Abstract: A resin particle includes a fluorescent colorant and a color pigment. A hue angle of the resin particle and a hue angle of the fluorescent colorant are different from each other. When a fluorescence peak wavelength in a spectral reflectance of the fluorescent colorant is represented by A (nm), an integrated value of a spectral reflectance (%) of the color pigment in a wavelength range of from A?30 (nm) to A+30 (nm) is 2,500 or more.

Abstract: A grain oriented electrical steel sheet includes a base steel sheet, a glass film, and a tension-insulation coating. When a glow discharge emission spectroscopy is conducted from a surface of the glass film toward a depth direction, an analysis starting time Ts, a time TAlp at which Al shows a maximum emission intensity, an Al emission intensity F(TAlp) at the TAlp, a time TSip at which Si shows a maximum emission intensity, and an Al emission intensity F(TSip) at the TSip satisfy 0.05?F(TSip)/F(TAlp)?0.50 and 2.0?(TAlp?Ts)/(TSip?Ts)?5.0.

Abstract: An etching method includes providing a substrate on a substrate support in a chamber of a plasma processing apparatus. The etching method further includes etching the substrate with plasma generated in the chamber, thereby forming a recess in the substrate. In the etching, an electrical bias is supplied to the substrate support, to attract ions from the plasma into the substrate. In the etching, at least one of a bias frequency, which is a reciprocal of a time length of a waveform cycle of the electrical bias, and a pulse duty ratio of a pulsed electrical bias is modified to maintain an ion energy flux to the substrate.

Abstract: An isocyanate-modified polyimide resin is a reaction product of a diisocyanate compound (a) having an isocyanate group and a polyimide resin having an amino group and/or an acid anhydride group. The polyimide resin is a reaction product of an aliphatic diamino compound (b), a tetrabasic acid dianhydride (c) and an aromatic diamino compound (c). The isocyanate-modified polyimide has an amino group and/or an acid anhydride group on both ends. This isocyanate-modified polyimide resin is a resin material having a novel structure, and is suitable for use in a printed wiring board. A cured product which is obtained using this resin material has a low dielectric loss tangent, while being excellent in terms of adhesiveness, heat resistance and mechanical property.

Abstract: The purpose of the present invention is to provide: a resin material that has a novel structure and can be suitably used in a printed wiring board: and a resin composition that contains this resin material and has a cured product thereof having a low dielectric loss tangent and excellent adhesion, heat resistance, and mechanical characteristics. The present invention provides: a polyamic acid resin that is a reaction product of an amino phenol compound (a), an aliphatic diamino compound (b), a tetrabasic acid dianhydride (c), and an aromatic diamino compound (d), said polyamic acid resin having an amino group at both ends thereof: a polyimide resin being an imidization compound of the polyamic acid resin: a resin composition containing the polyimide resin: and a cured product thereof.

Abstract: The present invention relates to a primer resin for semiconductor devices which comprises a polyamide resin represented by the following formula (1): (wherein, R1 represents a tetravalent aromatic tetracarboxylic acid residue selected from the group consisting of pyromellitic acid, 3,4,3?,4?-diphenyl ether tetracarboxylic acid, 2,3,6,7-naphthalenetetracarboxylic acid and 3,4,3?,4?-benzophenone tetracarboxylic acid, R2 represents at least one kind of divalent diamine residue selected from the group consisting of diamino-4,4?-hydroxydiphenylsulfone, 4,4?-diamino-3,3?5,5?-tetraethyldiphenylmethane and 1,3-bis-(aminophenoxy)benzene, and n is a repeating number and represents a positive number of 10 to 1000) and has a lead frame comprising copper or 42 alloy, a semiconductor device having said primer resin layer between a lead frame comprising copper or 42 alloy and a cured product of a sealing resin, and a semiconductor sealing epoxy resin composition containing said primer resin; and said semiconductor devic

Abstract: Disclosed is a heat-resistant adhesive including: a phenolic hydroxy group-containing aromatic polyamide resin (A) having a structure represented by the following formula (1) (in the formula, m and n each represent an average and satisfy the relation: 0.005?n/(m+n)<1, and m+n is an integer which is more than 0 but equal to or less than 200, Ar1 represents a divalent aromatic group, Ar2 represents a divalent aromatic group having a phenolic hydroxy group, and Ar3 represents a divalent aromatic group), an epoxy resin (B), a curing catalyst (C), an inorganic filler (D), and an epoxy resin curing agent other than the component (A) as an optional component, in which the amount of the component (D) contained therein relative to 100 parts by mass of the total amount of the components (A) to (C) and the epoxy resin curing agent as the optional component is 30 to 950 parts by mass.

