Patents by Inventor Saagar A. Shah

Saagar A. Shah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210212216
    Abstract: Flexible devices including conductive traces with enhanced stretchability, and methods of making and using the same are provided. The circuit die is disposed on a flexible substrate. Electrically conductive traces are formed in channels on the flexible substrate to electrically contact with contact pads of the circuit die. A first polymer liquid flows in the channels to cover a free surface of the traces. The circuit die can also be surrounded by a curing product of a second polymer liquid.
    Type: Application
    Filed: September 12, 2019
    Publication date: July 8, 2021
    Inventors: Saagar Shah, Mikhail L. Pekurovsky, Ankit Mahajan, Lyudmila A. Pekurovsky, Jessica Chiu, Jeremy K. Larsen, Kara A. Meyers, Teresa M. Goeddel, Thomas J. Metzler, Jonathan W. Kemling, Richard J. Pokorny, Benjamin R. Coonce, Chad M. Amb, Thomas P. Klun
  • Publication number: 20210178554
    Abstract: A bonded abrasive wheel is disclosed comprising a plurality of abrasive particles disposed in a binder, a first grinding surface, a second surface opposing the first grinding surface, and an outer circumference. The wheel comprises a rotational axis extending through a central hub and a circuit configured as a Radio Frequency Identification (RFID) unit coupled to the abrasive wheel. The circuit comprises an antenna configured to communicate with one or more external devices and comprising a first end and a second end, wherein antenna has a radius of curvature about an axis along at least a portion thereof such that the first end is disposed adjacent to but is spaced from the second end, and an integrated circuit (IC) operably coupled to the antenna and configured to store at least a first data.
    Type: Application
    Filed: August 15, 2019
    Publication date: June 17, 2021
    Inventors: Joseph B. Eckel, Nicholas T. Gabriel, Ankit Mahajan, Mikhail L. Pekurovsky, Kara A. Meyers, Thomas J. Metzler, Saagar A. Shah
  • Patent number: 10971468
    Abstract: Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: April 6, 2021
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Ankit Mahajan, Mikhail L. Pekurovsky, Matthew S. Stay, Daniel J. Theis, Ann M. Gilman, Shawn C. Dodds, Thomas J. Metzler, Matthew R. D. Smith, Roger W. Barton, Joseph E. Hernandez, Saagar A. Shah, Kara A. Meyers, James Zhu, Teresa M. Goeddel, Lyudmila A. Pekurovsky, Jonathan W. Kemling, Jeremy K. Larsen, Jessica Chiu, Kayla C. Niccum
  • Publication number: 20210035875
    Abstract: Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed at a registration area of a substrate. Fluid channels extend into the registration area and have a portion underneath the bottom surface of the solid circuit die. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward contact pads on the bottom surface of the circuit die to obtain the automatic registration.
    Type: Application
    Filed: February 27, 2019
    Publication date: February 4, 2021
    Inventors: Ankit Mahajan, Mikhail L. Pekurovsky, Saagar A. Shah, Thomas J. Metzler, Kara A. Meyers, James Zhu, Teresa M. Goeddel, Lyudmila A. Pekurovsky, Jonathan W. Kemling, Jeremy K. Larsen
  • Patent number: 10854355
    Abstract: A stretchable conductor includes a substrate with a first major surface and an elongate wire, wherein the substrate is an elastomeric material, the elongate wire is on the first major surface of the substrate, the wire includes a first end and a second end, and further includes at least one arcuate region between the first end and the second end. At least one portion of the arcuate region of the wire in the region has a first surface area portion embedded in the surface of the substrate and a second surface area portion unembedded on the substrate and exposed in an amount sufficient to render at least an area of the substrate in the region electrically conductive. The unembedded second surface portion of the arcuate region may lie above or below a plane of the substrate. Additionally, different methods of preparing said stretchable conductor are disclosed. Composite articles including said stretchable conductor in durable electrical contact with a conductive fabric are also disclosed.
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: December 1, 2020
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Ankit Mahajan, Jr., James Zhu, Saagar A. Shah, Mikhail L. Pekurovsky, Vivek Krishnan, Kevin T. Reddy, Christopher B. Walker, Jr., Michael A. Kropp, Kara A. Meyers, Teresa M. Goeddel, Thomas J. Metzler, Jonathan W. Kemling, Roger W. Barton
  • Publication number: 20200105991
    Abstract: Electronic devices including a layer of polymeric material and solid semiconductor dies partially embedded in the layer are provided. The dies have first ends projecting away from the first major surface of the layer. The electronic devices can be formed by sinking the first ends of the dies into a major surface of a liner. A flowable polymeric material is filled into the space between the dies and solidified to form the layer of polymeric material. The first ends of the dies are exposed by delaminating the liner from the first ends of the dies. Electrical conductors are provided on the layer to connect the first ends of the dies.
    Type: Application
    Filed: March 22, 2018
    Publication date: April 2, 2020
    Inventors: Ankit Mahajan, Mikhail L. Pekurovsky, Matthew S. Stay, Shawn C. Dodds, Thomas J. Metzler, Matthew R.D. Smith, Saagar A. Shah, Jae Yong Lee, James F. Poch, Roger W. Barton
  • Publication number: 20200105440
    Abstract: A stretchable conductor includes a substrate with a first major surface and an elongate wire, wherein the substrate is an elastomeric material, the elongate wire is on the first major surface of the substrate, the wire includes a first end and a second end, and further includes at least one arcuate region between the first end and the second end. At least one portion of the arcuate region of the wire in the region has a first surface area portion embedded in the surface of the substrate and a second surface area portion unembedded on the substrate and exposed in an amount sufficient to render at least an area of the substrate in the region electrically conductive. The unembedded second surface portion of the arcuate region may lie above or below a plane of the substrate. Additionally, different methods of preparing said stretchable conductor are disclosed. Composite articles including said stretchable conductor in durable electrical contact with a conductive fabric are also disclosed.
    Type: Application
    Filed: June 7, 2018
    Publication date: April 2, 2020
    Inventors: Ankit Mahajan, Jr., James Zhu, Saagar A. Shah, Mikhail L. Pekurovsky, Vivek Krishnan, Kevin T. Reddy, Christopher B. Walker, Jr., Michael A. Kropp, Kara A. Meyers, Teresa M. Goeddel, Thomas J. Metzler, Jonathan W. Kemling, Roger W. Barton
  • Publication number: 20190273061
    Abstract: Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.
    Type: Application
    Filed: November 16, 2017
    Publication date: September 5, 2019
    Inventors: Ankit Mahajan, Mikhail L. Pekurovsky, Matthew S. Stay, Daniel J. Theis, Ann M. Gillman, Shawn C. Dodds, Thomas J. Metzler, Matthew R.D. Smith, Roger W. Barton, Joseph E. Hernandez, Saagar A. Shah, Kara A. Meyers, James Zhu, Teresa M. Goeddel, Lyudmila A. Pekurovsky, Jonathan W. Kemling, Jeremy K. Larsen, Jessica Chiu, Kayla C. Niccum