Patents by Inventor Sarah Eunkyung Kim

Sarah Eunkyung Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device package comprising thermal interface layer and method of fabricating of the same
    Patent number: 11232996
    Abstract: A method for manufacturing a semiconductor device package may comprise providing a semiconductor device, preparing a thermal interface layer on the semiconductor device, and disposing a heat spreader on the thermal interface layer, wherein the thermal interface layer comprises a core shell composite containing a metal core and a carbon shell surrounding the metal core.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: January 25, 2022
    Assignees: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUS, FOUNDATION FOR RESEARCH AND BUSINESS, SEOUL NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Sunyong Lee, Sarah Eunkyung Kim, Tae Hyeob Im
  • SEMICONDUCTOR DEVICE PACKAGE COMPRISING THERMAL INTERFACE LAYER AND METHOD OF FABRICATING OF THE SAME
    Publication number: 20210118771
    Abstract: A method for manufacturing a semiconductor device package may comprise providing a semiconductor device, preparing a thermal interface layer on the semiconductor device, and disposing a heat spreader on the thermal interface layer, wherein the thermal interface layer comprises a core shell composite containing a metal core and a carbon shell surrounding the metal core.
    Type: Application
    Filed: June 18, 2020
    Publication date: April 22, 2021
    Applicants: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUS, FOUNDATION FOR RESEARCH AND BUSINESS, SEOUL NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Sunyong Lee, Sarah Eunkyung Kim, Tae Hyeob Im