Abstract: According to one embodiment, an apparatus includes: a device configured to partially provide a second conductor layer on a surface of a first conductor layer; a device configured to partially provide a first insulating layer on the surface of the first conductor layer; a device configured to integrate the first conductor layer, the second conductor layer, the first insulating layer, and a third conductor layer, in a state in which the second conductor layer and the first insulating layer provided on the surface of the first conductor layer are covered with the third conductor layer from a side opposite the first conductor layer; a device configured to form a conductor pattern by partially removing at least one of the first conductor layer and the third conductor layer in a structure obtained by the integrating; and a device configured to cover both sides of the structure.

Abstract: According to one embodiment, an apparatus includes: a device configured to partially provide a second conductor layer on a surface of a first conductor layer; a device configured to partially provide a first insulating layer on the surface of the first conductor layer; a device configured to integrate the first conductor layer, the second conductor layer, the first insulating layer, and a third conductor layer, in a state in which the second conductor layer and the first insulating layer provided on the surface of the first conductor layer are covered with the third conductor layer from a side opposite the first conductor layer; a device configured to form a conductor pattern by partially removing at least one of the first conductor layer and the third conductor layer in a structure obtained by the integrating; and a device configured to cover both sides of the structure.

Abstract: According to one embodiment, an electronic apparatus includes a housing and a flexible printed circuit board accommodated in the housing. The flexible printed circuit board includes a base portion, an electrically conductive portion, a first adhesive portion, a cover portion, a rigid reinforcement plate, and a second adhesive portion. The electrically conductive portion is laminated to the base portion. The first adhesive portion is laminated to the conductive portion and includes a first opening. The cover portion is laminated to the first adhesive portion and includes a second opening continuous with the first opening. The rigid reinforcement plate is opposed to the cover portion. The second adhesive portion penetrates the first and second openings and is interposed between the cover portion and the reinforcement plate.

Abstract: According to one embodiment, an electronic apparatus includes a housing and a flexible printed wiring board in the housing. The flexible printed wiring board includes a via, an insulator, a first conductive pattern, and a second conductive pattern. The insulator around the via includes a first surface and a second surface opposite to the first surface. The first conductive pattern is connected to the via on the first surface. The second conductive pattern is connected to the via on the second surface.

Abstract: According to one embodiment, an apparatus includes: a device configured to partially provide a second conductor layer on a surface of a first conductor layer; a device configured to partially provide a first insulating layer on the surface of the first conductor layer; a device configured to integrate the first conductor layer, the second conductor layer, the first insulating layer, and a third conductor layer, in a state in which the second conductor layer and the first insulating layer provided on the surface of the first conductor layer are covered with the third conductor layer from a side opposite the first conductor layer; a device configured to form a conductor pattern by partially removing at least one of the first conductor layer and the third conductor layer in a structure obtained by the integrating; and a device configured to cover both sides of the structure.

Abstract: According to one embodiment, an electronic apparatus includes a housing and a flexible printed wiring board in the housing. The flexible printed wiring board includes a via, an insulator, a first conductive pattern, and a second conductive pattern. The insulator around the via includes a first surface and a second surface opposite to the first surface. The first conductive pattern is connected to the via on the first surface. The second conductive pattern is connected to the via on the second surface.

Abstract: According to one embodiment, a television receiver includes a housing, a circuit board, and a flexible printed wiring board. The flexible printed wiring board is electrically connected to the circuit board, and includes an inner layer, a first outer layer, a second outer layer, a first conductive layer, a second conductive layer, and a conductive portion. The inner layer is provided with a first surface and a second surface. The first outer layer covers the first surface. The second outer layer covers the second surface. The first conductive layer is buried in the first surface and is in contact with the first outer layer. The second conductive layer is buried in the second surface and is in contact with the second outer layer. The conductive portion passes through the inner layer and electrically connects between the first conductive layer and the second conductive layer.

