Patents by Inventor Sadami Yakuwa

Sadami Yakuwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding apparatus
    Patent number: 5263630
    Abstract: In order to vibrate a capillary stably at an arbitrary frequency with an arbitrary waveform, a bonding apparatus having a piezoelectric element vibrating stably at an arbitrary frequency with an arbitrary waveform in response to an input of a piezoelectric element control signal from a piezoelectric element control signal generator is provided.
    Type: Grant
    Filed: August 3, 1992
    Date of Patent: November 23, 1993
    Assignee: NEC Corporation
    Inventors: Tsuneo Kanomata, Sadami Yakuwa