Patents by Inventor Sadamu KAJISA

Sadamu KAJISA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC ELEMENT MOUNTING SUBSTRATE AND ELECTRONIC DEVICE
    Publication number: 20220148933
    Abstract: An electronic element mounting substrate according to an aspect of the present disclosure is provided with a substrate and a plurality of electrodes. The substrate includes an electronic element mounting region. The plurality of electrodes are located around the electronic element mounting region. The substrate includes the electronic element mounting region and at least one of a first protrusion portion spanning between the plurality of electrodes or a second protrusion portion spanning between the plurality of electrodes from an outer edge of the substrate in a plan view.
    Type: Application
    Filed: March 27, 2020
    Publication date: May 12, 2022
    Applicant: KYOCERA Corporation
    Inventors: Sadamu KAJISA, Kyouji UEMURA
  • Electronic component mounting board, electronic device, and electronic module
    Patent number: 10681831
    Abstract: An electronic component mounting board includes a substrate and a metal layer. The substrate includes a first layer, and a second layer located at a lower surface of the first layer. The metal layer is located between the first layer and the second layer, and includes a first conductor layer, and a second conductor layer located with a space from the first conductor layer. The space extends from a first end of the metal layer to a second end of the metal layer different from the first end as viewed from above. The metal layer overlaps a first imaginary line that is parallel to one side of the substrate and passes through a center of the substrate, and a second imaginary line that is perpendicular to the first imaginary line and passes through the center of the substrate as viewed from above.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: June 9, 2020
    Assignee: KYOCERA CORPORATION
    Inventor: Sadamu Kajisa
  • ELECTRONIC COMPONENT MOUNTING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
    Publication number: 20190008064
    Abstract: An electronic component mounting board includes a substrate and a metal layer. The substrate includes a first layer, and a second layer located at a lower surface of the first layer. The metal layer is located between the first layer and the second layer, and includes a first conductor layer, and a second conductor layer located with a space from the first conductor layer. The space extends from a first end of the metal layer to a second end of the metal layer different from the first end as viewed from above. The metal layer overlaps a first imaginary line that is parallel to one side of the substrate and passes through a center of the substrate, and a second imaginary line that is perpendicular to the first imaginary line and passes through the center of the substrate as viewed from above.
    Type: Application
    Filed: May 24, 2018
    Publication date: January 3, 2019
    Applicant: KYOCERA Corporation
    Inventor: Sadamu KAJISA