Abstract: Systems and methods for audio power limiting based on thermal modeling are described. In some embodiments, a method includes monitoring a first temperature of a power die within an audio system; monitoring a second temperature of a digital die within the audio system; and using the first and second temperatures to limit an amplitude of an audio signal provided to a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) of an amplifier within the audio system to keep an operating temperature of the MOSFET under a thermal protection threshold without stopping the audio signal from being output by the audio system.