Patents by Inventor S. Jay Chey
S. Jay Chey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11000474Abstract: Electromechanical substance delivery devices are provided which implement low-power electromechanical release mechanisms for controlled delivery of substances such as drugs and medication. For example, an electromechanical device includes a substrate having a cavity formed in a surface of the substrate, a membrane disposed on the surface of the substrate covering an opening of the cavity, and a seal disposed between the membrane and the surface of the substrate. The seal surrounds the opening of the cavity, and the seal and membrane are configured to enclose the cavity and retain a substance within the cavity. An electrode structure is configured to locally heat a portion of the membrane in response to a control voltage applied to the electrode structure, and create a stress that causes a rupture in the locally heated portion of the membrane to release the substance from within the cavity.Type: GrantFiled: December 22, 2017Date of Patent: May 11, 2021Assignee: International Business Machines CorporationInventors: S. Jay Chey, Bing Dang, John U. Knickerbocker, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria, Lavanya Turlapati, Bucknell C. Webb, Steven L. Wright
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Publication number: 20180133152Abstract: Electromechanical substance delivery devices are provided which implement low-power electromechanical release mechanisms for controlled delivery of substances such as drugs and medication. For example, an electromechanical device includes a substrate having a cavity formed in a surface of the substrate, a membrane disposed on the surface of the substrate covering an opening of the cavity, and a seal disposed between the membrane and the surface of the substrate. The seal surrounds the opening of the cavity, and the seal and membrane are configured to enclose the cavity and retain a substance within the cavity. An electrode structure is configured to locally heat a portion of the membrane in response to a control voltage applied to the electrode structure, and create a stress that causes a rupture in the locally heated portion of the membrane to release the substance from within the cavity.Type: ApplicationFiled: December 22, 2017Publication date: May 17, 2018Inventors: S. Jay Chey, Bing Dang, John U. Knickerbocker, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria, Lavanya Turlapati, Bucknell C. Webb, Steven L. Wright
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Patent number: 9937124Abstract: Electromechanical substance delivery devices are provided which implement low-power electromechanical release mechanisms for controlled delivery of substances such as drugs and medication. For example, an electromechanical device includes a substrate having a cavity formed in a surface of the substrate, a membrane disposed on the surface of the substrate covering an opening of the cavity, and a seal disposed between the membrane and the surface of the substrate. The seal surrounds the opening of the cavity, and the seal and membrane are configured to enclose the cavity and retain a substance within the cavity. An electrode structure is configured to locally heat a portion of the membrane in response to a control voltage applied to the electrode structure, and create a stress that causes a rupture in the locally heated portion of the membrane to release the substance from within the cavity.Type: GrantFiled: September 11, 2014Date of Patent: April 10, 2018Assignee: International Business Machines CorporationInventors: S. Jay Chey, Bing Dang, John U. Knickerbocker, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria, Lavanya Turlapati, Bucknell C. Webb, Steven L. Wright
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Patent number: 9575040Abstract: A corrosion sensor includes a plurality of metal strips having different thicknesses. A first metal strip with the least thickness is first employed to provide sensitive corrosion detection. After an exposed portion of the first metal strip is consumed, a second metal strip having a second least thickness can be employed to provide continued sensitive corrosion detection employing a remaining un-corroded portion of the second metal strip. The plurality of metal strips can be sequentially employed as exposed portions of thinner metal strips become unusable through complete corrosion and un-corroded exposed portions of thicker metal strips become thin enough to provide sensitive corrosion detection.Type: GrantFiled: April 30, 2014Date of Patent: February 21, 2017Assignee: GLOBALFOUNDRIES INC.Inventors: S. Jay Chey, Hendrik F. Hamann, Levente I. Klein, Michael A. Schappert, Prabjit Singh
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Patent number: 9335346Abstract: An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.Type: GrantFiled: September 10, 2012Date of Patent: May 10, 2016Assignee: GLOBALFOUNDRIES INC.Inventors: S. Jay Chey, Dustin M. Fregeau, Donna S. Zupanski-Nielsen, Aparna Prabhakar, Pavan Samudrala, Mohammed S. Shaikh
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Publication number: 20160074323Abstract: Electromechanical substance delivery devices are provided which implement low-power electromechanical release mechanisms for controlled delivery of substances such as drugs and medication. For example, an electromechanical device includes a substrate having a cavity formed in a surface of the substrate, a membrane disposed on the surface of the substrate covering an opening of the cavity, and a seal disposed between the membrane and the surface of the substrate. The seal surrounds the opening of the cavity, and the seal and membrane are configured to enclose the cavity and retain a substance within the cavity. An electrode structure is configured to locally heat a portion of the membrane in response to a control voltage applied to the electrode structure, and create a stress that causes a rupture in the locally heated portion of the membrane to release the substance from within the cavity.Type: ApplicationFiled: September 11, 2014Publication date: March 17, 2016Inventors: S. Jay Chey, Bing Dang, John U. Knickerbocker, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria, Lavanya Turlapati, Bucknell C. Webb, Steven L. Wright
