Abstract: A wire harness routing structure includes a wire harness and a door support component that supports a door-side section of the wire harness on a sliding door. The door support component includes a slider part provided in the door-side section and a guide component in which a guide groove for guiding the slider part is formed. The guide groove includes an opening/closing groove and a stress absorption groove. The slider part moves along the opening/closing groove when the sliding door is opened and closed. The slider part moves along the stress absorption groove when the sliding door is open and a tread load is applied to an exposed section of the wire harness.

Abstract: A method for manufacturing an electronic component includes a substrate preparation process including preparing an insulative substrate, an insulation layer formation process including forming an insulation layer on the substrate, a penetration process including forming a through-hole penetrating through the insulation layer, and a wiring process forming a through-wiring in the through-hole. The through-wiring constitutes at least a part of a coil unit wound in a solenoid form. The method may further include, before the insulation layer formation process, a first metal layer formation process including forming a first metal layer on the substrate. The through-wiring is continuous with the first metal layer, and the coil unit includes the first metal layer.

Abstract: An electronic component includes a functional portion, a first insulating layer, an external electrode, and a wiring portion. The first insulating layer includes a first obverse surface facing a first side in a thickness direction, and a first side surface facing a first side in a first direction intersecting the thickness direction. The external electrode is electrically connected to the functional portion. The wiring portion electrically connects the functional portion and the external electrode. The external electrode includes an obverse-surface covering portion covering the first obverse surface, and a side-surface covering portion covering the first side surface. The functional portion may include an inductor portion and a capacitor portion.