Patents by Inventor Sébastien Gaillard

Sébastien Gaillard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • GUIDE VANES ASSEMBLY WITH POSITION-MAINTAINING DEVICE
    Publication number: 20240133306
    Abstract: A turbine engine nozzle extending about an axis and including a vane assembly mounted between an outer shroud and an inner shroud; and a position retaining device configured to be placed in an elastically prestressed state between the inner shroud and an inner platform of the vane assembly to apply a stress on the vane assembly towards the outer shroud. The contact between the inner shroud and the inner platform is obtained by one same surface of the position retaining device.
    Type: Application
    Filed: February 8, 2022
    Publication date: April 25, 2024
    Applicants: SAFRAN AIRCRAFT ENGINES, SAFRAN CERAMICS
    Inventors: Sébastien Serge Francis CONGRATEL, Aurélien GAILLARD, Matthieu Arnaud GIMAT, Clément JARROSSAY, David René Pierre LE CAIR
  • Integrated circuit with protection from copper extrusion
    Patent number: 8853760
    Abstract: An integrated circuit may include an element placed in an insulating region adjacent to a copper metallization level and including a barrier layer in contact with a metallization level. The element may be electrically connected to and spaced away from a copper line of the metallization level by way of an electrical link passing through the barrier layer and including an electrically conductive material different from copper in direct contact with the copper line.
    Type: Grant
    Filed: November 9, 2011
    Date of Patent: October 7, 2014
    Assignee: STMicroelectronics (Crolles 2) SAS
    Inventors: Sébastien Cremer, Sébastien Gaillard
  • INTEGRATED CIRCUIT WITH PROTECTION FROM COPPER EXTRUSION
    Publication number: 20120112259
    Abstract: An integrated circuit may include an element placed in an insulating region adjacent to a copper metallization level and including a barrier layer in contact with a metallization level. The element may be electrically connected to and spaced away from a copper line of the metallization level by way of an electrical link passing through the barrier layer and including an electrically conductive material different from copper in direct contact with the copper line.
    Type: Application
    Filed: November 9, 2011
    Publication date: May 10, 2012
    Applicant: STMicroelectronics (Crolles 2) SAS
    Inventors: Sébastien CREMER, Sébastien Gaillard