Abstract: A microelectronic package is provided. The microelectronic package includes a substrate, a die coupled to a top surface of the substrate and a integrated heat spreader thermally coupled to the die, wherein the integrated heat spreader comprises integrated heat spreader walls. The microelectronic package also includes a thermal interface material disposed between the die and the integrated heat spreader and an underfill material disposed between the integrated heat spreader and the substrate, wherein the underfill material is disposed within gaps between the integrated heat spreader walls, the die and the thermal interface material.

Abstract: A microelectronic package is provided. The microelectronic package includes a substrate, a die coupled to a top surface of the substrate and a integrated heat spreader thermally coupled to the die, wherein the integrated heat spreader comprises integrated heat spreader walls. The microelectronic package also includes a thermal interface material disposed between the die and the integrated heat spreader and an underfill material disposed between the integrated heat spreader and the substrate, wherein the underfill material is disposed within gaps between the integrated heat spreader walls, the die and the thermal interface material.

Abstract: Methods and apparatus to improve flux spray atomization and/or splash control are described. In one embodiment, a flux nozzle includes a plurality of injection holes to deposit flux fluid through an exit hole of an air cap onto a substrate (such as a printed circuit board). The flux fluid may atomize prior to deposition onto the substrate as relatively smaller broken down flux droplets that may aid reduced spray splash. Other embodiments are also described.

Abstract: A conductive material may be jet dispensed (i.e. jet sprayed) on an integrated circuit die and a bond pad to form a conformal electrical connection on and between the bond pad and the die. In some cases, a smaller package footprint and/or height may result.

Abstract: A combined thermal interface material and second layer interconnect reflow material and method are disclosed.

Abstract: An integrated circuit packaging method, system and apparatus for maintaining a predetermined temperature between reflow and underfill dispense are disclosed.

Abstract: A method for attaching an integrated circuit chip to a package substrate includes placing the integrated circuit onto the package substrate, and performing reflow to attach the integrated circuit to the package substrate. The temperature of the integrated circuit and package assembly is maintained at or above a predetermined temperature prior to dispensing an underfill between the package substrate and the integrated circuit. An underfill material is dispensed between the package substrate and the integrated circuit. The underfill material is cured to a first level of curing in the integrated circuit and package assembly. The underfill material is cooled in the integrated circuit and package assembly, and the underfill material is cured to a second level of curing in which the second level of curing is greater than the first level of curing.

Abstract: A combined thermal interface material and second layer interconnect reflow material and method are disclosed.

Abstract: A method for attaching an integrated circuit chip to a package substrate includes placing the integrated circuit onto the package substrate, and performing reflow to attach the integrated circuit to the package substrate. The temperature of the integrated circuit and package assembly is maintained at or above a predetermined temperature prior to dispensing an underfill between the package substrate and the integrated circuit. An underfill material is dispensed between the package substrate and the integrated circuit. The underfill material is cured to a first level of curing in the integrated circuit and package assembly. The underfill material is cooled in the integrated circuit and package assembly, and the underfill material is cured to a second level of curing in which the second level of curing is greater than the first level of curing.

Abstract: Methods for fabricating thermal management systems for micro-component devices are described herein. The methods may include initially overlaying a target substrate with a blank that is in sheet form, and stamping a microchannel structure having a plurality of outer walls enclosing a predefined area from the blank. The microchannel structure may then be bonded to a heat dissipating side opposite from a micro-component device facing side of a first substrate, the micro-component device facing side of the first substrate being adapted to thermally engage with the micro-component device. The microchannel structure may then be bonded to a second substrate opposite the first substrate, resulting in a closed volume microchannel being defined. Finally, the defined microchannel may then be substantially filled with a fluid thermal interface material.

Abstract: Methods and apparatus to improve flux spray atomization and/or splash control are described. In one embodiment, a flux nozzle includes a plurality of injection holes to deposit flux fluid through an exit hole of an air cap onto a substrate (such as a printed circuit board). The flux fluid may atomize prior to deposition onto the substrate as relatively smaller broken down flux droplets that may aid reduced spray splash. Other embodiments are also described.

Abstract: Some embodiments include an apparatus comprising a spray head to spray a substrate, the substrate having a region to be sprayed and a region to be masked, the two regions separated by a boundary, and a mask having channels, the mask located between the spray head and the substrate. In an embodiment, the mask further has a lip to prevent flux overspray from falling onto a substrate below. In an embodiment, flux overspray removal is assisted with a vacuum system. Other embodiments are described and claimed.

Abstract: A heat spreader, comprised of a plurality of carbon fibers oriented in a plurality of directions, with a carbon or metal matrix material dispersed about the fibers, is described. The carbon fibers facilitate the spreading of heat away from the smaller semiconductor device and up to a larger heat removal device, such as a heat sink.

Abstract: A system may include an integrated heat spreader that includes a portion of solder material and a thermal conductor, wherein a voidless interface exists between the solder material and a first side of the thermal conductor.

Abstract: In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat spreader. The heat spreader is provided over the die and is attached to the substrate with fasteners rather than a sealant-adhesive. Some examples of suitable fasteners may include rivets, barbed connectors, and gripping clips.

Abstract: A method and an arrangement to bond a die to a substrate of a die-substrate combination to form a microelectronic package. The method comprises: providing the die-substrate combination including a die, a substrate, pre-connection bumps and an underfill material, the pre-connection bumps and underfill material being disposed between the die and the substrate; forming joints from the pre-connection bumps at a joint formation site to obtain an intermediate package; curing the underfill material of the intermediate package at an underfill curing site to obtain the microelectronic package; using a conveying device to transfer the intermediate package from the joint formation site to the underfill curing site; and applying heat energy to the intermediate package during at least part of a transfer thereof from the joint formation site to the underfill curing site to control a temperature of the intermediate package.

Abstract: A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved interfacial contact. Embodiments of thermal conduction structures are shown that provide composite thermal conduction and circulated liquid cooling. Embodiments are further shown that require simple, low numbers of manufacturing steps and reduced thermal interface thickness.

Abstract: A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved interfacial contact. Embodiments of thermal conduction structures are shown that provide composite thermal conduction and circulated liquid cooling. Embodiments are further shown that require simple, low numbers of manufacturing steps and reduced thermal interface thickness.

Abstract: A process of making a multi-layer thermal interface material is depicted. The multi-layer thermal interface material is attached between an integrated heat spreader and a die. Processing of the multi-layer thermal interface material includes stamping or other pressure processing.

Abstract: Apparatus and methods for providing self-contained, closed-loop microchannel cooling systems that can be integrated into a micro-component package, such as a microelectronic package, are described herein.