Abstract: There is provided a crystalline polylactic acid resin composition comprising 95 to 99.97 parts by mass of a polylactic acid resin (A) having a D-isomer content of not greater than 0.6 mol % or not less than 99.4 mol %, and 0.03 to 5 parts by mass of a crystal nucleus agent (B). There is also provided a crystalline polylactic acid resin composition prepared by melt-kneading 100 parts by mass of a polylactic acid resin (A) having a D-isomer content of not greater than 0.6 mol % or not less than 99.4 mol %, 0.01 to 20 parts by mass of a (meth)acrylate compound (C), and 0.02 to 20 parts by mass of a peroxide (D).

Abstract: Disclosed is a resin composition including a thermoplastic resin (A), a glass fiber (B) having a ratio of the major axis to the minor axis of the fiber cross section of 1.5 to 10 and a flame retardant (C), wherein the mass ratio (A/B) of the thermoplastic resin (A) to the glass fiber (B) is 30/70 to 95/5, and a part or the whole of the thermoplastic resin (A) is composed of a polyamide 11 resin (A1a) or/and a polyamide 1010 resin (A1b); and the resin composition includes 10 parts by mass or more of the polyamide 11 resin (A1a) or/and the polyamide 1010 resin (A1b) and 5 to 40 parts by mass of the flame retardant (C) in relation to 100 parts by mass of the total amount of the thermoplastic resin (A) and the glass fiber (B).

Abstract: There is provided a crystalline polylactic acid resin composition comprising 95 to 99.97 parts by mass of a polylactic acid resin (A) having a D-isomer content of not greater than 0.6 mol % or not less than 99.4 mol %, and 0.03 to 5 parts by mass of a crystal nucleus agent (B). There is also provided a crystalline polylactic acid resin composition prepared by melt-kneading 100 parts by mass of a polylactic acid resin (A) having a D-isomer content of not greater than 0.6 mol % or not less than 99.4 mol %, 0.01 to 20 parts by mass of a (meth)acrylate compound (C), and 0.02 to 20 parts by mass of a peroxide (D).

Abstract: The present invention is to provide an aqueous resin dispersion containing polyester resin having a low acid value and a high-molecular weight that is excellent in storage stability and can form a resin film superior in film properties such as adhesiveness to base materials, water resistance, solvent resistance, processability, and the like, and a process for producing the same. The present invention relates to a polyester resin aqueous dispersion, comprising: a polyester resin (A) having an acid value of 2 mg KOH/g or more and less than 8 mg KOH/g and a number-average molecular weight of 5,000 or more; a basic compound (B); and water (C), wherein the content of the polyester resin (A) is 1 to 70 percent by mass, the content of water (C) is 10 percent by mass or more, and no surfactant is contained, and a process for producing the polyester resin aqueous dispersion by phase-inversion emulsification, wherein the phase-inversion emulsification is carried out at a temperature of 40° C. or lower.

Abstract: The present invention is to provide an aqueous dispersion of polyester resin with an excellent molecular weight stability, its production method, and an aqueous coating composition. An aqueous dispersion of polyester resin having an acid value of 8 to 40 mg KOH/g and a weight average molecular weight of 9,000 or more contains an organic solvent less than 0.5% by mass. A method for producing the aqueous dispersion of polyester resin comprising a step of at first obtaining an aqueous dispersion of polyester resin containing not lower than 0.5% by mass of an organic solvent by adding the polyester resin and a basic compound to an aqueous medium to make the resulting mixture aqueous and a step of removing the organic solvent from the aqueous dispersion. An aqueous coating composition can be obtained by adding a curing agent to the foregoing aqueous dispersion of polyester resin.

Abstract: The present invention provides a polyamide resin composition in which silicate layers originating from a layered silicate and having the below-described property {circle around (1)} are uniformly dispersed on a molecular level in a polyamide resin to accomplish high strength, high modulus, high heat resistance, high toughness, excellent dimensional stability, and high tensile elongation with a small deviation. {circle around (1)}: average particle size from a photograph observation of transmission electron microscopy is 0.1 &mgr;m or less and not including a maximum particle size of 30 &mgr;m or higher.

Abstract: A polyamide resin composition comprising a copolyamide and silicate layers originating from a swellable fluoromica, dispersed in said copolyamide on a molecular level, wherein an average thickness and an average aspect ratio (length/thickness) of the silicate layers are within specific ranges. Also disclosed is a process for preparing the polyamide resin composition.

Abstract: A polyamide resin composition comprising (A) a reinforced polyamide resin which comprises 100 parts by weight of a nylon 6 homopolymer or copolymer and 1 to 20 parts by weight of a layered silicate uniformly dispersed in the polymer on the molecular level and (B) a non-reinforced polyamide resin, a test specimen of said composition having a tensile weld strength of 45 MPa or higher and a flexural modulus of 4 GPa or higher.