Abstract: The present disclosure provides method and apparatus for guiding topic in a conversation between a user and a chat engine. At least one first topic is determined. A first message is provided to the user based on the at least one first topic, to guide the conversation to the at least one first topic. A first response to the first message is received from the user. It is determined whether the first response is associated with the at least one first topic. In the case of determining that the first response is associated with the at least one first topic, at least one second topic is determined based on the at least one first topic. At least one second message is provided based at least on the at least one second topic, wherein if the at least one second topic is associated with resource or service, the at least one second message includes at least the resource or service.

Abstract: The present disclosure provides method and apparatus for guiding topic in a conversation between a user and a chat engine. At least one first topic is determined. A first message is provided to the user based on the at least one first topic, to guide the conversation to the at least one first topic. A first response to the first message is received from the user. It is determined whether the first response is associated with the at least one first topic. In the case of determining that the first response is associated with the at least one first topic, at least one second topic is determined based on the at least one first topic. At least one second message is provided based at least on the at least one second topic, wherein if the at least one second topic is associated with resource or service, the at least one second message includes at least the resource or service.

Abstract: A semiconductor chip with conductive wiring that is routed to the edge of the substrate from the chip's backside. A plurality of such semiconductor chips are stacked and electrically connected using a wiring element that is a circuit board or conductive adhesive strips. The wiring element connects the conductive wiring of each semiconductor chip along the sides of the chips to the package substrate. A method of manufacturing the semiconductor chip includes batch manufacturing a plurality of die on a wafer with an active surface on which a plurality bonding pads are formed, and a backside which is the rear side of the active surface; forming a circuit groove on the backside; applying conductive wiring on the circuit groove using a conductive material; and separating the wafer into a plurality of semiconductor chips.

Abstract: A stacked chip package includes a substrate having an upper surface and a lower surface, a first semiconductor chip having an upper surface and a lower surface, wherein the lower surface of the first semiconductor chip is attached to the upper surface of the substrate and the upper surface of the first semiconductor chip includes a plurality of first electrode pads, and a second semiconductor chip having an upper surface and a lower surface. The lower surface of the second semiconductor chip is attached to the upper surface of the first semiconductor chip, and the lower surface of the second semiconductor chip includes trenches that correspond to the locations of the first electrode pads on the upper surface of the first semiconductor chip.