Patents by Inventor Sa ZHU

Sa ZHU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Gesture recognition method, apparatus and system based on coupling capacitance
    Patent number: 12099712
    Abstract: A gesture recognition method, apparatus and system based on coupling capacitance, which are configured to solve the technical problem in the prior art of it not being possible to recognize a complex gesture due to the fact that the coordinates of a manipulation body on a three-dimensional plane cannot be determined.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: September 24, 2024
    Assignees: Beijing BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Xingjun Shu, Qingzhu Guan, Shuang Shi, Jinlong Zheng, Junjie Xu, Yanming Wang, Sa Li, Fuan Zhu, Yue An, Yadong Zhang, Zongli Gao, Cuie Wang, Shuainan Liu, Shengwei Yang, Lidong Wang, Libao Cui, Runfei Du, Qi Zhang
  • Motor thermoanalysis method with temperature field directly coupled with heat circuit
    Patent number: 11093662
    Abstract: A motor thermal analysis method with a temperature field directly coupled with a thermal circuit is used for modeling partial parts of the motor, and a thermal circuit method is used for modeling other parts. A temperature field is contacted with a thermal circuit through an equivalent temperature boundary and an equivalent convection boundary. The thermal circuit part is composed of one-dimensional finite elements, and two connecting boundaries are deemed as two boundary elements. An element stiffness matrix, an element loading matrix and an element mass matrix corresponding to the one-dimensional finite elements and the boundary elements are respectively overlaid to a global stiffness matrix, a global loading matrix and a global mass matrix, and the distribution of temperature in the temperature field and the distribution of temperature in the thermal circuit are obtained simultaneously by solving a whole system of linear equations.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: August 17, 2021
    Assignee: SOUTHEAST UNIVERSITY
    Inventors: Ming Cheng, Sa Zhu
  • MOTOR THERMOANALYSIS METHOD WITH TEMPERATURE FIELD DIRECTLY COUPLED WITH HEAT CIRCUIT
    Publication number: 20190114385
    Abstract: A motor thermal analysis method with a temperature field directly coupled with a thermal circuit is used for modeling partial parts of the motor, and a thermal circuit method is used for modeling other parts. A temperature field is contacted with a thermal circuit through an equivalent temperature boundary and an equivalent convection boundary. The thermal circuit part is composed of one-dimensional finite elements, and two connecting boundaries are deemed as two boundary elements. An element stiffness matrix, an element loading matrix and an element mass matrix corresponding to the one-dimensional finite elements and the boundary elements are respectively overlaid to a global stiffness matrix, a global loading matrix and a global mass matrix, and the distribution of temperature in the temperature field and the distribution of temperature in the thermal circuit are obtained simultaneously by solving a whole system of linear equations.
    Type: Application
    Filed: February 20, 2017
    Publication date: April 18, 2019
    Inventors: Ming CHENG, Sa ZHU