Abstract: A capacitor mounting structure is proposed which can easily relieve a stress given to an extraction lead when ambient temperature is changed, soldering is made, or vibration is given, and can prevent breakage of the extraction lead. An outside holder is provided at an outside of a resin case housing a capacitor covered with a filler, and an inside holder is provided. The outside holder includes an upper outer wall bonded to an upper resin wall of the resin case. Lower openings of the resin case and the outside holder overlap with each other and form a lower space. An extraction lead is disposed in the lower space.

Abstract: A semiconductor device, in which the air within a gel resin can be efficiently and well purged, comprising a casing, a semiconductor device electrically connected by bonding wires and a gel resin filled in the casing and serves for insulation covering of the semiconductor device and the bonding wire. The device further comprises a board-shaped vibration damper in contact with the gel resin and is provided with a plurality of perforations each having an air inlet and an air outlet for the purpose of air extraction during the filling of the gel resin. The sectional area of the perforations is tapered and larger at the inlet than at the outlet, thus causing the perforations to have the form of a substantially conical trapezoid as a whole.

Abstract: A semiconductor device of the invention comprises a semiconductor element provided within a housing, a bonding wire, a sealing resin member covering the semiconductor element and bonding wire, and a sheet member. The sheet member is fixed in the housing and arranged out of contact with the bonding wire, and moreover buried in the sealing resin member. Because the sheet member restrains the sealing resin member from vibrating, the bonding wire is connected with improved reliability. In place of the sheet member, it is possible to use a pillar member fixed on an insulating substrate. The semiconductor device is suitable for use on a mobile body, such as a vehicle, which proceeds with vibrations.

Abstract: A semiconductor device, in which the air within a gel resin can be efficiently and well purged, comprising a casing, a semiconductor device electrically connected by bonding wires and a gel resin filled in the casing and serves for insulation covering of the semiconductor device and the bonding wire. The device further comprises a board-shaped vibration damper in contact with the gel resin and is provided with a plurality of perforations each having an air inlet and an air outlet for the purpose of air extraction during the filling of the gel resin. The sectional area of the perforations is tapered and larger at the inlet than at the outlet, thus causing the perforations to have the form of a substantially conical trapezoid as a whole.

Abstract: A semiconductor device of the invention comprises a semiconductor element provided within a housing, a bonding wire, a sealing resin member covering the semiconductor element and bonding wire, and a sheet member. The sheet member is fixed in the housing and arranged out of contact with the bonding wire, and moreover buried in the sealing resin member. Because the sheet member restrains the sealing resin member from vibrating, the bonding wire is connected with improved reliability. In place of the sheet member, it is possible to use a pillar member fixed on an insulating substrate. The semiconductor device is suitable for use on a mobile body, such as a vehicle, which proceeds with vibrations.