Abstract: A disk holder springing-out prevention device is constituted by utilizing an existing loading block LB. A disk holder 3 is restricted to an accommodated position within a magazine M by means of a stopper 1a provided on a holder guide rail 1. In general, the initial position of the loading block LB is adapted to be a raised/lowered position corresponding to the uppermost disk holder 3 and the stopper 1a is adapted to be superimposed in the vertical direction with an engagement projection 2a of a holder extracting member 2 when the holder extracting member 2 is in the initial position in the feed direction. In this way, positional restriction of the uppermost disk holder 3 is effected by the holder extracting member 2 whereas the stopper 1a performs positional restriction of the remaining disk holders 3. As a result, springing out of the disk holders 3 from the magazine M can be reliably prevented.

Abstract: On a loading block LB, there are provided a wire 1 having spring properties and two rollers (disk pressing sections) 2 made of rubber that are capable of rotating about this wire 1 as their rotary shaft. One end of the wire 1 is coupled with a cam hole 4a provided in a large-diameter gear (rotary member) 4 of the loading block LB through a linking plate (operating member) 3 and a coupling pin 3a provided on this linking plate 3, so that the rollers 2 are subjected to drive control between a pressing position and a release position by the operation of this cam hole 4a. During disk feeding or clamping action, the disk D can be pressed against the disk holder DH by pressing the rollers 2 against the disk D.

Abstract: A disk holder springing-out prevention device is constituted by utilizing an existing loading block LB. A disk holder 3 is restricted to an accommodated position within a magazine M by means of a stopper 1a provided on a holder guide rail 1. In general, the initial position of the loading block LB is adapted to be a raised/lowered position corresponding to the uppermost disk holder 3 and the stopper 1a is adapted to be superimposed in the vertical direction with an engagement projection 2a of a holder extracting member 2 when the holder extracting member 2 is in the initial position in the feed direction. In this way, positional restriction of the uppermost disk holder 3 is effected by the holder extracting member 2 whereas the stopper 1a performs positional restriction of the remaining disk holders 3. As a result, springing out of the disk holders 3 from the magazine M can be reliably prevented.

Abstract: On a loading block LB, there are provided a wire 1 having spring properties and two rollers (disk pressing sections) 2 made of rubber that are capable of rotating about this wire 1 as their rotary shaft. One end of the wire 1 is coupled with a cam hole 4a provided in a large-diameter gear (rotary member) 4 of the loading block LB through a linking plate (operating member) 3 and a coupling pin 3a provided on this linking plate 3, so that the rollers 2 are subjected to drive control between a pressing position and a release position by the operation of this cam hole 4a. During disk feeding or clamping action, the disk D can be pressed against the disk holder DH by pressing the rollers 2 against the disk D.

Abstract: An equipment support structure capable of permitting the vertical arrangement or orientation of a damper spring to be readily carried out irrespective of the posture of setting of an equipment, A damper link which is pivotally moved depending upon the position of setting of an equipment is pivotally mounted at the proximal end thereof on one of the equipment and mount for supporting the equipment through dampers and a damper spring is provided between the damper link and the other of the mount and equipment for offsetting load applied from the equipment to the dampers and operatively connected to the damper ling so as to be pivotally moved in association with the damper link.

Abstract: A drive arrangement effects movement of a disk conveying portion to a plurality of first positions and to a second position relative to a case and a rotatable turntable. The drive arrangement includes a driving gear, a slide member having a gear portion engaging the driving gear, and a movable slide plate engaged by the slide member, the slide plate having a stepwise cam portion which effects movement of the disk conveying portion between its positions. The disk conveying portion has two rotatable rollers which can engage an edge of a disk in the case when the disk conveying portion is in one of its first positions, and which rotate in order to extract the disk. As the disk conveying portion moves to its second position, the disk supported by the rollers moves to the turntable, and a clamp member is moved from a retracted position to a clamping position to hold the disk against the turntable, after which the rollers are disengaged from the disk.

Abstract: A disk selecting mechanism is disclosed, in which a slide plate is moved forward and backward by driving a slide link by means of a driving gear and a disk conveying portion is moved according thereto in the up and downward direction by a stepwise cam portion disposed on the slide link so as to set it at an arbitrary position in the up and downward direction, in order to select an arbitrary disk from a magazine.

Abstract: A method of producing a semiconductor device having a light transparent window, includes: a process of die bonding a chip onto a lead frame; a process of attaching a wall surrounding a picture element to either of the external contour surface of the surface of the chip or the light transparent window surrounding the picture element; a process of inserting the chip and the light transparent window into a metal mold in such a manner that an empty closed space is produced between the chip and the light transparent window via the wall; and a process of plastic molding the device except for the light transparent window by filling resin into the metal mold and making the resin hardened.

Abstract: An electrode supporting conduit tube for electrical heating of underground hydrocarbon resources comprises a metal conduit tube and an insulating member adhered on and around the outer peripheral surface of the metal conduit tube. The insulating member is a laminated body of a web of glass fiber impregnated with water-dispersion varnish of a hot-water resistant and thermoplastic resin and a polyether/ether/ketone resin film, which is formed by first alternately winding the glass fiber web and the resin film on and around the outer peripheral surface of the metal conduit tube for a plurality of winding turns, and then subjecting both polyether/ether/ketone resin film and glass fiber web thus wound on and around the metal conduit tube to shaping under heat and pressure at a heating temperature of from 350.degree. C. to 450.degree. C, and under a pressure of from 10 kg/cm.sup.2 to 200 kg/cm.sup.2.

Abstract: A semiconductor device and a method for manufacturing a semiconductor device of a type having a resin package and a window in the package such as a quartz glass window transparent to ultraviolet rays. A semiconductor chip is bonded onto a surface of a die pad of a lead frame. A softened resin is then extruded from the opposite surface of the die pad through gaps between the die pad and the leads with the extrusion being carried out in an inert gas atmosphere. An inner package member is thus formed surrounding the semiconductor chip. An outer package member, made of a thermosetting resin having a weight ratio of resin to filler less than that of the inner package, is molded around the chip assembly and inner package.

Abstract: A semiconductor device and a method for manufacturing a semiconductor device of a type having a resin package and a window in the package such as a quartz glass window transparent to ultraviolet rays. A semiconductor chip is bonded onto a surface of a die pad of a lead frame. A softened resin is then extruded from the opposite surface of the die pad through gaps between the die pad and the leads with the extrusion being carried out in an inert gas atmosphere. An inner package member is thus formed surrounding the semiconductor chip. An outer package member, made of a thermosetting resin having a weight ratio of resin to filler less than that of the inner package, is molded around the chip assembly and inner package.