Abstract: An optical waveguide package includes a substrate, and an optical waveguide layer on an upper surface of the substrate. The optical waveguide layer includes a cladding and a core in the cladding. The cladding has at least one first recess having a bottom surface and a first inner wall surface surrounding the bottom surface. The first inner wall surface of the at least one first recess is inclined and has an upper side outward from a lower side.

Abstract: The present invention relates to a sensor wiring substrate in which a decrease in detection accuracy is suppressed, a sensor package, and a sensor device. A gas sensor wiring substrate includes a substrate having a first accommodation recessed portion for accommodating a microphone element and a second accommodation recessed portion for accommodating an infrared light emitting element, and connection wiring. In the gas sensor wiring substrate, thermal resistance of a heat transfer path between a bottom surface of the first accommodation recessed portion and a bottom surface of the second accommodation recessed portion is greater than thermal resistance in any position of an imaginal heat transfer path in case of a depth of the first accommodation recessed portion identical with a depth of the second accommodation recessed portion. For example, the depth of the second accommodation recessed portion is deeper than the depth of the first accommodation recessed portion.

Abstract: The present invention relates to a sensor wiring substrate in which a decrease in detection accuracy is suppressed, a sensor package, and a sensor device. A gas sensor wiring substrate includes a substrate having a first accommodation recessed portion for accommodating a microphone element and a second accommodation recessed portion for accommodating an infrared light emitting element, and connection wiring. In the gas sensor wiring substrate, thermal resistance of a heat transfer path between a bottom surface of the first accommodation recessed portion and a bottom surface of the second accommodation recessed portion is greater than thermal resistance in any position of an imaginal heat transfer path in case of a depth of the first accommodation recessed portion identical with a depth of the second accommodation recessed portion. For example, the depth of the second accommodation recessed portion is deeper than the depth of the first accommodation recessed portion.

Abstract: A lid body includes a plate body containing silicon; a protective film disposed on a main surface of the plate body, the protective film protecting the plate body from a joining brazing material; a frame-like hole passing through the protective film, the frame-like hole being provided at an outer periphery of the protective film; and a sealing metallic layer made of metal, disposed so as to fill in the hole.

Abstract: A lid body includes a plate body containing silicon; a protective film disposed on a main surface of the plate body, the protective film protecting the plate body from a joining brazing material; a frame-like hole passing through the protective film, the frame-like hole being provided at an outer periphery of the protective film; and a sealing metallic layer made of metal, disposed so as to fill in the hole.

Abstract: A reacting apparatus includes a reactor having a supply port and a discharge port, a first member connected to the surface of the reactor having a through hole associated with the supply port, and a second member connected to the surface of the reactor and having a through hole associated with the discharge port, a supply pipe connected to the supply port by way of the through hole of the first member, to supply a fluid before the reaction to the supply port, and a discharge pipe connected to the discharge port by way of the through hole of the second member, to discharge a fluid after the reaction from the discharge port. The supply port and discharge port include a portion covered by a surface of the first member and a portion communicating with the through hole of the first member. The discharge port includes a portion covered by a surface of the second member and a portion communicating with the through hole of the second member.

Abstract: A reacting apparatus includes a reactor having a supply port and a discharge port, a first member connected to the surface of the reactor having a through hole associated with the supply port, and a second member connected to the surface of the reactor and having a through hole associated with the discharge port, a supply pipe connected to the supply port by way of the through hole of the first member, to supply a fluid before the reaction to the supply port, and a discharge pipe connected to the discharge port by way of the through hole of the second member, to discharge a fluid after the reaction from the discharge port. The supply port and discharge port include a portion covered by a surface of the first member and a portion communicating with the through hole of the first member. The discharge port includes a portion covered by a surface of the second member and a portion communicating with the through hole of the second member.