Patents by Inventor Ryuzo Fukao
Ryuzo Fukao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6926794Abstract: The present invention provides an information carrier which has flat surfaces, is excellent in beautiful appearance and permits beautiful necessary printing, and a production process which permits easy and inexpensive production of such an information carrier. An IC chip 1 and a coil 2 connected to the IC chip are embedded in a substrate 3 composed of a nonwoven fabric. The IC chip and the coil are held between two nonwoven fabrics produced according to a conventional production procedure. The laminate of the nonwoven fabrics is fed to a roller or a press and the two nonwoven fabrics are hot-pressed, whereby their mating surfaces are joined with or without an adhesive (including low-melting synthetic resin fiber) incorporated into the webs. After positioning of the coil in the thus obtained raw product of information carrier, the laminate of the nonwoven fabrics and cover sheets is cut to obtain an information carrier of predetermined shape and size.Type: GrantFiled: October 15, 2002Date of Patent: August 9, 2005Assignee: Hitachi Maxell, Ltd.Inventors: Kyouichi Kohama, Ryuzo Fukao, Wasao Takasugi, Kazuhiko Daido, Toshinobu Sueyoshi
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Patent number: 6762075Abstract: For producing a semiconductor module, an electrically insulating layer and an electrically conductive layer are formed on a Nickel-base metal film over a metallic surface, the electrically conductive layer is connected electrically to an electric element through an electrically conductive joint arranged between the electric element and the electrically conductive layer, at least a part of the electric element and at least a part of the electrically conductive joint are covered with a molding resin, and subsequently, the Nickel-base metal film is removed from the metallic surface so that a combination of the Nickel-base metal film, the electrically insulating layer, the electrically conductive layer, the electrically conductive joint and the molding resin is separated from the metallic surface.Type: GrantFiled: April 7, 2003Date of Patent: July 13, 2004Assignee: Hitachi Maxell, Ltd.Inventors: Kiyoharu Kishimoto, Ryuzo Fukao, Koji Yamaguchi, Hiroyuki Tsukamoto, Yuji Yamashita, Yuji Kikuchi, Tomonori Kanai
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Publication number: 20040119911Abstract: A thermal-responsive liquid crystal display having a polymer dispersed liquid crystal layer formed to have excellent response speed, good display characteristics, uniform thickness distribution, high thickness, high contrast and excellent resistance to thermal cycle. A polymer dispersed liquid crystal layer formed of a composition of a polymer and a liquid crystal is provided on a heating unit. The polymer is a thermoplastic resin, and the glass transition temperature (Tg) of the resin and the phase transition temperature (TNI) of the liquid crystal satisfy the condition of −20≦(Tg−TNI)≦20 (° C.). The polymer dispersed liquid crystal layer is formed by laminating a plurality of polymer dispersed liquid crystal films.Type: ApplicationFiled: July 25, 2003Publication date: June 24, 2004Applicant: Hitachi Maxell, Ltd.Inventors: Kouji Ooae, Ryuzo Fukao, Yuji Yamashita
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Patent number: 6603210Abstract: For producing a semiconductor module, an electrically insulating layer and an electrically conductive layer are formed on a Nickel-base metal film over a metallic surface, the electrically conductive layer is connected electrically to an electric element through an electrically conductive joint arranged between the electric element and the electrically conductive layer, at least a part of the electric element and at least a part of the electrically conductive joint are covered with a molding resin, and subsequently, the Nickel-base metal film is removed from the metallic surface so that a combination of the Nickel-base metal film, the electrically insulating layer, the electrically conductive layer, the electrically conductive joint and the molding resin is separated from the metallic surface.Type: GrantFiled: July 12, 2001Date of Patent: August 5, 2003Assignee: Hitachi Maxell, Ltd.Inventors: Kiyoharu Kishimoto, Ryuzo Fukao, Koji Yamaguchi, Hiroyuki Tsukamoto, Yuji Yamashita, Yuji Kikuchi, Tomonori Kanai
