Abstract: A semiconductor apparatus includes: first electronic components; a first circuit board, including first electronic component mounting pads on which the first electronic components are mounted; and a second circuit board located above the first circuit board, wherein the first electronic component mounting pads are arranged on a first face of the first circuit board, opposite the second circuit board, and the first circuit board and the second circuit board are electrically connected by internal connection terminals located between the first circuit board and the second circuit board, and wherein a recessed portion is formed in the second circuit board, opposite the first electronic components, in order to provide space to accommodate portions of the first electronic components.

Abstract: A package includes: a package body including a substrate, an electronic component mounted on a first surface of the substrate, and a sealing resin layer for sealing the electronic component; and a shield case for covering the sealing resin layer, the shield case being made of metal and having an inverted U-shape in a cross-sectional view, wherein a bent part of the shield case is formed in such a manner that at least a part of an end of the shield case is bent toward a second surface of the substrate opposite to the first surface, and the bent part abuts on the second surface so that the shield case is attached to the substrate.

Abstract: A semiconductor device includes a first wiring board having a semiconductor element connection pad; a semiconductor element connected to the semiconductor element connection pad; and a second wiring board facing the semiconductor element and the first wiring board, the second wiring board being electrically connect to the first wiring board. The semiconductor element includes an electrode configured to electrically connect a first surface of the semiconductor element and a second surface of the semiconductor element to each other. The first surface of the semiconductor element faces the first wiring board. The second surface of the semiconductor element faces the second wiring board. The first wiring board and the second wiring board are electrically connected to each other via the electrode.

Abstract: A semiconductor apparatus includes: first electronic components; a first circuit board, including first electronic component mounting pads on which the first electronic components are mounted; and a second circuit board located above the first circuit board, wherein the first electronic component mounting pads are arranged on a first face of the first circuit board, opposite the second circuit board, and the first circuit board and the second circuit board are electrically connected by internal connection terminals located between the first circuit board and the second circuit board, and wherein a recessed portion is formed in the second circuit board, opposite the first electronic components, in order to provide space to accommodate portions of the first electronic components.

Abstract: It is an electronic component built-in substrate 100 configured as follows. That is, an electronic component 30 is provided between at least two boards 10 and 20. An electrode 34 of the electronic component 30 is electrically connected to at least one of the board 10. Also, the boards 10 and 20 are electrically connected to each other. Additionally, the gap between the boards 10 and 20 is sealed with a resin. The electronic component built-in substrate 100 is featured in that a solder ball 40 for electrically connecting the boards 10 and 20 to each other is provided on a surface of the electronic component 30, which faces the other board 20.

Abstract: A package includes: a package body including a substrate, an electronic component mounted on a first surface of the substrate, and a sealing resin layer for sealing the electronic component; and a shield case for covering the sealing resin layer, the shield case being made of metal and having an inverted U-shape in a cross-sectional view, wherein a bent part of the shield case is formed in such a manner that at least a part of an end of the shield case is bent toward a second surface of the substrate opposite to the first surface, and the bent part abuts on the second surface so that the shield case is attached to the substrate.

Abstract: A semiconductor device is disclosed that comprises a board, a ground terminal disposed on the board, a connection terminal disposed on the board, a semiconductor chip mounted on the board, and a shield member electrically connected to the ground terminal. The semiconductor chip, the ground terminal, and the connection terminal are disposed on one side of the board, and the shield member is disposed directly on and covers the other side of the board.

Abstract: A semiconductor device is disclosed that comprises a board, a ground terminal disposed on the board, a connection terminal disposed on the board, a semiconductor chip mounted on the board, and a shield member electrically connected to the ground terminal. The semiconductor chip, the ground terminal, and the connection terminal are disposed on one side of the board, and the shield member is disposed directly on and covers the other side of the board.

Abstract: A semiconductor device is provided that includes a semiconductor chip, a substrate on which the semiconductor chip is mounted, a mounting terminal that is arranged on a first side of the substrate, and a testing terminal that is arranged on a second side of the substrate which second side is opposite the first side of the substrate.

Abstract: A semiconductor device includes a semiconductor chip, wirings, a substrate electrically connected to the semiconductor chip via the wirings and a plurality of discrete parts provided on a part of the substrate. The part is located closer to the center of the substrate than a wiring disposing area where the wirings are disposed.

Abstract: A semiconductor device is disclosed that includes a substrate, electronic components that are arranged at an electronic components mounting area of the substrate, a ground terminal that is arranged within the electronic components mounting area, transfer molded resin that covers the electronic components while exposing the ground terminal, a shield member that covers the electronic components and is connected to the ground terminal, and conductive adhesive that realizes electrical connection between the ground terminal and the shield member.