Patents by Inventor Sabine Pichler-Wilhem

Sabine Pichler-Wilhem has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for the packaging of optical or optoelectronic components, and optical or optoelectronic package element producible according to the method
    Publication number: 20080012109
    Abstract: The invention relates to a method for producing package parts for optical or optoelectronic components. To this end a metal package element is bonded to a transparent package element by means of a glass solder ring, the glass solder being brought in contact with the metal package element and the transparent package element, and the metal package element being inductively heated by an alternating electromagnetic field generated by an induction coil, so that the glass solder is heated and fused in contact with the metal package element and a hermetic, preferably ring-shaped bond between the metal package element and the transparent package element being produced by fusing and subsequently solidifying the glass solder.
    Type: Application
    Filed: July 2, 2007
    Publication date: January 17, 2008
    Applicant: SCHOTT AG
    Inventors: Joern Besinger, Sabine Pichler-Wilhem, Dieter Goedeke, Luise Sedlmeier