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Publication number: 20030140489Abstract: For producing a semiconductor module, an electrically insulating layer and an electrically conductive layer are formed on a Nickel-base metal film over a metallic surface, the electrically conductive layer is connected electrically to an electric element through an electrically conductive joint arranged between the electric element and the electrically conductive layer, at least a part of the electric element and at least a part of the electrically conductive joint are covered with a molding resin, and subsequently, the Nickel-base metal film is removed from the metallic surface so that a combination of the Nickel-base metal film, the electrically insulating layer, the electrically conductive layer, the electrically conductive joint and the molding resin is separated from the metallic surface.Type: ApplicationFiled: April 7, 2003Publication date: July 31, 2003Applicant: Hitachi Maxell, Ltd.Inventors: Kiyoharu Kishimoto, Ryuzo Fukao, Koji Yamaguchi, Hiroyuki Tsukamoto, Yuji Yamashita, Yuji Kikuchi, Tomonori Kanai
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Patent number: 6532046Abstract: The object of the present invention is to provide a novel liquid crystal display material having an excellent contrast ratio, a display method and a display device using the material. The present invention uses a liquid crystal display material comprising a polymer in which a liquid crystal is dispersed in a dissolvable state or a phase separable state, wherein the liquid crystal dissolves in the polymer at high temperatures and separates from the polymer at low temperatures, and a contrast ratio (B/A) of a reflectance (A) of the display material cooled from the dissolution state at a rate of 10° C./sec and a reflectance (B) of the display material cooled from the dissolution state at a rate of 4° C./sec is not less than 2. The image forming state can be maintained by controlling the cooling rate from the dissolution state to maintain the liquid crystal in translucent state.Type: GrantFiled: October 25, 2000Date of Patent: March 11, 2003Assignee: Hitachi Maxell, Ltd.Inventors: Yuji Yamashita, Keiko Kurata, Kouji Ooae, Ryuzo Fukao
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Publication number: 20030037875Abstract: The present invention provides an information carrier which has flat surfaces, is excellent in beautiful appearance and permits beautiful necessary printing, and a production process which permits easy and inexpensive production of such an information carrier. An IC chip 1 and a coil 2 connected to the IC chip are embedded in a substrate 3 composed of a nonwoven fabric. The IC chip and the coil are held between two nonwoven fabrics produced according to a conventional production procedure. The laminate of the nonwoven fabrics is fed to a roller or a press and the two nonwoven fabrics are hot-pressed, whereby their mating surfaces are joined with or without an adhesive (including low-melting synthetic resin fiber) incorporated into the webs. After positioning of the coil in the thus obtained raw product of information carrier, the laminate of the nonwoven fabrics and cover sheets is cut to obtain an information carrier of predetermined shape and size.Type: ApplicationFiled: October 15, 2002Publication date: February 27, 2003Applicant: Hitachi Maxell, Ltd.Inventors: Kyouichi Kohama, Ryuzo Fukao, Wasao Takasugi, Kazuhiko Daido, Toshinobu Sueyoshi
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Publication number: 20030011078Abstract: A semiconductor module comprises,Type: ApplicationFiled: September 17, 2002Publication date: January 16, 2003Applicant: Hitachi Maxell, Ltd.Inventors: Ryuzo Fukao, Koji Yamaguchi, Susumu Imai, Yuichi Sukegawa
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Patent number: 6482495Abstract: The present invention provides an information carrier which has flat surfaces, is excellent in beautiful appearance and permits beautiful necessary printing, and a production process which permits easy and inexpensive production of such an information carrier. An IC chip 1 and a coil 2 connected to the IC chip are embedded in a substrate 3 composed of a nonwoven fabric. The IC chip and the coil are held between two nonwoven fabrics produced according to a conventional production procedure. The laminate of the nonwoven fabrics is fed to a roller or a press and the two nonwoven fabrics are hot-pressed, whereby their mating surfaces are joined with or without an adhesive (including low-melting synthetic resin fiber) incorporated into the webs. After positioning of the coil in the thus obtained raw product of information carrier, the laminate of the nonwoven fabrics and cover sheets is cut to obtain an information carrier of predetermined shape and size.Type: GrantFiled: March 12, 1997Date of Patent: November 19, 2002Assignee: Hitachi Maxwell, Ltd.Inventors: Kyouichi Kohama, Ryuzo Fukao, Wasao Takasugi, Kazuhiko Daido, Toshinobu Sueyoshi
