Patents by Inventor Saat Shukri bin Embong

Saat Shukri bin Embong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally enhanced semiconductor package system
    Patent number: 8415786
    Abstract: A semiconductor package system is provided including: a semiconductor chip; a substrate having a substrate opening and a vertical build-up wing, the substrate having the semiconductor chip mounted thereon with the vertical build-up wing circumscribed by vertical planes of a perimeter of, and spaced apart from, the semiconductor chip; a first heat slug attached above the substrate at a first horizontal plane and to a first surface of the semiconductor chip, the semiconductor chip at least partially encapsulated by the first heat slug; and a second heat slug attached to the substrate at a second horizontal plane above the first horizontal plane and to a second surface of the semiconductor chip through the substrate opening.
    Type: Grant
    Filed: April 3, 2012
    Date of Patent: April 9, 2013
    Assignee: STATS ChipPac Ltd.
    Inventors: You Yang Ong, Zurina binti Zukiffly, Saat Shukri bin Embong
  • THERMALLY ENHANCED SEMICONDUCTOR PACKAGE SYSTEM
    Publication number: 20120187555
    Abstract: A semiconductor package system is provided including: a semiconductor chip; a substrate having a substrate opening and a vertical build-up wing, the substrate having the semiconductor chip mounted thereon with the vertical build-up wing circumscribed by vertical planes of a perimeter of, and spaced apart from, the semiconductor chip; a first heat slug attached above the substrate at a first horizontal plane and to a first surface of the semiconductor chip, the semiconductor chip at least partially encapsulated by the first heat slug; and a second heat slug attached to the substrate at a second horizontal plane above the first horizontal plane and to a second surface of the semiconductor chip through the substrate opening.
    Type: Application
    Filed: April 3, 2012
    Publication date: July 26, 2012
    Inventors: You Yang Ong, Zurina binti Zukiffly, Saat Shukri bin Embong
  • Hyper thermally enhanced semiconductor package system comprising heat slugs on opposite surfaces of a semiconductor chip
    Patent number: 8164182
    Abstract: A semiconductor package system is provided including mounting a semiconductor chip to a substrate having a substrate opening. A first heat slug is attached to a first surface of the semiconductor chip at least partially encapsulating the semiconductor chip. A second heat slug is attached to the second surface of the semiconductor chip through the substrate opening.
    Type: Grant
    Filed: November 14, 2005
    Date of Patent: April 24, 2012
    Assignee: Stats Chippac Ltd.
    Inventors: You Yang Ong, Zurina binti Zukiffly, Saat Shukri bin Embong
  • HYPER THERMALLY ENHANCED SEMICONDUCTOR PACKAGE SYSTEM
    Publication number: 20060131735
    Abstract: A semiconductor package system is provided including mounting a semiconductor chip to a substrate having a substrate opening. A first heat slug is attached to a first surface of the semiconductor chip at least partially encapsulating the semiconductor chip. A second heat slug is attached to the second surface of the semiconductor chip through the substrate opening.
    Type: Application
    Filed: November 14, 2005
    Publication date: June 22, 2006
    Applicant: STATS CHIPPAC LTD.
    Inventors: You Yang Ong, Zurina binti Zukiffly, Saat Shukri bin Embong