Abstract: A Wiring substrate includes a substrate body that is formed from ceramics, and that includes a front surface, a back surface, and side surfaces positioned between peripheral sides of the front surface and the back surface; a frame-shaped metalized layer (surface conductor portion) that is formed on the front surface of the substrate body, a surface of the frame-shaped metalized layer being covered with a metal plating film; and an electroplating conductor layer that is formed in the substrate body, an end of the electroplating conductor layer being electrically connected to the frame-shaped metalized layer, the other end of the electroplating conductor layer being formed at the front surface of the substrate body, the other end of the electroplating conductor layer being electrically independent of different conductor portions that differ from frame-shaped metalized layer, the electroplating conductor layer being separated from the side surfaces of the substrate body.

Abstract: [Object] To provide a Wiring substrate in which, even if, for example, a front surface of a ceramic substrate body is provided with an electrically independent surface conductor portion, or even if a bottom-surface side of the cavity that opens at the front surface of the substrate body is provided with a surface conductor portion that is similar to that mentioned above, a surface of each of these surface conductor portions is reliably covered with metal plating films by electroplating; scratches on these surfaces caused by contact with an electrode pin are less likely to be conspicuous; and the substrate body can be reduced in size.

Abstract: A wiring board unit includes: a polygonal wiring board having three or more sides in top view, a product insulating part comprising a plurality of external terminals, and a dummy insulating part at an outer edge of one of the at least three sides; and a lead frame including a frame having an inner edge defining an opening within which the wiring board is disposed in top view, and a plurality of leads, one end of each of the plurality of leads connected to the inner edge of the frame and the other end of each of the plurality of leads respectively connected to one of the plurality of external terminals of the wiring board, wherein a connection unit for connecting the frame of the lead frame and the dummy insulating part of the wiring board is arranged therebetween.

Abstract: A joint structure includes: a ceramic member; a metallized layer formed on a surface of the ceramic member; and a metal member joined to the metallized layer via a brazing material. The metal member includes a base part erected on the metallized layer, and an extended part extended from the base part to define a predetermined gap with respect to the metallized layer. The base part includes an end joined to the metallized layer by a brazing material layer including the brazing material, and a side joined to the metallized layer around the base part by a fillet including the brazing material formed on the metallized layer around the base part. The extended part defines a recess at a position facing the metallized layer on which the fillet is formed.

Abstract: A wiring board unit includes: a polygonal wiring board having three or more sides in top view, a product insulating part comprising a plurality of external terminals, and a dummy insulating part at an outer edge of one of the at least three sides; and a lead frame including a frame having an inner edge defining an opening within which the wiring board is disposed in top view, and a plurality of leads, one end of each of the plurality of leads connected to the inner edge of the frame and the other end of each of the plurality of leads respectively connected to one of the plurality of external terminals of the wiring board, wherein a connection unit for connecting the frame of the lead frame and the dummy insulating part of the wiring board is arranged therebetween.

Abstract: A joint structure includes: a ceramic member; a metallized layer formed on a surface of the ceramic member; and a metal member joined to the metallized layer via a brazing material. The metal member includes a base part erected on the metallized layer, and an extended part extended from the base part to define a predetermined gap with respect to the metallized layer. The base part includes an end joined to the metallized layer by a brazing material layer including the brazing material, and a side joined to the metallized layer around the base part by a fillet including the brazing material formed on the metallized layer around the base part. The extended part defines a recess at a position facing the metallized layer on which the fillet is formed.

Abstract: A long tubular article characterized by having a smooth surface and a substantially uniform wall thickness in the circumferential direction and the longitudinal direction and by being produced by injection molding a thermoplastic resin and a method for the injection molding.

Abstract: There is here provided a thermoplastic resin composition which comprises (I) 99 to 1% by weight of an aromatic polyester resin, (II) 1 to 99% by weight of at least one kind of resin selected from the group consisting of a polyphenylene ether resin, a mixture of the polyphenylene ether resin and a styrene polymer, a polycarbonate resin, and a polyarylene sulfide resin, (III) 0.1 to 100 parts by weight, based on 100 parts by weight of the aforesaid resins (I)+(II), of a multi-phase structure thermoplastic resin which is composed of 5 to 95% by weight of an epoxy group-containing olefin copolymer and 95 to 5% by weight of a vinyl polymer or copolymer obtained from at least one kind of vinyl monomer, either of both the components being formed with a dispersion phase having a particle diameter of 0.001 to 10 .mu.m. A method for preparing the above-mentioned thermoplastic resin composition is also provided here.

Abstract: There is here provided a thermoplastic resin composition containing(I) 99 to 1% by weight of an ABS resin,(II) 1 to 99% by weight of at least one kind of resin selected from an aromatic polyester resin and a polyamide resin(III) 0.1 to 100 parts by weight, based on 100 parts by weight of the aforesaid resins (I)+(II), of a multi-phase structure thermoplastic resin which is composed of 5 to 95% by weight of an epoxy group-containing olefin copolymer and 95 to 5% by weight of a vinyl polymer or copolymer obtained from at least one kind of vinyl monomer, either of the polymer or copolymer being in the state of a dispersion phase having a particle diameter of 0.001 to 10 .mu.m. A method for preparing the above-mentioned thermoplastic resin composition is also provided here.

Abstract: There is here provided a thermoplastic resin composition containing(I) 99 to 1% by weight of a polypropylene,(II) 1 to 99% by weight of at least one kind of resin selected from the group consisting of an aromatic polyester resin, a polycarbonate resin, a polyamide resin, a polyphenylene ether resin or a mixture of the polyphenylene ether resin and a styrene polymer and an ABS resin, and(III) 0.1 to 100 parts by weight, based on 100 parts by weight of the aforesaid resins (I)+(II), of a multi-phase structure thermoplastic resin which is composed of 5 to 95% by weight of a polyolefin and 95 to 5% by weight of a vinyl polymer or copolymer obtained from at least one kind of vinyl monomer, either of both the components being in the state of a dispersion phase having a particle diameter of 0.001 to 10 .mu.m. A method for preparing the above-mentioned thermoplastic resin composition is also provided here.

Abstract: Provided is a power cable coating composition comprising a copolymer of ethylene or ethylene and an .alpha.-olefin with 0.02-2 mol % of a cyclic non-conjugated diene, said copolymer being prepared by a high-pressure radical polymerization process, said copolymer having a melt index of 0.2-10 g/10 min and an iodine value in the range of 0.2 to 20, and not more than 2.5 parts by weight, based on 100 parts by weight of said copolymer, of a peroxide, said composition on heat-crosslinking affording a crosslinked product having at least the following properties:(a) a percent heat-deformation at 120.degree. C. not more than 20%, and(b) a maximum peak temperature (Tm) not lower than 100.degree. C. measured according to the differential scanning calorimetry (DSC).