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Patent number: 6412701Abstract: There is a flexible IC module utilizable for the production of contactless IC cards and a method for producing an information carrier using the flexible IC module. An IC chip 1 and a coil 2 are embedded in a flexible substrate 3 comprising a nonwoven fabric or the like having compressibility in the thickness direction, self-pressure bonding property and resin impregnation property. This flexible IC module is produced in the following procedure. {circle around (1)} A first nonwoven fabric 12 having compressibility in the thickness direction, self-pressure bonding property and resin impregnation property is placed on a bottom force 11. {circle around (2)} An IC chip and a coil are placed on the first nonwoven fabric after positioning them. {circle around (3)} A second nonwoven fabric 13 is superposed on the IC chip and coil. {circle around (4)} A top force 14 is pressed onto the second nonwoven fabric, and the first and second nonwoven fabrics, the IC chip and the coil are integrated by hot pressing.Type: GrantFiled: January 5, 1999Date of Patent: July 2, 2002Assignee: Hitachi Maxell, Ltd.Inventors: Kyouichi Kohama, Yusuke Hirai, Kaname Tamada, Toshinobu Sueyoshi, Ryuzo Fukao, Kazuhiko Daido
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Publication number: 20020020925Abstract: For producing a semiconductor module, an electrically insulating layer and an electrically conductive layer are formed on a Nickel-base metal film over a metallic surface, the electrically conductive layer is connected electrically to an electric element through an electrically conductive joint arranged between the electric element and the electrically conductive layer, at least a part of the electric element and at least a part of the electrically conductive joint are covered with a molding resin, and subsequently, the Nickel-base metal film is removed from the metallic surface so that a combination of the Nickel-base metal film, the electrically insulating layer, the electrically conductive layer, the electrically conductive joint and the molding resin is separated from the metallic surface.Type: ApplicationFiled: July 12, 2001Publication date: February 21, 2002Inventors: Kiyoharu Kishimoto, Ryuzo Fukao, Koji Yamaguchi, Hiroyuki Tsukamoto, Yuji Yamashita, Yuji Kikuchi, Tomonori Kanai
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Patent number: 6211931Abstract: The object of the present invention is to provide a polymer-dispersed liquid crystal display element which won't cause cross-talk effects and is capable of simple matrix drive. In the polymer-dispersed liquid crystal display element of the present invention, a polymer having a dielectric constant greater than that of the liquid crystal is used, and the volumetric content of the liquid crystal is not greater than that of the polymer.Type: GrantFiled: January 27, 1999Date of Patent: April 3, 2001Assignee: Hitachi Maxell, Ltd.Inventors: Ryuzo Fukao, Yuji Yamashita, Kouji Ooae
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Patent number: 5611958Abstract: The invention provides a phosphor excited by infrared rays to emit infrared rays which has a nonacicular particle shape and a particle size of 4 .mu.m or smaller after being synthesized. The phosphor preferably comprises an oxoacid salt-containing compound including at least one element selected from the group consisting of Nd, Yb and Er. The invention further provides a material having a latent image pattern comprising said phosphor and an optical reading system which use the material having a latent image pattern.Type: GrantFiled: May 4, 1994Date of Patent: March 18, 1997Assignee: Hitachi Maxell, Ltd.Inventors: Yoji Takeuchi, Toshio Oshima, Ryuzo Fukao, Hisao Kanzaki
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Patent number: 5277964Abstract: A discharge recording medium comprising a substrate and a thin metal layer which is formed on the substrate layer and is made of aluminum containing at least one metal selected from the group consisting of manganese, copper and magnesium, which has good environmental resistance and printing characteristics.Type: GrantFiled: March 18, 1992Date of Patent: January 11, 1994Assignee: Hitachi Maxell, Ltd.Inventors: Ryuzo Fukao, Taiji Matsumoto
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Patent number: 5246766Abstract: A thermal recording medium including a base layer containing a resin having a functional group which chemically bonds with a metal having a low melting point, such as Sn-Pb alloy, and a thermal recording layer made of a thin film with low resistivity of a low melting point metal formed on said base layer such that when a part of the thermal recording layer is heated, the heated part melts and perforates to record information.Type: GrantFiled: August 10, 1990Date of Patent: September 21, 1993Assignee: Hitachi Maxell Ltd.Inventors: Ryuzo Fukao, Tsunemi Oiwa, Shuichi Wada, Akio Shimizu, Seiichi Asada, Hisanobu Mikamo, Akira Kato