Abstract: A light-emitting device having high heat resistance in a manufacturing process is provided.

Abstract: A light-emitting device with a high resolution and favorable characteristics manufactured by a photolithography method is provided. In the light-emitting device, a first light-emitting device and a second light-emitting device are adjacent each other. The first light-emitting device includes a first EL layer, and the second light-emitting device includes a second EL layer. The first EL layer includes at least a first light-emitting layer and a first electron-transport layer, and the second EL layer includes at least a second light-emitting layer and a second electron-transport layer. The first electron-transport layer contains a first heteroaromatic compound and a first organic compound, and the second electron-transport layer contains a second heteroaromatic compound and a second organic compound.

Abstract: A light-emitting device with high heat resistance in a manufacturing process is to be provided.

Abstract: A light-emitting device with high heat resistance in a manufacturing process is to be provided.

Abstract: A novel mixed material with improved resistance is provided. The mixed material includes a first heteroaromatic compound and a second heteroaromatic compound, and the first heteroaromatic compound is represented by any one of General Formulae (G1) to (G6). The second heteroaromatic compound is not represented by the same general formula as that of the first heteroaromatic compound.

Abstract: A light-emitting device, an electronic device, or a lighting device with low power consumption and high reliability is provided. The light-emitting device includes a first light-emitting element, a second light-emitting element, a third light-emitting element, and a fourth light-emitting element. The first to fourth light-emitting elements include the same EL layer between an anode and a cathode. The EL layer includes a first light-emitting layer and a second light-emitting layer. The first light-emitting layer contains a fluorescent substance. The peak wavelength of an emission spectrum of the fluorescent substance in a toluene solution of the fluorescent substance is 440 nm to 460 nm, preferably 440 nm to 455 nm. The second light-emitting layer contains a phosphorescent substance. The first light-emitting element exhibits blue emission. The second light-emitting element exhibits green emission. The third light-emitting element exhibits red emission.

Abstract: An endoscopic device generates an endoscopic image based on an image pickup signal generated by an image pickup device at a distal-end portion of an insertion portion, acquires channel information regarding a channel formed in the insertion portion, acquires angle information regarding a display angle of the endoscopic image, and generates and outputs a display image including a display endoscopic image generated based on modifying the endoscopic image based on the angle information, and a channel guide image generated based on the angle information and the channel information.

Abstract: An endoscope system includes an endoscope including at least one switch, each of which can be assigned two functions, and a controller. The controller sets a plurality of function pairs, each of which is composed of a combination of any one of a plurality of first functions and any one of a plurality of second functions, and assigns one function pair selected from the plurality of function pairs to the switch, measures a switch pressing time period after the switch is pressed, and executes the first function when the switch pressing is released before a predetermined first time period elapses after the switch is pressed and executes the second function when the switch pressing time period passes the first time period.

Abstract: A ruthenium compound from which high-quality film-like metal ruthenium can be obtained and a process for producing a metal ruthenium film from the ruthenium compound by chemical vapor deposition.

Abstract: A ruthenium compound from which high-quality film-like metal ruthenium can be obtained and a process for producing a metal ruthenium film from the ruthenium compound by chemical vapor deposition. The ruthenium compound as a material for chemical vapor deposition is represented by the following formula (1), for example.

Abstract: A chemical vapor deposition material comprising a ruthenium compound having a ligand represented by the following formula: wherein R1, R2 and R3 are each independently a hydrogen atom, fluorine atom, trifluoromethyl group or hydrocarbon group having 1 to 10 carbon atoms, and a method of forming a ruthenium film from the chemical vapor deposition material by chemical vapor deposition. A high-quality ruthenium film even when it is very thin can be obtained.

Abstract: A chemical vapor deposition material comprising a ruthenium compound having a ligand represented by the following formula: wherein R1, R2 and R3 are each independently a hydrogen atom, fluorine atom, trifluoromethyl group or hydrocarbon group having 1 to 10 carbon atoms, and a method of forming a ruthenium film from the chemical vapor deposition material by chemical vapor deposition. A high-quality ruthenium film even when it is very thin can be obtained.

Abstract: A composition for forming a coating film, comprising a reaction product of a tantalum alkoxide and at least one compound selected from carbamic acid, carboxylic acid and carboxylic anhydride and a solvent. A tantalum oxide film is obtained by forming a coating film of this composition and thermally and/or optically treating the coating film. This tantalum oxide film has a large dielectric constant and a small leak current.

Abstract: A composition for forming a high-quality tantalum film which is advantageously used as an capacitor insulating film and a process for forming the high-quality tantalum film. The composition for forming a tantalum oxide film, which comprises at least one tantalum compound selected from the group consisting of a reaction product of a compound capable of reacting with a tantalum alkoxide and a tantalum alkoxide and a hydrolyzate of the reaction product, and a solvent, and the process for forming the tantalum oxide film by applying this composition to a substrate and heating it.