Abstract: A semiconductor device includes a semiconductor switching element, a first lead with the semiconductor element mounted thereon, a second lead, and a sealing resin. The second lead is spaced from the first lead in a first direction perpendicular to a thickness direction of the semiconductor element. The sealing resin covers a portion of the first lead, a portion of the second lead, and the semiconductor element. A resin reverse surface of the sealing resin includes a first and a second end portions spaced from each other in the first direction. The resin reverse surface also includes a third and a fourth end portions spaced from each other in a second direction perpendicular to the thickness direction and the first direction. Among the four end portions, the first lead is exposed only from the first end portion, and the second lead is exposed only from the second end portion.

Abstract: A semiconductor device includes a semiconductor layer, a transistor cell portion, formed in the semiconductor layer, a first trench, formed in the semiconductor layer, a diode, electrically separated from the transistor cell portion and having a first conductivity type portion and a second conductivity type portion disposed inside the first trench, a second trench, formed in the semiconductor layer, and a bidirectional Zener diode, electrically connected to the transistor cell portion and having a pair of first conductivity type portions, disposed inside the second trench, and at least one second conductivity type portion, formed between the pair of first conductivity type portion.

Abstract: A semiconductor device includes a semiconductor layer, a transistor cell portion, formed in the semiconductor layer, a first trench, formed in the semiconductor layer, a diode, electrically separated from the transistor cell portion and having a first conductivity type portion and a second conductivity type portion disposed inside the first trench, a second trench, formed in the semiconductor layer, and a bidirectional Zener diode, electrically connected to the transistor cell portion and having a pair of first conductivity type portions, disposed inside the second trench, and at least one second conductivity type portion, formed between the pair of first conductivity type portion.

Abstract: The alignment accuracy between light emitting elements, light receiving elements, and an insulating film is improved. A photocoupling device manufacturing method includes preparing a first lead frame having a first frame part supporting light receiving elements and a second lead frame having a second frame part supporting light emitting elements. The method also includes superposing the first and the second lead frame such that the light receiving elements and the light emitting elements mutually oppose via a first light-transmissive resin covering the light receiving elements, a second light-transmissive resin covering the light emitting elements, and an insulating film sheet positioned between the first and the second light-transmissive resin. The insulating film sheet includes body parts positioned between the light receiving elements and the light emitting elements, joining parts joined to the body parts, and a third frame part fixed between the first and the second frame part.

Abstract: A photocoupler comprises an input side lead frame; an output side lead frame disposed facing the input side lead frame with a gap therebetween; a light emitting device mounted on a face of the input side lead frame facing the output side lead frame side; a light receiving device mounted on a face of the output side lead frame facing the input side lead frame side, opposite to and having a gap with the light emitting device; and a protrusion disposed on at least a part of an area around the light receiving device on the output side lead frame and being formed of conductive bonding wire or a bump, protruding to the input side lead frame side.

Abstract: The alignment accuracy between light emitting elements, light receiving elements, and an insulating film is improved. A photocoupling device manufacturing method includes preparing a first lead frame having a first frame part supporting light receiving elements and a second lead frame having a second frame part supporting light emitting elements. The method also includes superposing the first and the second lead frame such that the light receiving elements and the light emitting elements mutually oppose via a first light-transmissive resin covering the light receiving elements, a second light-transmissive resin covering the light emitting elements, and an insulating film sheet positioned between the first and the second light-transmissive resin. The insulating film sheet includes body parts positioned between the light receiving elements and the light emitting elements, joining parts joined to the body parts, and a third frame part fixed between the first and the second frame part.

Abstract: A photocoupler comprises an input side lead frame; an output side lead frame disposed facing the input side lead frame with a gap therebetween; a light emitting device mounted on a face of the input side lead frame facing the output side lead frame side; a light receiving device mounted on a face of the output side lead frame facing the input side lead frame side, opposite to and having a gap with the light emitting device; and a protrusion disposed on at least a part of an area around the light receiving device on the output side lead frame and being formed of conductive bonding wire or a bump, protruding to the input side lead frame side.

Abstract: A photocoupler comprises an input side lead frame; an output side lead frame disposed facing the input side lead frame with a gap therebetween; a light emitting device mounted on a face of the input side lead frame facing the output side lead frame side; a light receiving device mounted on a face of the output side lead frame facing the input side lead frame side, opposite to and having a gap with the light emitting device; and a protrusion disposed on at least a part of an area around the light receiving device on the output side lead frame and being formed of conductive bonding wire or a bump, protruding to the input side lead frame side.