Abstract: Disclosed is related to a thermosetting resin composition which comprises a polyimide resin (A) having a phenolic hydroxyl group, preferably a polyimide resin (A) produced from an aminophenol (a), a diamino compound (b) and a tetrabasic acid dianhydride (c), and an epoxy resin (B); and a cured product thereof. The resin composition is excellent in storage stability, and gives a cured product excellent in flame retardancy and heat resistance. Furthermore, when the cured product is in a film form, the product has sufficient flexibility and excellent folding endurance.

Abstract: To provide an epoxy resin giving a cured object having high heat resistance, which is improved in impact resistance and moisture resistance as compared with conventional high-heat-resistance epoxy resins. The epoxy resin is obtained by glycidylating one or more phenol compounds comprising 95% or more 1,1,2,2-tetrakis (hydroxyphenyl)ethane, and is characterized in that in an examination by gel permeation chromatography, the epoxy resin has a tetranucleus-form content of 50 to 90% by area and an octanucleus-form content of at least 5% by area and has a total chlorine content of 5,000 ppm or smaller.

Abstract: The present invention relates to a copper foil having a primer resin layer which improves the adhesive strength between a copper foil surface without roughening treatment and a substrate resin and a laminated sheet using the same and is characterized by using a polyimide represented by the following formula (1): (wherein, R1 represents a quadrivalent aromatic group which is a residual group of a dicarboxylic acid dianhydride ingredient (pyromellitic acid anhydride, 3,3?,4,4?-biphenyltetracarboxylic acid dianhydride, 3,3?,4,4?-benzophenontetracarboxylic acid dianhydride or 2,3,6,7-naphthalenetetracarboxylic acid dianhydride), R2 represents a divalent aromatic group which is a residual group of a diamine ingredient (1,3-bis-(3-aminophenoxy)benzene, 3,3?-diamino-4,4?-dihydroxydiphenylsulfone or/and 4,4?-diamino-3,3?,5,5?-tetraethyldiphenylmethane), and n1 represents a repeating number) as a primer resin; and copper foils and laminated sheets having said polyimide layer as a primer have high adhesive strength

Abstract: [PROBLEMS] To provide a photosensitive resin composition which has excellent photosensitivity and gives a cured product reduced in warpage and excellent in flexing properties, adhesion, pencil hardness, solvent resistance, acid resistance, heat resistance, resistance to gold plating, etc. [MEANS FOR SOLVING PROBLEMS] A urethane resin (A) soluble in aqueous alkali solutions and curable with active energy rays which is obtained by reacting a diisocyanate compound (a) with a tetrabasic acid dianhydride (b) to obtain a compound (E), reacting the compound (E) with a hydroxylated compound (c) having an unsaturated group and optionally with a hydroxylated compound (d) other than the compound (c) to obtain a compound (F), and further reacting hydroxy groups of the compound (F) with a diisocyanate compound (e).

Abstract: The present invention relates to a primer resin for semiconductor devices which comprises a polyamide resin represented by the following formula (1): (wherein, R1 represents a tetravalent aromatic tetracarboxylic acid residue selected from the group consisting of pyromellitic acid, 3,4,3?,4?-diphenyl ether tetracarboxylic acid, 2,3,6,7-naphthalenetetracarboxylic acid and 3,4,3?,4?-benzophenone tetracarboxylic acid, R2 represents at least one kind of divalent diamine residue selected from the group consisting of diamino-4,4?-hydroxydiphenylsulfone, 4,4?-diamino-3,3?5,5?-tetraethyldiphenylmethane and 1,3-bis-(aminophenoxy)benzene, and n is a repeating number and represents a positive number of 10 to 1000) and has a lead frame comprising copper or 42 alloy, a semiconductor device having said primer resin layer between a lead frame comprising copper or 42 alloy and a cured product of a sealing resin, and a semiconductor sealing epoxy resin composition containing said primer resin; and said semiconductor devic

Abstract: An object of the present invention is to provide a copper foil with a resin layer to be used as a resin substrate for a flexible printed wiring board and having good adhesiveness between the copper foil, to which no roughening treatment is applied, and a raw material resin layer. A copper foil with a resin layer characterized in that a copper foil having no roughening treatment applied thereto is directly joined to a resin layer, which contains a phenolic hydroxyl group-containing aromatic polyamide resin having a structure represented by the following formula (1): in the formula (1), m and n denote average values and satisfy the relationship: 0.005?n/(m+n)<0.05, m+n is 2 to 200; Ar1 is a divalent aromatic group; Ar2 is a divalent aromatic group having a phenolic hydroxyl group, and Ar3 is a divalent aromatic group.

