Patents by Inventor Sadaji SUTOU

Sadaji SUTOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120325068
    Abstract: To restrain shifting of a circular blade, and reduce a cutting-in angle of the circular blade with respect to the tape roll main body, both ends of a rotatable blade shaft 38 is supported by a pair of shaft bearings 39a and 39b of shaft supporting members 37 of a tool post 20. The circular blade 21 is mounted to the blade shaft 38, between the shaft bearings 39a and 39b. This prevents the blade shaft 38 from being shifted or bent, restrains shifting of the circular blade 21, and reduce the cutting-in angle of the circular blade 21 with respect to the tape roll main body.
    Type: Application
    Filed: June 20, 2012
    Publication date: December 27, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Sadaji SUTOU, Futoshi MATSUE, Akira OKANO
  • Publication number: 20090263606
    Abstract: The present invention provides a thermosetting adhesive or pressure-sensitive adhesive tape or sheet including: a thermosetting adhesive or pressure-sensitive adhesive layer formed of a thermosetting adhesive or pressure-sensitive adhesive composition containing an acrylic polymer (X) constituted of, as essential monomer components, an alkyl (meth)acrylate (a) in which the alkyl moiety thereof has from 2 to 14 carbon atoms and a cyano group-containing monomer (b), and a phenol resin (Y); and provided on at least one surface of the thermosetting adhesive or pressure-sensitive adhesive layer, a release liner including a plastic film substrate and a release layer provided on at least one side of the plastic film substrate, the release layer containing low density polyethylene as a major component and having a thickness of 5 ?m or more and less than 20 ?m.
    Type: Application
    Filed: April 20, 2009
    Publication date: October 22, 2009
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takahiro NONAKA, Noritsugu DAIGAKU, Rie KUWAHARA, Masahiro OURA, Sadaji SUTOU
  • Publication number: 20060107811
    Abstract: The laminate-cutting method according to the present invention is a method for cutting an optical film wherein layers are laminated through a pressure-sensitive adhesive agent with a cutting edge, wherein the cutting of the laminate with the cutting edge is performed in the state that compressive stress applied to the optical film is decreased when the laminate is cut with the cutting edge. This makes it possible to provide a laminate-cutting method, a cutting device and a laminate-cutting pedestal wherein the generation of the adhesion of paste to a cutting edge, the blocking, cracking, chipping of cut faces, and others is prevented.
    Type: Application
    Filed: May 11, 2005
    Publication date: May 25, 2006
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshikazu Tanaka, Toshirou Nishikubo, Kazuo Kitada, Noriaki Hara, Sadaji Sutou