Patents by Inventor Sa Yong Lee
Sa Yong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11763982Abstract: An inductor includes a body in which a plurality of insulating layers on which a plurality of coil patterns are arranged are stacked, and first and second external electrodes disposed inside the body, wherein the plurality of coil patterns are connected by coil connecting portions and form a coil in which opposing ends thereof are connected to the first and second external electrodes, and the first and second external electrodes are directly connected to the opposing ends of the plurality of coil patterns inside the body.Type: GrantFiled: November 30, 2018Date of Patent: September 19, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sa Yong Lee, Mi Sun Hwang
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Patent number: 11488768Abstract: A coil component includes: a body including a magnetic material, coil pattern layers disposed in the magnetic material, a core portion surrounded by the coil pattern layers, and an insulating layer disposed in the core portion and between adjacent coil pattern layers among the coil pattern layers, wherein each of the coil pattern layers comprises a spiral-shaped pattern; and an external electrode disposed on the body.Type: GrantFiled: May 10, 2019Date of Patent: November 1, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Sa Yong Lee, Myung Sam Kang
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Patent number: 11476034Abstract: A coil electronic component includes a body having a multilayer structure formed by stacking a plurality of sheets and external electrodes disposed on outer surfaces of the body. A coil pattern is printed on each of the plurality of sheets. The coil pattern includes a coil body and a corner pattern spaced apart from the coil pattern and coupled to the external electrodes. An inner edge of the second coil pattern facing the coil body is formed as a curved line or a linear line.Type: GrantFiled: July 6, 2018Date of Patent: October 18, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Hui Jo, Hye Won Jung, Sa Yong Lee
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Patent number: 11430737Abstract: Provided is a printed circuit board including a laminate that is formed by vertically stacking a plurality of insulating layers including a rigid insulating layer, a flexible insulating layer having a first region in vertical contact with at least one of the plurality of insulating layers and a second region located on an outer side of the laminate, and a first electronic element embedded in the flexible insulating layer.Type: GrantFiled: August 12, 2019Date of Patent: August 30, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho-Hyung Ham, Sa-Yong Lee, Ju-Ho Kim
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Patent number: 11013114Abstract: A printed circuit board is provided. The printed circuit board includes an insulating material, and a circuit comprising a first region that partially penetrates the insulating material, and a second region formed on the first region and that protrudes from an upper portion of the insulating material, the first region includes a first electroplating layer and a first electroless plating layer that are formed between the insulating material and the first electroplating layer.Type: GrantFiled: October 23, 2019Date of Patent: May 18, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Seon-Ha Kang, Sa-Yong Lee, Mi-Sun Hwang, Ju-Ho Kim
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Patent number: 10902994Abstract: A coil electronic component includes a body including a plurality of insulating layers and coil patterns disposed on the insulating layers, and external electrodes formed on external surfaces of the body and connected to the coil patterns, wherein the external electrodes include first layers being electroless plating layers and second layers formed on the first layers and having a form in which metal particles are dispersed in a polymer base, respectively.Type: GrantFiled: May 24, 2018Date of Patent: January 26, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chi Seong Kim, Jun Il Kang, Sa Yong Lee, Gun Hwi Hyung
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Patent number: 10847300Abstract: There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a coil part; and cover parts disposed on upper and lower surfaces of the body. The coil part includes a plurality of through-vias penetrating through the upper and lower surfaces of the body and connection patterns disposed on the upper and lower surfaces of the body, disposed in the cover parts, and connecting the plurality of through-vias to each other.Type: GrantFiled: July 5, 2017Date of Patent: November 24, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Woo Choi, Jin Ho Hong, Il Jong Seo, Sa Yong Lee, Myung Sam Kang, Tae Hong Min
