Patents by Inventor Sachie Yamada

Sachie Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Head suspension and method of manufacturing the head suspension with particular electrical connection arrangement between a piezoelectric element and a wiring member
    Patent number: 8416536
    Abstract: A head suspension has a base, a piezoelectric element, a load beam, and a wiring member to supply electric power to the piezoelectric element so that the piezoelectric element deforms to move the load beam relative to the base. The wiring member has a conductive base layer, an insulating layer, and a wiring layer layered in this order. The wiring layer has a wiring electrode. The piezoelectric element has an element electrode. A through hole is formed through the conductive base layer and insulating layer, to expose the wiring electrode to the element electrode. A projection is formed on at least one of the wiring electrode and element electrode, to face the other electrode through the through hole. The projection brings the electrodes into contact with each other and a conductive adhesive joins the electrodes and together.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: April 9, 2013
    Assignee: NHK Spring Co., Ltd.
    Inventors: Hideki Fuchino, Sachie Yamada
  • HEAD SUSPENSION AND METHOD OF MANUFACTURING HEAD SUSPENSION
    Publication number: 20110141624
    Abstract: A head suspension has a base, a piezoelectric element, a load beam, and a wiring member to supply electric power to the piezoelectric element so that the piezoelectric element deforms to move the load beam relative to the base. The wiring member has a conductive base layer, an insulating layer, and a wiring layer layered in this order. The wiring layer has a wiring electrode. The piezoelectric element has an element electrode. A through hole is formed through the conductive base layer and insulating layer, to expose the wiring electrode to the element electrode. A projection is formed on at least one of the wiring electrode and element electrode, to face the other electrode through the through hole. The projection brings the electrodes into contact with each other and a conductive adhesive joins the electrodes and together.
    Type: Application
    Filed: December 15, 2010
    Publication date: June 16, 2011
    Applicant: NHK SPRING CO., LTD.
    Inventors: Hideki Fuchino, Sachie Yamada