Abstract: A system for man-machine interaction for a vehicle is disclosed. The proposed system includes an interactive reflected display on a windscreen of the vehicle; an eye tracking module including an eye gaze tracker for tracking eye gaze direction of a user, and a training unit to train the tracking module using a neural network to predict a real-time set of coordinates for eye gaze direction of the user based on a created reference data set of coordinates of the display; a finger tracking module to detect presence of a finger of the user and track movement of the finger; a cursor module configured to, on the basis of a received input, move a cursor on the display to an area of interest on the display; and a wireless switch module operatively coupled to the display for selecting a target in the area of interest on the display.

Abstract: Some embodiments provide a non-transitory machine-readable medium that stores a program. The program receives a document from a first computing system that is destined for a second computing system via a network platform. The program further identifies an integration configuration associated with the first computing system. The program also determines a document format of the document. The program further transforms the document format of the document from a first document format to a second document format based on the integration configuration. The program also sends the document in the second document format to the network platform in order for the network platform to forward the document to the second computing system.

Abstract: A multi-chip package includes multiple IC die interconnected to a package substrate. An integrated heat spreader (IHS) is located over one or more primary IC die, but is absent from over one or more secondary IC die. Thermal cross-talk between IC dies and/or thermal performance of individual IC dies may be improved by constraining the dimensions of the IHS to be over less than all IC die of the package. A first thermal interface material (TIM) may be between the IHS and the primary IC die, but absent from over the secondary IC die. A second TIM may be between a heat sink and the IHS and also between the heat sink and the secondary IC die. The heat sink may be segmented, or have a non-planarity to accommodate differences in z-height across the IC die and/or as a result of constraining the dimensions of the IHS to be over less than all IC die.

Abstract: A multi-chip package includes multiple IC die interconnected to a package substrate. An integrated heat spreader (IHS) is located over one or more primary IC die, but is absent from over one or more secondary IC die. Thermal cross-talk between IC dies and/or thermal performance of individual IC dies may be improved by constraining the dimensions of the IHS to be over less than all IC die of the package. A first thermal interface material (TIM) may be between the IHS and the primary IC die, but absent from over the secondary IC die. A second TIM may be between a heat sink and the IHS and also between the heat sink and the secondary IC die. The heat sink may be segmented, or have a non-planarity to accommodate differences in z-height across the IC die and/or as a result of constraining the dimensions of the IHS to be over less than all IC die.

Abstract: A microelectronic package may be fabricated to include a microelectronic substrate, a plurality of microelectronic devices attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one of the plurality of microelectronic devices and attached to the microelectronic substrate, and at least one offset spacer attached between the microelectronic substrate and the heat dissipation device to control the bondline thickness between the heat dissipation device and at least one of the plurality of microelectronic devices.

Abstract: A microelectronic package may be fabricated to include a microelectronic substrate, a plurality of microelectronic devices attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one of the plurality of microelectronic devices and attached to the microelectronic substrate, and at least one offset spacer attached between the microelectronic substrate and the heat dissipation device to control the bondline thickness between the heat dissipation device and at least one of the plurality of microelectronic devices.

Abstract: Some embodiments provide a non-transitory machine-readable medium that stores a program. The program receives a document from a first computing system that is destined for a second computing system via a network platform. The program further identifies an integration configuration associated with the first computing system. The program also determines a document format of the document. The program further transforms the document format of the document from a first document format to a second document format based on the integration configuration. The program also sends the document in the second document format to the network platform in order for the network platform to forward the document to the second computing system.