Patents by Inventor Sachiho Hayama

Sachiho Hayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5919069
    Abstract: It is an object of the present invention to provide a method for assembling cathode-ray tubes, which does not require a transfer device and which yields good operating efficiency at the time of switching between models. When a cathode-ray tube is inserted into a cabinet, a suction device is inserted through an opening in the front of the cabinet in an upright position and holds the front face of the cathode-ray tube in an upright position, the cathode-ray tube is moved to a fixing position in the cabinet by relative movement of the suction device and the cabinet, the cathode-ray tube is fixed to the cabinet from the rear side of the cabinet by means of a screw fastening device, and the suction device is released from the cathode-ray tube.
    Type: Grant
    Filed: July 11, 1997
    Date of Patent: July 6, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Sachiho Hayama
  • Patent number: 4981249
    Abstract: An automatic jet soldering apparatus comprising: a solder bath for holding molten solder therein; a nozzle body having an open top and an open bottom through which the molten solder rises from the solder bath; a punched panel having numerous holes and disposed inside of the nozzle body in such a way to be opened and closed; and a jet source connected to the lower part of the nozzle body, the molten solder rising upward through the nozzle body via the open bottom and the open top of the nozzle body by means of jet power from the jet source. The soldering apparatus further comprises a back rectifying plate mounted on the rear portion of the top opening of the nozzle body, the sloping angle of the back rectifying plate being adjustable, thereby attaining an easy removal of solder residues from the punched panel and achieving a zero relative speed between a printed circuit board and the solder flow velocity, so that the reliability of soldering can be enhanced.
    Type: Grant
    Filed: August 30, 1989
    Date of Patent: January 1, 1991
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yasuji Kawashima, Kazuo Nishibori, Yasuhiro Morita, Sachiho Hayama