Patents by Inventor Sadamitsu Jumonji

Sadamitsu Jumonji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible printed circuit board
    Patent number: 6664479
    Abstract: A flexible printed circuit board (FPC) comprises a base film; a base film side adhesive layer provided on the base film; a metal foil layer on which a pattern circuit is formed, provided on the base film side adhesive layer; and a cover layer side adhesive layer provided on the metal foil layer, wherein at least one of the base film side adhesive and the cover layer side adhesive layer has a higher glass transition temperature than an operating temperature of the flexible printed circuit board, so that the FPC has a stable flexibility at high temperature.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: December 16, 2003
    Assignee: Fujikura Ltd.
    Inventors: Nobuo Tanabe, Kenichi Okada, Yukihiko Kurosawa, Takayuki Imai, Sadamitsu Jumonji, Masahiko Arai, Masahiro Kaizu
  • Flexible printed circuit board
    Publication number: 20020189855
    Abstract: A flexible printed circuit board (FPC) comprises a base film; a base film side adhesive layer provided on the base film; a metal foil layer on which a pattern circuit is formed, provided on the base film side adhesive layer; and a cover layer side adhesive layer provided on the metal foil layer, wherein at least one of the base film side adhesive and the cover layer side adhesive layer has a higher glass transition temperature than the working environment temperature of the flexible printed circuit board, so that the FPC has a stable flexibility at high temperature.
    Type: Application
    Filed: April 27, 2001
    Publication date: December 19, 2002
    Inventors: Nobuo Tanabe, Kenichi Okada, Yukihiko Kurosawa, Takayuki Imai, Sadamitsu Jumonji, Masahiko Arai, Masahiro Kaizu