Patents by Inventor Sachiko Ishikawa
Sachiko Ishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7930371Abstract: A deployment method and system in the OS deployment software are disclosed in which the deployment is possible to server units having various hardware configurations. In a computer system, a disk image of a deployer server unit is managed by a management server and a deployee server unit is connected to the management server through a network. The hardware configuration information of the deployer server unit and a hardware configuration tolerance list obtained from a driver information file in the disk image are held in the disk image. In response to a deployment instruction from the user, the management server compares the hardware configuration of the deployer server unit with that of the deployee server unit, and by detecting the difference therebetween, changes the deployment method in accordance with the detected difference.Type: GrantFiled: February 28, 2008Date of Patent: April 19, 2011Assignee: Hitachi, Ltd.Inventors: Yusuke Furuyama, Yoshifumi Takamoto, Keisuke Hatasaki, Sachiko Ishikawa
-
Publication number: 20090283013Abstract: Diamond fine particles having porous structure known in a high thermal resistance and low dielectric constant film has a high thermal conductivity and is expected as an insulating film for multiplayer wirings of a semiconductor integrated circuit device. A liquid composition of diamond fine particles, which are raw material of the film, is unstable as colloid, resulting in low reproducibility and yield in the production of films. It becomes possible to impart a very low viscosity and improved stability to the colloid liquid composition of diamond fine particles by containing a small amount of amine. If necessary, a thickener may be used to adjust the viscosity appropriately, so that various kinds of application systems can be used. A low dielectric constant film having a relative dielectric constant of about 2.5 can be thus obtained. Further, the liquid composition may be utilized as an abrasive for finishing.Type: ApplicationFiled: July 17, 2009Publication date: November 19, 2009Applicants: Rorze Corporation, Daiken Chemical Co., Ltd.Inventors: Takayuki Takahagi, Hiroyuki Sakaue, Shoso Shingubara, Hiroyuki Tomimoto, Toshio Sakurai, Masahiko Uchiyama, Sachiko Ishikawa
-
Publication number: 20090132683Abstract: A deployment method and system in the OS deployment software are disclosed in which the deployment is possible to server units having various hardware configurations. In a computer system, a disk image of a deployer server unit is managed by a management server and a deployee server unit is connected to the management server through a network. The hardware configuration information of the deployer server unit and a hardware configuration tolerance list obtained from a driver information file in the disk image are held in the disk image. In response to a deployment instruction from the user, the management server compares the hardware configuration of the deployer server unit with that of the deployee server unit, and by detecting the difference therebetween, changes the deployment method in accordance with the detected difference.Type: ApplicationFiled: February 28, 2008Publication date: May 21, 2009Inventors: Yusuke FURUYAMA, Yoshifumi Takamoto, Keisuke Hatasaki, Sachiko Ishikawa
-
Publication number: 20070107317Abstract: Diamond fine particles having porous structure known in a high thermal resistance and low dielectric constant film has a high thermal conductivity and is expected as an insulating film for multiplayer wirings of a semiconductor integrated circuit device. A liquid composition of diamond fine particles, which are raw material of the film, is unstable as colloid, resulting in low reproducibility and yield in the production of films. It becomes possible to impart a very low viscosity and improved stability to the colloid liquid composition of diamond fine particles by containing a small amount of amine. If necessary, a thickener may be used to adjust the viscosity appropriately, so that various kinds of application systems can be used. A low dielectric constant film having a relative dielectric constant of about 2.5 can be thus obtained. Further, the liquid composition may be utilized as an abrasive for finishing.Type: ApplicationFiled: October 21, 2004Publication date: May 17, 2007Applicants: JAPAN SCIENCE AND TECHNOLOGY AGENCY, RORZE CORPORATION, DAIKEN CHEMICAL CO., LTD.Inventors: Takayuki Takahagi, Hiroyuki Sakaue, Shoso Shingubara, Hiroyuki Tomimoto, Toshio Sakurai, Masahiko Uchiyama, Sachiko Ishikawa
-
Patent number: 5191347Abstract: A pulsed Doppler radar system comprises a transmitter for generating and transmitting a pulse signal having expanded frequency bandwidth, an antenna apparatus for sending the output of the transmitter to a target and for receiving a signal which was sent by the transmitter and reflected by the target, a receiver for processing the received signal to obtain a complex video signal, a pulse compressing circuit including a pulse Doppler processor responsive to the complex video signal for detecting a relative speed of the target and a storage device for storing a reference signal which includes a compensation factor by which an influence of the Doppler effect is compensated in accordance with the speed of the target.Type: GrantFiled: August 28, 1991Date of Patent: March 2, 1993Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Sachiko Ishikawa, Takahiko Fujisaka, Yoshimasa Oh-hashi
-
Patent number: 4929044Abstract: An optical pickup comprises at least a semiconductor laser, a waveguide optically coupled with the semiconductor laser for propagating therein a light from the semiconductor to guide it to a recording medium and a light deflector element provided on the waveguide for deflecting the light propagated in the waveguide by means of a surface acoustic wave. A multi-mode oscillation laser capable of stably operating in longitudinal modes the number of which is not larger than 5 is used as the semiconductor laser. The semiconductor laser is disposed in proximity to the waveguide at a distance not larger than 1 .mu.m, thereby inputting the light from the semiconductor laser into the waveguide with a high efficiency. A frequency applied to the light deflector element may be changed upon change between a read-out state and a write-in state so that a light spot on the recording medium is held at a predetermined position (track or address).Type: GrantFiled: May 13, 1988Date of Patent: May 29, 1990Assignee: Hitachi, Ltd.Inventors: Akira Arimoto, Sachiko Ishikawa, Keiji Kataoka
-
Patent number: 4861128Abstract: An optical pickup comprising a semiconductor laser, a first waveguide for leading light emitted by the semiconductor laser to recording medium and coupling again light returning from the recording medium; splitting element for separating the light returning from the recording medium from the first waveguide path; and a second waveguide propagating light returning from the recording medium and separated by the splitting element; wherein light going towards the recording medium and light returning from the recording medium propagate separately in the first and the second waveguide so that the utilization efficiency of the light is increased.Type: GrantFiled: February 3, 1988Date of Patent: August 29, 1989Assignee: Hitachi, Ltd.Inventors: Sachiko Ishikawa, Akira Arimoto
-
Patent number: 4735835Abstract: Disclosed is a welded can having at least the inner face side of a weld seam covered with a composite film of a thermoplastic resin, wherein the thermoplastic resin composite film comprises (I) an innermost layer, located on the inner face side of the can, of a thermoplastic polyester having a molecularly oriented crystal and comprising a dibasic acid component content of at least 90 mole % of terephthalic acid and a diol component containing at least 90 mole % of ethylene glycol, said innermost layer (I) overlayer (II) a seam-contacting layer, located on the seam side, of a thermoplastic copolyester containing in the chain molecule a dibasic acid component containing 40 to 95 mole % of terephthalic acid and 0 to 40 mole % of isophthalic acid and a diol component containing ethylene glycol and butane diol in a total amount of 65 to 100 mole % at a molar ratio of from 5/95 and 80/20 or a blend of such copolyesters, and the composite film comprising the layers (I) and (II) has an elasticity modulus of 5 to 220Type: GrantFiled: September 2, 1986Date of Patent: April 5, 1988Assignee: Toyo Seikan Kaisha, Ltd.Inventors: Kazuo Taira, Sachiko Ishikawa, Hisakazu Yasumuro, Kenji Matsuno, Hiroshi Matsubayashi