Patents by Inventor Sadao Fujieda

Sadao Fujieda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin-molded semiconductor device and a process for manufacturing the same
    Patent number: 4540603
    Abstract: A process for manufacturing resin-molded semiconductor devices which are sealed in an epoxy resin is carried out without employing a metal mold. In the process, an epoxy resin is deposited on a sub-assembly consisting of a semiconductor pellet brazed to axial leads while turning the sub-assembly with the axial leads as a center so that the epoxy resin is applied to a predetermined shape; then the epoxy resin is heated at an elevated temperature while turning the sub-assembly so that surface portions of the epoxy resin are hardened and the epoxy resin is further heated at an elevated temperature without turning the sub-assembly so that the epoxy resin is completely hardened.
    Type: Grant
    Filed: December 19, 1983
    Date of Patent: September 10, 1985
    Assignee: Hitachi, Ltd.
    Inventors: Toshiyuki Hidaka, Hisashi Sakamoto, Toshiaki Fukuhara, Sadao Fujieda, Yutaka Misawa