Patents by Inventor Ryuzo Hochin

Ryuzo Hochin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4312692
    Abstract: A method of mounting electronic components on a printed circuit board by temporarily attaching the electronic component (4) to the circuit board (1) with adhesive (3) applied to the board (1), irradiating the adhesive (3) with ultraviolet rays with or without heating to cure the adhesive (3) and thereby rigidly attach the component (4) to the board (1), and thereafter joining the electrodes (5) of the component (4) to conductor portions (2) on the board (1). Excess adhesive portions (3a) adjoining the component (4) are cured first to subsequently cure the other portion of the adhesive (3) in chain relation to the curing of the excess.
    Type: Grant
    Filed: March 5, 1980
    Date of Patent: January 26, 1982
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Junji Ikeda, Ryuzo Hochin, Tamotsu Wakahata