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Publication number: 20200176386Abstract: Provided is a printed circuit board including a laminate that is formed by vertically stacking a plurality of insulating layers including a rigid insulating layer, a flexible insulating layer having a first region in vertical contact with at least one of the plurality of insulating layers and a second region located on an outer side of the laminate, and a first electronic element embedded in the flexible insulating layer.Type: ApplicationFiled: August 12, 2019Publication date: June 4, 2020Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ho-Hyung HAM, Sa-Yong LEE, Ju-Ho KIM
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Publication number: 20200170110Abstract: A printed circuit board is provided. The printed circuit board includes an insulating material, and a circuit comprising a first region that partially penetrates the insulating material, and a second region formed on the first region and that protrudes from an upper portion of the insulating material, the first region includes a first electroplating layer and a first electroless plating layer that are formed between the insulating material and the first electroplating layer.Type: ApplicationFiled: October 23, 2019Publication date: May 28, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Seon-Ha KANG, Sa-Yong LEE, Mi-Sun HWANG, Ju-Ho KIM
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Publication number: 20200163228Abstract: A printed circuit board includes: an insulating material; a metal layer disposed on a first surface of the insulating material and including an opening; a pad disposed along a second surface of the insulating material; a via hole penetrating through the insulating material and extending from the pad to the opening; and a conductor disposed along the opening and the via hole. A diameter of a portion of the via hole adjacent to the opening is smaller than a diameter of a portion of the opening adjacent to the via hole.Type: ApplicationFiled: October 25, 2019Publication date: May 21, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Sa-Yong LEE, Tae-Hong MIN
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Patent number: 10636562Abstract: A coil electronic component includes: a plurality of coil layers including, respectively, coil patterns and connection patterns disposed outside the coil patterns and forming a stacking structure; conductive vias connecting the coil patterns formed on different levels to each other; and external electrodes electrically connected to the plurality of coil layers. The coil patterns of at least two of the plurality of coil layers may have the same shape and be electrically connected to each other in parallel.Type: GrantFiled: July 27, 2017Date of Patent: April 28, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ki Seok Kim, Myung Sam Kang, Ye Jeong Kim, Kwang Hee Kwon, Sa Yong Lee
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Publication number: 20200090848Abstract: A chip component includes a magnetic substrate having ferrite layers, and an insulating layer disposed on the magnetic substrate and having an electrode disposed therein. An external electrode is connected to the electrode on the insulating layer. The magnetic substrate and the insulating layer have a chemical coupling structure formed on an interface therebetween. The chemical coupling structure includes Si—O—C or Si—O—N.Type: ApplicationFiled: November 25, 2019Publication date: March 19, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Sa Yong LEE, Yong Il KWON, Jin Ho HONG, Sung Han KIM, Keun Yong LEE
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Publication number: 20190318867Abstract: An inductor includes a body in which a plurality of insulating layers on which a plurality of coil patterns are arranged are stacked, and first and second external electrodes disposed inside the body, wherein the plurality of coil patterns are connected by coil connecting portions and form a coil in which opposing ends thereof are connected to the first and second external electrodes, and the first and second external electrodes are directly connected to the opposing ends of the plurality of coil patterns inside the body.Type: ApplicationFiled: November 30, 2018Publication date: October 17, 2019Inventors: Sa Yong LEE, Mi Sun HWANG
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Publication number: 20190267182Abstract: A coil component includes: a body including a magnetic material, coil pattern layers disposed in the magnetic material, a core portion surrounded by the coil pattern layers, and an insulating layer disposed in the core portion and between adjacent coil pattern layers among the coil pattern layers, wherein each of the coil pattern layers comprises a spiral-shaped pattern; and an external electrode disposed on the body.Type: ApplicationFiled: May 10, 2019Publication date: August 29, 2019Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Sa Yong LEE, Myung Sam KANG
