Abstract: There is provided a semiconductor device capable of equalizing a chip temperature while suppressing variation in electrical stress applied to each circuit at the time of a burn-in test. A semiconductor device according to one embodiment includes a current adjustment circuit capable of adjusting a current amount flowing in the current adjustment circuit itself, a flash memory for storing an adjustment amount of the current adjustment circuit, and a control circuit for controlling the current amount flowing in the current adjustment circuit in accordance with the adjustment amount when a burn-in mode signal indicating a burn-in mode is supplied.