Patents by Inventor S. Kaysar Rahim

S. Kaysar Rahim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Redistribution layer enhancement to improve reliability of wafer level packaging
    Patent number: 8084871
    Abstract: An enhanced redistribution layer is provided that geometrically expands redistribution layer (RDL) pads associated with a ball grid array of a wafer level package (WLP) to provide tensile stress relief during temperature cycle and/or drop testing of the WLP.
    Type: Grant
    Filed: November 10, 2009
    Date of Patent: December 27, 2011
    Assignee: Maxim Integrated Products, Inc.
    Inventors: S. Kaysar Rahim, Tiao Zhou, Arkadii Samoilov, Viren Khandekar, Yong Li Xu
  • Redistribution layer enhancement to improve reliability of wafer level packaging
    Patent number: 7989961
    Abstract: An enhanced redistribution layer is provided that geometrically expands redistribution layer (RDL) pads associated with a ball grid array of a wafer level package (WLP) to provide tensile stress relief during temperature cycle and/or drop testing of the WLP.
    Type: Grant
    Filed: November 10, 2009
    Date of Patent: August 2, 2011
    Assignee: Maxim Integrated Products, Inc.
    Inventors: S. Kaysar Rahim, Tiao Zhou, Arkadii Samoilov, Viren Khandekar, Yong Li Xu