Abstract: According to one embodiment, an electronic apparatus includes a flexible printed wiring board. The printed wiring board includes a plurality of insulating layers, a conductive layer, and a ground layer. The ground layer comprises a first conductive paste filled in a plurality of openings of a second insulating layer so as to cover a ground line exposed to bottoms of the plurality of openings. The ground layer further comprises a second conductive paste applied so as to continuously cover the first conductive paste and the second insulating layer. The first and second conductive pastes each contain conductive particles and binder resin that binds the conductive particles, and the second conductive paste has the conductive particles whose amount as compared to the binder resin is larger than the first conductive paste such that a volume resistivity of the second conductive paste becomes smaller than that of the first conductive paste.

Abstract: According to one embodiment, an electronic apparatus includes a housing and a flexible printed circuit board accommodated in the housing. The flexible printed circuit board includes a base portion, an electrically conductive portion, a first adhesive portion, a cover portion, a rigid reinforcement plate, and a second adhesive portion. The electrically conductive portion is laminated to the base portion. The first adhesive portion is laminated to the conductive portion and includes a first opening. The cover portion is laminated to the first adhesive portion and includes a second opening continuous with the first opening. The rigid reinforcement plate is opposed to the cover portion. The second adhesive portion penetrates the first and second openings and is interposed between the cover portion and the reinforcement plate.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a circuit board accommodated in the hosing and including a first surface and a second surface located on an opposite side to the first surface, a flexible printed wiring board having an elasticity, electrically connected to the circuit board and provided from the first surface of the circuit board over to the second surface, and a pressing portion formed from a part of the flexible printed wiring board as it is bent, and pressing the flexible printed wiring board towards the first surface as it is brought into contact with the inner surface of the housing, which opposes the first surface of the circuit board.

Abstract: According to one embodiment, an electronic apparatus includes a flexible printed wiring board. The printed wiring board includes a conductive layer including a signal line and a ground line, a second insulating layer layered on the conductive layer and including openings open to above the ground line, a ground layer covering the signal line and electrically connected to the ground line, and a third insulating layer covering the ground layer. The ground layer includes first and second conductive pastes. The first conductive paste is filled in the openings so as to cover the ground line exposed to bottoms of the openings. The second conductive paste is applied so as to continuously cover the first conductive paste and the second insulating layer. The second conductive paste has a smaller volume resistivity than the first conductive paste.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a circuit board accommodated in the hosing and including a first surface and a second surface located on an opposite side to the first surface, a flexible printed wiring board having an elasticity, electrically connected to the circuit board and provided from the first surface of the circuit board over to the second surface, and a pressing portion formed from a part of the flexible printed wiring board as it is bent, and pressing the flexible printed wiring board towards the first surface as it is brought into contact with the inner surface of the housing, which opposes the first surface of the circuit board.

Abstract: According to one embodiment, a plurality of bumps are formed by repeatedly applying conductive paste to the conductive pattern portion, a plurality of bump-guiding openings are provided in the cover layer to align with the plurality of bumps, a plurality of crushed portions are formed by crushing heads of the plurality of bumps protruding from the cover layer through the bump-guiding openings, and a ground layer is formed on the cover layer. The ground layer is electrically connected to the plurality of crushed portions.

Abstract: According to one embodiment, there is provided a printed-wiring board in which a composite board is formed to have rigid portions and a bending portion, wherein the bending portion includes linear protrusions each formed with solder resist having a bending resistance property.

Abstract: According to one embodiment, in a method of inspecting a printed wiring board, the printed wiring board which is provided with an outer-layer surface and an inner-layer surface is prepared for inspection. The printed wiring board includes a land provided on the outer-layer surface, a via ranging from the land to the inner-layer surface, and an inner layer pattern provided on the inner-layer surface, wherein the inner layer pattern is electrically connected to the via when a via shift in the printed wiring board is within a tolerance range. A conduction state between the land and the inner layer pattern is detected.

Abstract: According to one embodiment, a printed wiring board includes a first layer, a flexible sheet member disposed at a part on a surface of the first layer, and a second layer which is disposed on the first layer and the flexible sheet member, a part of the second layer which corresponds to the flexible sheet member including an opening region.