Patents by Inventor Sabine Bergmann

Sabine Bergmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power electronics assembly including a circuit carrier
    Patent number: 11276623
    Abstract: A circuit carrier for holding at least one electrical power component is disclosed. The circuit carrier including a heat sink for holding and for cooling the power component. The heat sink having a surface. The circuit carrier includes a copper layer for mechanically connecting the heat sink to at least one copper plate, where the copper layer includes copper or a copper alloy and is cold-gas-sprayed or sintered on the surface of the heat sink. The circuit carrier also includes at least one copper plate for mechanically and electrically connecting the power component to the copper layer. The copper plate includes copper or a copper alloy and is arranged directly on a surface of the copper layer facing away from the heat sink and is areally, mechanically and electrically conductively connected to the copper layer.
    Type: Grant
    Filed: February 18, 2018
    Date of Patent: March 15, 2022
    Assignee: VITESCO TECHNOLOGIES GMBH
    Inventors: Erich Mattmann, Sabine Bergmann, Roland Brey, Soeren Rittstieg
  • POWER ELECTRONICS ASSEMBLY INCLUDING A CIRCUIT CARRIER
    Publication number: 20180174947
    Abstract: A circuit carrier for holding at least one electrical power component is disclosed. The circuit carrier including a heat sink for holding and for cooling the power component. The heat sink having a surface. The circuit carrier includes a copper layer for mechanically connecting the heat sink to at least one copper plate, where the copper layer includes copper or a copper alloy and is cold-gas-sprayed or sintered on the surface of the heat sink. The circuit carrier also includes at least one copper plate for mechanically and electrically connecting the power component to the copper layer. The copper plate includes copper or a copper alloy and is arranged directly on a surface of the copper layer facing away from the heat sink and is areally, mechanically and electrically conductively connected to the copper layer.
    Type: Application
    Filed: February 18, 2018
    Publication date: June 21, 2018
    Applicant: CONTINENTAL AUTOMOTIVE GMBH
    Inventors: Erich Mattmann, Sabine Bergmann, Roland Brey, Soeren Rittstieg