Abstract: The invention provides a phenolic hydroxyl group-containing rubber-modified polyamide resin capable of providing a cured product with excellent heat resistance, adhesion properties, electrically insulating property and flame retardance and having a sufficient flexibility when being shaped into a film, which is characterized by having in its molecule (a) a phenolic hydroxyl group-containing aromatic polyamide segment represented by the following formula (1): (in the formula (1), m and n are average values and satisfy a relationship of 0.005?n/(m+n)?1.00 and m+n is an integer of 2-200, and Ar1 is a bivalent aromatic group, Ar2 is a bivalent aromatic group having a phenolic hydroxyl group and Ar3 is a bivalent aromatic group) and (b) a hydrogenated butadiene polymer segment.

Abstract: The present invention relates to a positive type photosensitive polyimide resin composition comprising a phenolic hydroxy group-containing soluble polyimide resin (A) formed from a tetrabasic acid dianhydride (a), an aminophenol compound having at least two amino groups and at least one phenolic hydroxy group in one molecule (b), and a diamino compound (c); a diazo-based positive type photosensitizer (B); and an epoxy resin (C). Using the positive type photosensitive polyimide resin composition of the present invention, a resin composition which allows easy patterning, satisfies various properties such as flame retardancy, heat resistance, mechanical properties and flexibility, and is capable of coping with high functionalization of various electronic devices, and a cured product thereof can be provided.

Abstract: Disclosed is related to a thermosetting resin composition which comprises a polyimide resin (A) having a phenolic hydroxyl group, preferably a polyimide resin (A) produced from an aminophenol (a), a diamino compound (b) and a tetrabasic acid dianhydride (c), and an epoxy resin (B); and a cured product thereof. The resin composition is excellent in storage stability, and gives a cured product excellent in flame retardancy and heat resistance. Furthermore, when the cured product is in a film form, the product has sufficient flexibility and excellent folding endurance.

Abstract: The present invention relates to a photosensitive, aqueous alkaline solution-soluble polyimide resin (A) obtained by reacting a polyimide resin (a) which can be obtained by a tetracarboxylic acid dianhydride with a diamine compound with an energy ray-curing type aqueous alkaline solution-soluble resin (b); the resin has excellent photosensitivity obtained by mixing with a photopolymerization initiator and the like; the obtained cured products can be photosensitive resin compositions excellent in flexibility, low warping property, adhesion properties, solvent resistance, acid resistance, heat resistance, gold plating resistance and the like.

Abstract: [Problems] To provide an epoxy resin giving a cured object having high heat resistance, which is improved in impact resistance and moisture resistance as compared with conventional high-heat-resistance epoxy resins. [Means for Solving Problems] The epoxy resin is obtained by glycidylating one or more phenol compounds comprising 95% or more 1,1,2,2-tetrakis(hydroxyphenyl)ethane, and is characterized in that in an examination by gel permeation chromatography, the epoxy resin has a tetranucleus-form content of 50 to 90% by area and an octanucleus-form content of at least 5% by area and has a total chlorine content of 5,000 ppm or smaller.

Abstract: A photosensitive resin composition which is excellent in photosensitivity and excellent in flame resistance, flexibility, adhesiveness, pencil hardness, resistance to solvent, acid resistance, heat resistance, resistance to gold plating and the like and a cured article thereof are provided. An alkaline aqueous solution-soluble photosensitive resin composition containing an alkaline aqueous solution-soluble resin (A) obtained by adding a polybasic acid anhydride (c) to a resin (C) which is a reaction product of an epoxy resin (a) represented by the formula (1) with an unsaturated monocarboxylic acid (b), an epoxy resin (a?) represented by the formula (1) as a curing agent (B) and a photopolymerization initiator. [In the formula, n represents a positive number of 1 to 10 as an average value.

Abstract: [PROBLEMS] The present invention relates to a crystalline epoxy resin, which gives a cured object excellent in various properties including flame retardancy, low water absorption, and impact resistance. The object of the present invention is to provide epoxy resin which is useful as an optical material, an epoxy resin composition containing crystals of the epoxy resin having excellent storage stability and a cured object obtained from the composition. [MEANS FOR SOLVING PROBLEMS] The crystalline epoxy resin obtained by the glycidylation of the compound represented by the following formula (1).