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Patent number: 9057741Abstract: Probes are directly patterned on a test substrate, thereby eliminating a need for an interposer. Probe contact structures are formed as a two-level structure having a greater lateral dimension for a lower level portion than for an upper level portion. First cavities are formed in a masking layer applied to a test substrate, filling the cavities with a conductive material, and planarizing the top surfaces of the conductive material portions to form lower level portions. Another masking layer is applied over the lower level portions and patterned to define second cavities having a smaller lateral dimension that the lower level portions. The second cavities are filled with at least one conductive material to form upper level portions of the probe contact structures. The upper level portion of each probe contact structure can be employed to penetrate a surface oxide of solder balls.Type: GrantFiled: July 20, 2012Date of Patent: June 16, 2015Assignee: International Business Machines CorporationInventors: David M. Audette, Kevin Bocash, S. Jay Chey, Steven A. Cordes, Dustin M. Fregeau
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Patent number: 8949040Abstract: Principles of the invention provide methods and apparatus for providing corrosion management in buildings. In one aspect, an exemplary method includes the step of receiving first data relating corrosion rate to a plurality of environmental conditions. This first data is subsequently utilized to determine a quantitative relationship between corrosion rate and the plurality of environmental conditions. In another step, second data indicative of one or more environmental conditions within a building is received. A corrosion rate in the building is then determined at least in part by applying the determined quantitative relationship to this second data.Type: GrantFiled: August 31, 2011Date of Patent: February 3, 2015Assignee: International Business Machines CorporationInventors: S. Jay Chey, Hendrik F. Hamann, Levente Ioan Klein, Michael Alan Schappert, Andriy Stepanchuk
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Patent number: 8933717Abstract: Probes are directly patterned on a test substrate, thereby eliminating a need for an interposer. Probe contact structures are formed as a two-level structure having a greater lateral dimension for a lower level portion than for an upper level portion. First cavities are formed in a masking layer applied to a test substrate, filling the cavities with a conductive material, and planarizing the top surfaces of the conductive material portions to form lower level portions. Another masking layer is applied over the lower level portions and patterned to define second cavities having a smaller lateral dimension that the lower level portions. The second cavities are filled with at least one conductive material to form upper level portions of the probe contact structures. The upper level portion of each probe contact structure can be employed to penetrate a surface oxide of solder balls.Type: GrantFiled: June 21, 2012Date of Patent: January 13, 2015Assignee: International Business Machines CorporationInventors: David M. Audette, Kevin Bocash, S. Jay Chey, Steven A. Cordes, Dustin M. Fregeau
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Patent number: 8852408Abstract: An electrochemical cell apparatus is disclosed where the cell has a chamber for containing an electrolyte. The chamber is situated between a bottom and a top substrate. One or more bottom windows are in the bottom substrate and one or more top windows are in the top substrate. Each window has a window cover facing the chamber. The top window and bottom window each have a portion in alignment so that an electron beam passes through both respective portions. A spacer is deposited between the top and bottom substrate and forming walls surrounding the chamber. Two or more electrodes, each having an interior portion that is within the chamber and electrically continuous with an exterior portion external to the chamber, are located on the chamber side of the bottom substrate.Type: GrantFiled: April 29, 2009Date of Patent: October 7, 2014Assignee: International Business Machines CorporationInventors: S. Jay Chey, Mark den Heijer, Aparna Prabhakar, Frances M. Ross, Ranjani Sirdeshmukh
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Publication number: 20140230524Abstract: A corrosion sensor includes a plurality of metal strips having different thicknesses. A first metal strip with the least thickness is first employed to provide sensitive corrosion detection. After an exposed portion of the first metal strip is consumed, a second metal strip having a second least thickness can be employed to provide continued sensitive corrosion detection employing a remaining un-corroded portion of the second metal strip. The plurality of metal strips can be sequentially employed as exposed portions of thinner metal strips become unusable through complete corrosion and un-corroded exposed portions of thicker metal strips become thin enough to provide sensitive corrosion detection.Type: ApplicationFiled: April 30, 2014Publication date: August 21, 2014Applicant: International Business Machines CorporationInventors: S. Jay Chey, Hendrik F. Hamann, Levente I. Klein, Michael A. Schappert, Prabjit Singh
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Patent number: 8806740Abstract: A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.Type: GrantFiled: April 28, 2011Date of Patent: August 19, 2014Assignee: International Business Machines CorporationInventors: S. Jay Chey, Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia Kang-I Tsang
