Abstract: A system and method for identifying a location of a short in a circuit of a semiconductor device is disclosed. The method and system includes providing a power supply and providing a power distribution network coupled to the power supply. The power distribution network is for distributing power to a portion of the circuit. The power distribution network further including means for selectively disconnecting a portion of the power distribution network. The portion of the power distribution network supplies power to the location of the short.

Abstract: Aspects for supporting a package and a device coupled to the package at a device frontside during package removal at a package backside are described. In an exemplary aspect, a support structure includes a support frame supporting the package substantially near end portions of the package, and a set of support braces supporting the package substantially near the device. The structure further includes a block support positioned within the set of support braces and substantially underneath the device at a predetermined distance from the device. Support material is provided between the support frame and the set of support braces and between the block support and the device, wherein breakage of the package during grinding removal of the package is reduced.