Patents by Inventor Sachin Bedare
Sachin Bedare has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11551891Abstract: Particular embodiments described herein provide for an electronic device that can include a key height activation engine and a keyboard. The keyboard can include a plurality of keys and one or more of the plurality of keys can include a key height mechanism. The key height mechanism includes a shape memory material and when the key height mechanism is activated by the key height activation engine, the shape memory material raises the one or more of the plurality of keys that includes the key height mechanism from a first height to a second height.Type: GrantFiled: June 27, 2019Date of Patent: January 10, 2023Assignee: Intel CorporationInventors: Prakash Kurma Raju, Raghavendra Doddi, Prasanna Pichumani, Sachin Bedare, Bijendra Singh, Gopinath Kandasamy
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Publication number: 20220376623Abstract: A computing system having a high-performance battery pack (e.g., 3S, 4S battery packs) coupled to a voltage regulator and logic to control an input supply of the voltage regulator. The logic determines the context of usage of the computing device (or user attentiveness) and either dynamically bypasses the voltage regulator to provide the voltage from the high-performance battery pack directly to various components of the computing system, or dynamically engages devices of the voltage regulator to provide a lower supply voltage to the various components of the computing system.Type: ApplicationFiled: May 18, 2021Publication date: November 24, 2022Applicant: Intel CorporationInventors: Jagadish Singh, Tarakesava Reddy Koki, Mallari C. Hanchate, Anoop Parchuru, Praveen Kashyap Ananta Bhat, Don J. Nguyen, Sachin Bedare, Raghavendra R. Rao, Vinaya Kumar Chandrasekhara, Govindaraj G.
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Publication number: 20220015273Abstract: An example electronic device is disclosed that includes a printed circuit board, an electronic component coupled to the printed circuit board, and a solderless shield coupled to the printed circuit board and covering the electronic component.Type: ApplicationFiled: September 23, 2021Publication date: January 13, 2022Inventors: Bala P. Subramanya, Prakash Kurma Raju, Navneet K. Singh, Sachin Bedare, Vijith Halestoph R.
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Patent number: 11044548Abstract: In one embodiment, a portable computing device is described. The portable computing device includes a first surface comprising at least one user interface. The portable computing device also includes a second surface opposite the first surface. Further, the portable computing device includes at least one speaker port in the first surface. Further yet, the portable computing device includes a collapsible speaker chamber configured on the second surface opposite the at least one speaker port. Moreover, the portable computing device includes a speaker configured in the portable computing device between the speaker port and the collapsible speaker chamber.Type: GrantFiled: December 26, 2019Date of Patent: June 22, 2021Assignee: Intel CorporationInventors: Samarth Alva, Sumod Cherukkate, Sachin Bedare
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Publication number: 20200322714Abstract: In one embodiment, a portable computing device is described. The portable computing device includes a first surface comprising at least one user interface. The portable computing device also includes a second surface opposite the first surface. Further, the portable computing device includes at least one speaker port in the first surface. Further yet, the portable computing device includes a collapsible speaker chamber configured on the second surface opposite the at least one speaker port. Moreover, the portable computing device includes a speaker configured in the portable computing device between the speaker port and the collapsible speaker chamber.Type: ApplicationFiled: December 26, 2019Publication date: October 8, 2020Inventors: Samarth Alva, Sumod Cherukkate, Sachin Bedare
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Patent number: 10732683Abstract: In some embodiments, power may be temporarily removed from a first portion of a computer system (such as a display), and that power redirected to a second portion (such as a processor or System on a Chip), so that extra performance may be obtained from the second portion without exceeding the power budget for the system. If the first portion is a display, the time period of removed power may be short enough that the absence of luminance during that time period will not be noticeable to the human vision system. In a similar embodiment, power may be delivered to the first portion using pulse width modulation, using the time between pulses to redirect power to the other portion.Type: GrantFiled: April 30, 2018Date of Patent: August 4, 2020Assignee: Intel CorporationInventors: Sachin Bedare, Mallari Hanchate, Praveen Kashyap Ananta Bhat, Govindaraj Gettimalli, Vijayakumar A. Dibbad
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Publication number: 20190326081Abstract: Particular embodiments described herein provide for an electronic device that can include a key height activation engine and a keyboard. The keyboard can include a plurality of keys and one or more of the plurality of keys can include a key height mechanism. The key height mechanism includes a shape memory material and when the key height mechanism is activated by the key height activation engine, the shape memory material raises the one or more of the plurality of keys that includes the key height mechanism from a first height to a second height.Type: ApplicationFiled: June 27, 2019Publication date: October 24, 2019Applicant: Intel CorporationInventors: Prakash Kurma Raju, Raghavendra Doddi, Prasanna Pichumani, Sachin Bedare, Bijendra Singh, Gopinath Kandasamy
