Patents by Inventor Sabine Friedrich

Sabine Friedrich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Arrangement for an optoelectronic component, manufacturing process and optoelectronic component
    Patent number: 11728444
    Abstract: An arrangement for an optoelectronic component includes a substrate and an optical semiconductor chip arranged on the substrate. The optical semiconductor chip has an optically active region, a first optically non-active region, and a second optically non-active region. A connection structure connects a chip-side electrical connection to the optically active region. An electrical connection connects the chip-side electrical connection to a second substrate-side electrical connection. A coating is provided in a layer stack in the optically active region, in the first optically non-active region, and in the second optically non-active region. The layer stack includes a first layer and a second layer arranged above the first layer. The chip-side electrical connection and the connection structure in the first optically non-active region and the protective layer in the second optically non-active region are each arranged between the first layer and the second layer.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: August 15, 2023
    Assignee: First Sensor AG
    Inventors: Martin Wilke, Sabine Friedrich, Stephan Dobritz
  • Arrangement For an Optoelectronic Component, Manufacturing Process and Optoelectronic Component
    Publication number: 20210408302
    Abstract: An arrangement for an optoelectronic component includes a substrate and an optical semiconductor chip arranged on the substrate. The optical semiconductor chip has an optically active region, a first optically non-active region, and a second optically non-active region. A connection structure connects a chip-side electrical connection to the optically active region. An electrical connection connects the chip-side electrical connection to a second substrate-side electrical connection. A coating is provided in a layer stack in the optically active region, in the first optically non-active region, and in the second optically non-active region. The layer stack includes a first layer and a second layer arranged above the first layer. The chip-side electrical connection and the connection structure in the first optically non-active region and the protective layer in the second optically non-active region are each arranged between the first layer and the second layer.
    Type: Application
    Filed: June 2, 2021
    Publication date: December 30, 2021
    Applicant: First Sensor AG
    Inventors: Martin Wilke, Sabine Friedrich, Stephan Dobritz