Patents by Inventor Ryuusuke Suzuki

Ryuusuke Suzuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic part manufacturing method
    Patent number: 7604833
    Abstract: Provided is a method of manufacturing an electronic part in which a circuit element (3) is formed on a surface of a ceramic substrate (1) and conductive balls (2) are used as terminals of the electronic part. After the ceramic substrate (1) and the conductive balls (2) are fixed, the ceramic substrate (1) is appropriately divided. For this, the manufacturing method includes: a first step of forming the circuit element(s) (3) on the surface of a large ceramic substrate (1) including division grooves (4) longitudinally and laterally provided on the surface thereof; a second step of fixing the conductive balls (2) to terminal portion of the circuit element(s) (3); and a third step of applying stress to the large ceramic substrate (1) to open the division grooves (4), to divide the substrate (1), and the first, second, and third steps are performed in the stated order.
    Type: Grant
    Filed: August 25, 2004
    Date of Patent: October 20, 2009
    Assignee: KOA Corporation
    Inventor: Ryuusuke Suzuki
  • Electronic Component
    Publication number: 20080303149
    Abstract: An electronic component including, on one surface of a substrate (1), a plurality of circuit elements and external terminals each consisting of a conductive protrusion (9) for the circuit elements is provided with a structure capable of resisting an external force after mounting.
    Type: Application
    Filed: January 21, 2005
    Publication date: December 11, 2008
    Applicant: MINOWA KOA INC.
    Inventors: Toshiharu Takayama, Ryuusuke Suzuki, Takefumi Nakamori
  • Electronic part manufacturing method
    Publication number: 20070015309
    Abstract: Provided is a method of manufacturing an electronic part in which a circuit element (3) is formed on a surface of a ceramic substrate (1) and conductive balls (2) are used as terminals of the electronic part. After the ceramic substrate (1) and the conductive balls (2) are fixed, the ceramic substrate (1) is appropriately divided. For this, the manufacturing method includes: a first step of forming the circuit element(s) (3) on the surface of a large ceramic substrate (1) including division grooves (4) longitudinally and laterally provided on the surface thereof; a second step of fixing the conductive balls (2) to terminal portion of the circuit element(s) (3); and a third step of applying stress to the large ceramic substrate (1) to open the division grooves (4), to divide the substrate (1), and the first, second, and third steps are performed in the stated order.
    Type: Application
    Filed: August 25, 2004
    Publication date: January 18, 2007
    Inventor: Ryuusuke Suzuki