Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed. An example system includes interface circuitry; first programmable circuitry; and instructions to cause the first programmable circuitry to: determine, based on a first signal output by a first sensor, a first temperature at a first location that is associated with second programmable circuitry; determine, based on a second signal output by a second sensor, a second temperature at a second location that is different than the first location; set a first thermal setpoint for the second programmable circuitry in response to the second temperature failing to satisfy a threshold value; and set a second thermal setpoint for the second programmable circuitry in response to the second temperature satisfying the threshold value, wherein the second thermal setpoint is higher than the first thermal setpoint.

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package having a semiconductor chip therein. The semiconductor chip package to communicate a temperature of the semiconductor chip. The apparatus includes a heat sink that is thermally coupled to the semiconductor chip package. The heat sink has fins. The apparatus includes a fan. The apparatus includes a temperature sensing device. The temperature sensing device is to sense a temperature of an ambient before the ambient is warmed by the fins. A rotational speed of the fan is to be determined from the temperature of the semiconductor chip and the temperature of the ambient.