Patents by Inventor Ryutaro Shimoishi

Ryutaro Shimoishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder composition and electronic substrate
    Patent number: 11780035
    Abstract: A solder composition of the invention contains: a flux composition containing (A) a rosin resin, (B) an activator, (C) an imidazoline compound having a phenyl group, and (D) an antioxidant; and (E) solder powder, in which the (B) component contains (B1) an organic acid, the (B1) component contains at least one selected from the group consisting of (B11) 1-hydroxy-2-naphthoic acid, 3-hydroxy-2-naphthoic acid, and 1,4-dihydroxy-2-naphthoic acid, and the (C) component is at least one selected from the group consisting of 2-phenylimidazoline and 2-benzylimidazoline.
    Type: Grant
    Filed: September 21, 2021
    Date of Patent: October 10, 2023
    Assignee: Tamura Corporation
    Inventors: Ryutaro Shimoishi, Isao Sugiyama, Daigo Ichikawa
  • SOLDER COMPOSITION AND ELECTRONIC SUBSTRATE
    Publication number: 20220097181
    Abstract: A solder composition of the invention contains: a flux composition containing (A) a rosin resin, (B) an activator, (C) an imidazoline compound having a phenyl group, and (D) an antioxidant; and (E) solder powder, in which the (B) component contains (B1) an organic acid, the (B1) component contains at least one selected from the group consisting of (B11) 1-hydroxy-2-naphthoic acid, 3-hydroxy-2-naphthoic acid, and 1,4-dihydroxy-2-naphthoic acid, and the (C) component is at least one selected from the group consisting of 2-phenylimidazoline and 2-benzylimidazoline.
    Type: Application
    Filed: September 21, 2021
    Publication date: March 31, 2022
    Inventors: Ryutaro Shimoishi, Isao Sugiyama, Daigo Ichikawa