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Publication number: 20190122808Abstract: A coil electronic component includes a body having a multilayer structure formed by stacking a plurality of sheets and external electrodes disposed on outer surfaces of the body. A coil pattern is printed on each of the plurality of sheets. The coil pattern includes a coil body and a corner pattern spaced apart from the coil pattern and coupled to the external electrodes. An inner edge of the second coil pattern facing the coil body is formed as a curved line or a linear line.Type: ApplicationFiled: July 6, 2018Publication date: April 25, 2019Inventors: Dae Hui JO, Hye Won JUNG, Sa Yong LEE
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Publication number: 20190115145Abstract: A coil electronic component includes a body including a plurality of insulating layers and coil patterns disposed on the insulating layers, and external electrodes formed on external surfaces of the body and connected to the coil patterns, wherein the external electrodes include first layers being electroless plating layers and second layers formed on the first layers and having a form in which metal particles are dispersed in a polymer base, respectively.Type: ApplicationFiled: May 24, 2018Publication date: April 18, 2019Inventors: Chi Seong KIM, Jun Il KANG, Sa Yong LEE, Gun Hwi HYUNG
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Publication number: 20180130595Abstract: There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a coil part; and cover parts disposed on upper and lower surfaces of the body. The coil part includes a plurality of through-vias penetrating through the upper and lower surfaces of the body and connection patterns disposed on the upper and lower surfaces of the body, disposed in the cover parts, and connecting the plurality of through-vias to each other.Type: ApplicationFiled: July 5, 2017Publication date: May 10, 2018Inventors: Jung Woo Choi, Jin Ho Hong, Il Jong Seo, Sa Yong Lee, Myung Sam Kang, Tae Hong Min
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Publication number: 20180122557Abstract: A coil electronic component includes: a plurality of coil layers including, respectively, coil patterns and connection patterns disposed outside the coil patterns and forming a stacking structure; conductive vias connecting the coil patterns formed on different levels to each other; and external electrodes electrically connected to the plurality of coil layers. The coil patterns of at least two of the plurality of coil layers may have the same shape and be electrically connected to each other in parallel.Type: ApplicationFiled: July 27, 2017Publication date: May 3, 2018Inventors: Ki Seok KIM, Myung Sam KANG, Ye Jeong KIM, Kwang Hee KWON, Sa Yong LEE
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Patent number: 9899136Abstract: A coil component includes a body portion, a coil portion, and an electrode portion. The body portion includes a magnetic material, the coil portion is disposed in the body portion, and the electrode portion is disposed on the body portion and electrically connected to the coil portion. The coil portion includes a first coil layer in which a plurality of conductors having a planar spiral shape are stacked, a second coil layer in which a plurality of conductors having a planar spiral shape are stacked, and a first bump disposed between the first and second coil layers to electrically connect the first and second coil layers to each other. The first coil layer and the second coil layer are electrically connected to each other through the first bump to form a single coil having coil turns adjacent to each other in horizontal and vertical directions.Type: GrantFiled: December 30, 2016Date of Patent: February 20, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sa Yong Lee, Myung Sam Kang, Tae Hong Min, Seon Ha Kang, Mi Sun Hwang, Il Jong Seo
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Publication number: 20170330674Abstract: A coil component includes a body portion, a coil portion, and an electrode portion. The body portion includes a magnetic material, the coil portion is disposed in the body portion, and the electrode portion is disposed on the body portion and electrically connected to the coil portion. The coil portion includes a first coil layer in which a plurality of conductors having a planar spiral shape are stacked, a second coil layer in which a plurality of conductors having a planar spiral shape are stacked, and a first bump disposed between the first and second coil layers to electrically connect the first and second coil layers to each other. The first coil layer and the second coil layer are electrically connected to each other through the first bump to form a single coil having coil turns adjacent to each other in horizontal and vertical directions.Type: ApplicationFiled: December 30, 2016Publication date: November 16, 2017Inventors: Sa Yong LEE, Myung Sam KANG, Tae Hong MIN, Seon Ha KANG, Mi Sun HWANG, Il Jong SEO