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Patent number: 10403560Abstract: Particular embodiments described herein provide for a thermal cooling system that is part of a device that includes a hole-in-motherboard configuration. The device can include a substrate, one or more dies on a top portion of the substrate, one or more printed circuit boards below the substrate, where the printed circuit boards are coupled to the substrate with solder balls, and one or more land side capacitors below the substrate. A thermal conducting plate, phase change material, and one or more sponge walls to help insulate the solder balls from the thermal conductive layer can be located in the hole of the hole-in-motherboard configuration and help transfer heat and thermal energy away from the device.Type: GrantFiled: September 28, 2018Date of Patent: September 3, 2019Assignee: Intel CorporationInventors: Bijendra Singh, Sachin Bedare
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Patent number: 10275016Abstract: Disclosed are electrical systems and electronic devices. An electrical system includes an electronic device. The electronic device is configured to receive external power from an external power source, the external power sufficient to support normal mode operation of the electronic device. The electronic device includes control circuitry programmed to operate in the normal mode while receiving external power, and transition to one of a low power mode and a pre-shutdown mode responsive to sensor inputs. An electronic device includes an internal power source configured to provide internal power sufficient to support low power requirements of the electronic device operating in a low power mode, but not sufficient to support normal power requirements of a normal mode. The electronic device includes control circuitry programmed to transition from the low power mode to a hibernate mode while powered by only the internal power source.Type: GrantFiled: December 21, 2015Date of Patent: April 30, 2019Assignee: INTEL CORPORATIONInventors: Sachin Bedare, Ayeshwarya Mahajan
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Publication number: 20190045665Abstract: Particular embodiments described herein provide for a thermal cooling system that is part of a device that includes a hole-in-motherboard configuration. The device can include a substrate, one or more dies on a top portion of the substrate, one or more printed circuit boards below the substrate, where the printed circuit boards are coupled to the substrate with solder balls, and one or more land side capacitors below the substrate. A thermal conducting plate, phase change material, and one or more sponge walls to help insulate the solder balls from the thermal conductive layer can be located in the hole of the hole-in-motherboard configuration and help transfer heat and thermal energy away from the device.Type: ApplicationFiled: September 28, 2018Publication date: February 7, 2019Applicant: Intel CorporationInventors: Bijendra Singh, Sachin Bedare
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Publication number: 20190041931Abstract: In some embodiments, power may be temporarily removed from a first portion of a computer system (such as a display), and that power redirected to a second portion (such as a processor or System on a Chip), so that extra performance may be obtained from the second portion without exceeding the power budget for the system. If the first portion is a display, the time period of removed power may be short enough that the absence of luminance during that time period will not be noticeable to the human vision system. In a similar embodiment, power may be delivered to the first portion using pulse width modulation, using the time between pulses to redirect power to the other portion.Type: ApplicationFiled: April 30, 2018Publication date: February 7, 2019Applicant: Intel CorporationInventors: Sachin Bedare, Mallari Hanchate, Praveen Kashyap Ananta Bhat, Govindaraj Gettimalli, Vijayakumar A. Dibbad
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Publication number: 20170177069Abstract: Disclosed are electrical systems and electronic devices. An electrical system includes an electronic device. The electronic device is configured to receive external power from an external power source, the external power sufficient to support normal mode operation of the electronic device. The electronic device includes control circuitry programmed to operate in the normal mode while receiving external power, and transition to one of a low power mode and a pre-shutdown mode responsive to sensor inputs. An electronic device includes an internal power source configured to provide internal power sufficient to support low power requirements of the electronic device operating in a low power mode, but not sufficient to support normal power requirements of a normal mode. The electronic device includes control circuitry programmed to transition from the low power mode to a hibernate mode while powered by only the internal power source.Type: ApplicationFiled: December 21, 2015Publication date: June 22, 2017Applicant: INTEL CORPORATIONInventors: Sachin Bedare, Ayeshwarya Mahajan