Patents by Inventor Sachiko Sano

Sachiko Sano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed wiring board unit, auxiliary substrate for hierarchical mounting, and electronic apparatus
    Patent number: 6717824
    Abstract: A rectangular frame-like auxiliary substrate for hierarchical mounting 14 is mounted so as to surround a semiconductor component 15 mounted on a printed wiring board 11, and another semiconductor component 16 is mounted above the semiconductor component 15, being supported on the auxiliary substrate for hierarchical mounting 14 with terminals of the semiconductor component 16 being connected thereto. The auxiliary substrate for hierarchical mounting 14 has wiring patterns 35a and through holes 34a, and includes a power supply layer 32 and a ground layer 33 inside thereof with printed wiring board pads on a lower surface of the auxiliary substrate for hierarchical mounting 14 being more dispersed than component pads 23a on an upper surface of the auxiliary substrate for hierarchical mounting 14.
    Type: Grant
    Filed: November 30, 2001
    Date of Patent: April 6, 2004
    Assignee: Fujitsu Limited
    Inventors: Takashi Miyajima, Sachiko Sano
  • Printed wiring board unit, auxiliary substrate for hierarchical mounting, and electronic apparatus
    Publication number: 20020054486
    Abstract: A rectangular frame-like auxiliary substrate for hierarchical mounting 14 is mounted so as to surround a semiconductor component 15 mounted on a printed wiring board 11, and another semiconductor component 16 is mounted above the semiconductor component 15, being supported on the auxiliary substrate for hierarchical mounting 14 with terminals of the semiconductor component 16 being connected thereto. The auxiliary substrate for hierarchical mounting 14 has wiring patterns 35a and through holes 34a, and includes a power supply layer 32 and a ground layer 33 inside thereof with printed wiring board pads on a lower surface of the auxiliary substrate for hierarchical mounting 14 being more dispersed than component pads 23a on an upper surface of the auxiliary substrate for hierarchical mounting 14.
    Type: Application
    Filed: November 30, 2001
    Publication date: May 9, 2002
    Applicant: Fujitsu Limited
    Inventors: Takashi Miyajima, Sachiko Sano