Abstract: A conductive pattern formation ink which can be stably ejected in the form of liquid droplets and form a conductive pattern having high reliability, a conductive pattern having high reliability, and a wiring substrate provided with the conductive pattern and having high reliability are provided. The conductive pattern formation ink is used for forming a conductive pattern by ejecting the ink in the form of liquid droplets on a surface of a ceramic molded body using a liquid droplet ejecting method, the ceramic molded body being made of a material containing ceramic particles and a binder. The ink contains a water-based dispersion medium, and metal particles dispersed in the water-based dispersion medium, wherein the water-based dispersion medium contains oxygen molecules and nitrogen molecules, and wherein when the water-based dispersion medium is analyzed using a gas chromatography method, a total amount of the oxygen and nitrogen molecules contained in the water-based dispersion medium is 12 ppm or less.

Abstract: A conductive pattern forming ink for forming a conductive pattern on a substrate by a droplet discharge method includes: metal particles; an aqueous dispersion medium in which the metal particles are dispersed; xylitol; and a polyglycerol compound having a polyglycerol skeleton. H shown in the following formula (I) is 0.10 to 0.70, and H = OH ? ( A ) Mw ? ( A ) ? X ? ( A ) + OH ? ( B ) Mw ? ( B ) ? X ? ( B ) Formula ? ? ( I ) OH(A) represents an average number of hydroxyl groups in one molecule of the polyglycerol compound, Mw(A) represents a weight-average molecular weight of the polyglycerol compound, X(A) represents a content of the polyglycerol compound in the conductive pattern forming ink in weight percent; and OH(B) represents the number of hydroxyl groups in one molecule of the xylitol, Mw(B) represents a molecular weight of the xylitol, and X(B) represents a content of the xylitol in the conductive pattern forming ink in weight percent.

Abstract: A conductive pattern formation ink capable of producing a conductive pattern with reduced likelihood of generation of cracks, a conductive pattern which is small in the number of cracks generated, low in specific resistance and superior in high-frequency characteristics, and a wiring substrate provided with the conductive pattern which is small in the number of cracks generated, low in specific resistance and superior in high-frequency characteristics are provided. The conductive pattern formation ink is used for forming a conductive pattern on a base member by patterning and comprised of a dispersion solution. The dispersion solution includes a solvent, metal particles dispersed in the solvent, and an anti-cracking agent contained in the solvent, wherein the anti-cracking agent is contained for preventing generation of cracks in the conductive pattern during desolvation of the solvent.

Abstract: A conductive pattern formation ink which can be stably ejected in the form of liquid droplets and form a conductive pattern having high reliability, a conductive pattern having high reliability, and a wiring substrate provided with the conductive pattern and having high reliability are provided. The conductive pattern formation ink is used for forming a conductive pattern by ejecting the ink in the form of liquid droplets on a surface of a ceramic molded body using a liquid droplet ejecting method, the ceramic molded body being made of a material containing ceramic particles and a binder. The ink contains a water-based dispersion medium, and metal particles dispersed in the water-based dispersion medium, wherein the water-based dispersion medium contains oxygen molecules and nitrogen molecules, and wherein when the water-based dispersion medium is analyzed using a gas chromatography method, a total amount of the oxygen and nitrogen molecules contained in the water-based dispersion medium is 12 ppm or less.

Abstract: A conductive pattern forming ink for forming a conductive pattern on a substrate by a droplet discharge method includes: metal particles; an aqueous dispersion medium in which the metal particles are dispersed; xylitol; and a polyglycerol compound having a polyglycerol skeleton. H shown in the following formula (I) is 0.10 to 0.70, and H = OH ? ( A ) Mw ? ( A ) ? X ? ( A ) + OH ? ( B ) Mw ? ( B ) ? X ? ( B ) Formula ? ? ( I ) OH(A) represents an average number of hydroxyl groups in one molecule of the polyglycerol compound, Mw(A) represents a weight-average molecular weight of the polyglycerol compound, X(A) represents a content of the polyglycerol compound in the conductive pattern forming ink in weight percent; and OH(B) represents the number of hydroxyl groups in one molecule of the xylitol, Mw(B) represents a molecular weight of the xylitol, and X(B) represents a content of the xylitol in the conductive pattern forming ink in weight percent.

Abstract: A conductive pattern formation ink which can be stably ejected from a liquid droplet ejection head, a conductive pattern having high reliability, and a wiring substrate provided with the conductive pattern and having high reliability are provided. The conductive pattern formation ink is used for forming a conductive pattern on a base member using a liquid droplet ejecting method and comprised of a dispersion solution. The dispersion solution includes a water-based dispersion medium, metal particles dispersed in the water-based dispersion medium, and a drying suppressant contained in the water-based dispersion medium, the drying suppressant being contained for preventing drying of the dispersion solution.

Abstract: A conductive pattern formation ink capable of producing a conductive pattern with reduced likelihood of generation of cracks, a conductive pattern which is small in the number of cracks generated, low in specific resistance and superior in high-frequency characteristics, and a wiring substrate provided with the conductive pattern which is small in the number of cracks generated, low in specific resistance and superior in high-frequency characteristics are provided. The conductive pattern formation ink is used for forming a conductive pattern on a base member by patterning and comprised of a dispersion solution. The dispersion solution includes a solvent, metal particles dispersed in the solvent, and an anti-cracking agent contained in the solvent, wherein the anti-cracking agent is contained for preventing generation of cracks in the conductive pattern during desolvation of the solvent.

Abstract: A cooking apparatus for heating food to be served and capable of being operated with utmost simplicity without using and choosing various cooking-mode selection keys so as to achieve superb ease-of-operation. The cooking apparatus includes a cooking chamber for placing and storing food to be heated by the apparatus and a detector for detecting a state of a door attached to the cooking chamber, the door being freely openable and closable against an opening portion of the cooking chamber. An optical sensor, having a plurality of light emitting portions is disposed in a side of the cooking chamber and a plurality of light receiving portions are disposed counter to the light emitting portions. A drive unit is provided for driving the optical sensor and a judgement unit verifies and determines a cooking mode suitable for the food placed in the cooking chamber responsive to a signal from the optical sensor, where the drive unit is activated when the detector detects that the door is closed.

Abstract: A heating cooker includes a cooking chamber having a heater for heating food, a gas sensor for detecting the quantity of vapor evaporating from the food heated in the cooking chamber, a temperature sensor for detecting a temperature in the cooking chamber, and a controller for determined the kind of the food according to the quantity of vapor detected by the gas sensor, and for controlling the heating temperature and heating time of the heater according to the kind of food which has been determined.