Abstract: A filter includes: a substrate; input and output terminals located on the substrate; a resonant circuit located in a series pathway between the input and output terminals; a first component including a first inductor, which is electrically connected between a first node in the series pathway and a ground, and mounted in a first region on the substrate; a second component including a second inductor, which is electrically connected between a second node different from the first node in the series pathway and a ground, and mounted in a second region different from the first region on the substrate; and a third component including an acoustic wave resonator, which is electrically connected between a third node between the first and second nodes in the series pathway and a ground, and mounted in a third region between the first and second regions on the substrate.

Abstract: A filter includes: a substrate; input and output terminals located on the substrate; a resonant circuit located in a series pathway between the input and output terminals; a first component including a first inductor, which is electrically connected between a first node in the series pathway and a ground, and mounted in a first region on the substrate; a second component including a second inductor, which is electrically connected between a second node different from the first node in the series pathway and a ground, and mounted in a second region different from the first region on the substrate; and a third component including an acoustic wave resonator, which is electrically connected between a third node between the first and second nodes in the series pathway and a ground, and mounted in a third region between the first and second regions on the substrate.

Abstract: A filter circuit includes: a first element that is a first capacitor or a first inductor connected in series between input and output terminals; a second element that is connected in parallel to the first element between the input and output terminals, is a second inductor when the first element is the first capacitor, and is a second capacitor when the first element is the first inductor; a third element that is connected in parallel to the first element and in series with the second element between the input and output terminals, is a third inductor when the first element is the first capacitor, and is a third capacitor when the first element is the first inductor; and an acoustic wave resonator having a first end coupled to a first node between the second element and the third element and a second end coupled to a ground terminal.

Abstract: A filter circuit includes: a first element that is a first capacitor or a first inductor connected in series between input and output terminals; a second element that is connected in parallel to the first element between the input and output terminals, is a second inductor when the first element is the first capacitor, and is a second capacitor when the first element is the first inductor; a third element that is connected in parallel to the first element and in series with the second element between the input and output terminals, is a third inductor when the first element is the first capacitor, and is a third capacitor when the first element is the first inductor; and an acoustic wave resonator having a first end coupled to a first node between the second element and the third element and a second end coupled to a ground terminal.

Abstract: An electronic device includes: a first substrate, a first function part in its first surface, an adhesive layer on the first surface so as to surround the first function part, a second substrate bonded to the first substrate by the adhesive layer to form a gap between the first and second substrates, a first via interconnection piercing the first substrate to connect the first surface and an opposite second surface, a second via interconnection piercing the second substrate to connect a third surface of the second substrate opposite to the first substrate and a fourth surface opposite to the third surface, a first terminal provided on the second surface and connected to the first via interconnection, a second terminal provided on the fourth surface and connected to the second via interconnection. The first function part is connected to at least one of the first and second via interconnections.

Abstract: A circuit substrate includes: a laminate substrate in which a conductive layer and an insulating layer are laminated; a filter chip that has an acoustic wave filter and is provided inside of the laminate substrate; and an active component that is provided on a surface of the laminate substrate and is connected with the filter chip, at least a part of the active component overlapping with a projected region that is a region of the filter chip projected in a thickness direction of the laminate substrate.

Abstract: An electronic device includes: a first substrate, a first function part in its first surface, an adhesive layer on the first surface so as to surround the first function part, a second substrate bonded to the first substrate by the adhesive layer to form a gap between the first and second substrates, a first via interconnection piercing the first substrate to connect the first surface and an opposite second surface, a second via interconnection piercing the second substrate to connect a third surface of the second substrate opposite to the first substrate and a fourth surface opposite to the third surface, a first terminal provided on the second surface and connected to the first via interconnection, a second terminal provided on the fourth surface and connected to the second via interconnection. The first function part is connected to at least one of the first and second via interconnections.

Abstract: A circuit substrate includes: a laminate substrate in which a conductive layer and an insulating layer are laminated; a filter chip that has an acoustic wave filter and is provided inside of the laminate substrate; and a chip component that is provided on a surface of the laminate substrate and is connected to the filter chip, at least a part of the chip component overlapping with a projected region that is a region of the filter chip projected in a thickness direction of the laminate substrate.

Abstract: A circuit substrate includes: a laminate substrate in which a conductive layer and an insulating layer are laminated; a filter chip that has an acoustic wave filter and is provided inside of the laminate substrate; and a chip component that is provided on a surface of the laminate substrate and is connected to the filter chip, at least a part of the chip component overlapping with a projected region that is a region of the filter chip projected in a thickness direction of the laminate substrate.

Abstract: A semiconductor device having a substrate; an emitter electrode or source electrode formed on the top surface side of the substrate; a gate electrode formed on the top surface side of the substrate; and a collector electrode or drain electrode formed on the bottom surface side of the substrate. The device includes an insulating region formed so as to surround a device-forming region provided on the top surface side of the substrate; and a drift region of the device-forming region, the drift region being in contact with the insulating region, is formed of a semiconductor layer having the same conduction type as that of a channel formed through application of an electric potential to the gate electrode. The gate electrode is a trench gate. An outer peripheral portion of the emitter electrode or source electrode extends in a width of 20 ?m or more over the top surface of the insulating region.

Abstract: A semiconductor device having a substrate; an emitter electrode or source electrode formed on the top surface side of the substrate; a gate electrode formed on the top surface side of the substrate; and a collector electrode or drain electrode formed on the bottom surface side of the substrate. The device includes an insulating region formed so as to surround a device-forming region provided on the top surface side of the substrate; and a drift region of the device-forming region, the drift region being in contact with the insulating region, is formed of a semiconductor layer having the same conduction type as that of a channel formed through application of an electric potential to the gate electrode. The gate electrode is a trench gate. An outer peripheral portion of the emitter electrode or source electrode extends in a width of 20 ?m or more over the top surface of the insulating region.

Abstract: A direct conversion receiver is disclosed wherein a received RF signal is mixed in a mixer with a local oscillation signal having a frequency the same as a desired central frequency, and is down-converted to a base band signal. The receiver comprises a divider for dividing the received RF signal; an adder provided at a received RF signal input side of the mixer; a phase shifter provided before the input of the mixer, for shifting a phase of the divided signal of the received RF signal; and a gain adjustable amplifier provided after the divider, and before or after the phase shifter, for amplifying the divided signal to supply the phase-shifted and amplified signal to the adder. Accordingly a DC offset due to the direct conversion can be removed and an adverse effect due to transient response when the DC offset changes can be prevented.

Abstract: A direct conversion receiver is disclosed wherein a received RF signal is mixed in a mixer with a local oscillation signal having a frequency the same as a desired central frequency, and is down-converted to a base band signal. The receiver comprises a divider for dividing the received RF signal; an adder provided at a received RF signal input side of the mixer; a phase shifter provided before the input of the mixer, for shifting a phase of the divided signal of the received RF signal; and a gain adjustable amplifier provided after the divider, and before or after the phase shifter, for amplifying the divided signal to supply the phase-shifted and amplified signal to the adder. Accordingly a DC offset due to the direct conversion can be removed and an adverse effect due to transient response when the DC offset changes can be prevented.

Abstract: There is provided a gene encoding a protein that has an activity of regulating the pH of vacuoles, for example a gene derived from morning glory encoding a protein that has the amino acid sequence as set forth in SEQ ID NO: 2. By introducing this gene into a plant, the flower color can be regulated via the control of the pH of vacuoles.

Abstract: In a method for producing eggs with improved flavor, hen poultry are fed a feed containing nutmeg and/or cinnamon. Eggs obtained from the poultry and foods produced from the eggs have an improved taste.