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Patent number: 8723534Abstract: A corrosion sensor includes a plurality of metal strips having different thicknesses. A first metal strip with the least thickness is first employed to provide sensitive corrosion detection. After an exposed portion of the first metal strip is consumed, a second metal strip having a second least thickness can be employed to provide continued sensitive corrosion detection employing a remaining un-corroded portion of the second metal strip. The plurality of metal strips can be sequentially employed as exposed portions of thinner metal strips become unusable through complete corrosion and un-corroded exposed portions of thicker metal strips become thin enough to provide sensitive corrosion detection.Type: GrantFiled: January 10, 2011Date of Patent: May 13, 2014Assignee: International Business Machines CorporationInventors: S. Jay Chey, Hendrik F. Hamann, Levente I. Klein, Michael A. Schappert, Prabjit Singh
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Publication number: 20130344694Abstract: Probes are directly patterned on a test substrate, thereby eliminating a need for an interposer. Probe contact structures are formed as a two-level structure having a greater lateral dimension for a lower level portion than for an upper level portion. First cavities are formed in a masking layer applied to a test substrate, filling the cavities with a conductive material, and planarizing the top surfaces of the conductive material portions to form lower level portions. Another masking layer is applied over the lower level portions and patterned to define second cavities having a smaller lateral dimension that the lower level portions. The second cavities are filled with at least one conductive material to form upper level portions of the probe contact structures. The upper level portion of each probe contact structure can be employed to penetrate a surface oxide of solder balls.Type: ApplicationFiled: July 20, 2012Publication date: December 26, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: David M. Audette, Kevin Bocash, S. Jay Chey, Steven A. Cordes, Dustin M. Fregeau
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Publication number: 20130342234Abstract: Probes are directly patterned on a test substrate, thereby eliminating a need for an interposer. Probe contact structures are formed as a two-level structure having a greater lateral dimension for a lower level portion than for an upper level portion. First cavities are formed in a masking layer applied to a test substrate, filling the cavities with a conductive material, and planarizing the top surfaces of the conductive material portions to form lower level portions. Another masking layer is applied over the lower level portions and patterned to define second cavities having a smaller lateral dimension that the lower level portions. The second cavities are filled with at least one conductive material to form upper level portions of the probe contact structures. The upper level portion of each probe contact structure can be employed to penetrate a surface oxide of solder balls.Type: ApplicationFiled: June 21, 2012Publication date: December 26, 2013Applicant: Intenational Business Machines CorporationInventors: David M. AUDETTE, Kevin BOCASH, S. Jay CHEY, Steven A. CORDES, Dustin M. FREGEAU
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Patent number: 8595919Abstract: A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.Type: GrantFiled: April 28, 2011Date of Patent: December 3, 2013Assignee: International Business Machines CorporationInventors: S. Jay Chey, Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia Kang-I Tsang
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Patent number: 8487304Abstract: An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.Type: GrantFiled: April 30, 2010Date of Patent: July 16, 2013Assignee: International Business Machines CorporationInventors: S. Jay Chey, Dustin M. Fregeau, Donna S. Zupanski-Nielsen, Aparna Prabhakar, Pavan Samudrala, Mohammed S. Shaikh
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Publication number: 20130047547Abstract: Principles of the invention provide methods and apparatus for providing corrosion management in buildings. In one aspect, an exemplary method includes the step of receiving first data relating corrosion rate to a plurality of environmental conditions. This first data is subsequently utilized to determine a quantitative relationship between corrosion rate and the plurality of environmental conditions. In another step, second data indicative of one or more environmental conditions within a building is received. A corrosion rate in the building is then determined at least in part by applying the determined quantitative relationship to this second data.Type: ApplicationFiled: August 31, 2011Publication date: February 28, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: S. Jay Chey, Hendrik F. Hamann, Levente Ioan Klein, Michael Alan Schappert, Andriy Stepanchuk
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Publication number: 20120329295Abstract: An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.Type: ApplicationFiled: September 10, 2012Publication date: December 27, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: S. Jay Chey, Dustin M. Fregeau, Donna S. Zupanski-Nielsen, Aparna Prabhakar, Pavan Samudrala, Mohammed S. Shaikh
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Publication number: 20120234902Abstract: A plurality of through-substrate holes is formed in each of at least one substrate. Each through-substrate hole extends from a top surface of the at least one substrate to the bottom surface of the at least one substrate. The at least one substrate is held by a stationary chuck or a rotating chuck. Vacuum suction is provided to a set of through-substrate holes among the plurality of through-substrate holes through a vacuum manifold attached to the bottom surface of the at least one substrate. An injection mold solder head located above the top surface of the at least one substrate injects a solder material into the set of through-substrate holes to form a plurality of through-substrate solders that extend from the top surface to the bottom surface of the at least one substrate. The vacuum suction prevents formation of air bubbles or incomplete filling in the plurality of through-substrate holes.Type: ApplicationFiled: June 4, 2012Publication date: September 20, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: S. Jay Chey, David Danovitch, Peter A. Gruber, Cornelia K. Tsang