Patents by Inventor Sadao Hirae
Sadao Hirae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7600522Abstract: A substrate treatment method including the steps of: generating droplets of a treatment liquid by mixing the treatment liquid with a gas; and causing the treatment liquid droplets generated in the liquid droplet generating step to impinge on a surface of a substrate being treated. The treatment liquid droplets have a volume median diameter of 5 ?m to 40 ?m.Type: GrantFiled: March 4, 2009Date of Patent: October 13, 2009Assignee: Dainippon Screen Mfg. Co., Ltd.Inventors: Masanobu Sato, Sadao Hirae, Shuichi Yasuda
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Publication number: 20090165828Abstract: A substrate treatment method including the steps of: generating droplets of a treatment liquid by mixing the treatment liquid with a gas; and causing the treatment liquid droplets generated in the liquid droplet generating step to impinge on a surface of a substrate being treated. The treatment liquid droplets have a volume median diameter of 5 ?m to 40 ?m.Type: ApplicationFiled: March 4, 2009Publication date: July 2, 2009Inventors: Masanobu Sato, Sadao Hirae, Shuichi Yasuda
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Patent number: 7479205Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.Type: GrantFiled: May 10, 2004Date of Patent: January 20, 2009Assignee: Dainippon Screen Mfg. Co., Ltd.Inventors: Seiichiro Okuda, Hiroaki Sugimoto, Takuya Kuroda, Masanobu Sato, Sadao Hirae, Shuichi Yasuda, Kenya Morinishi, Masayoshi Imai
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Patent number: 7428907Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.Type: GrantFiled: May 5, 2004Date of Patent: September 30, 2008Assignee: Dainippon Screen Mfg. Co., Ltd.Inventors: Seiichiro Okuda, Hiroaki Sugimoto, Takuya Kuroda, Masanobu Sato, Sadao Hirae, Shuichi Yasuda, Kenya Morinishi, Masayoshi Imai
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Patent number: 7267130Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.Type: GrantFiled: May 3, 2004Date of Patent: September 11, 2007Assignee: Dainippon Screen Mfg. Co., Ltd.Inventors: Seiichiro Okuda, Hiroaki Sugimoto, Takuya Kuroda, Masanobu Sato, Sadao Hirae, Shuichi Yasuda, Kenya Morinishi, Masayoshi Imai
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Publication number: 20060191556Abstract: In a substrate processing apparatus (1), a ring-shaped cover part (61) opposed to an annular surface (51a) of a rotating part (51) is provided and the rotating part (51) rotates the substrate (9) while holding the substrate (9). An exhaust flow space (64) connecting with a gap space (62) between the cover part (61) and the annular surface (51a) along an outer edge of the cover part (61) is formed by a duct main body (63) connected to the cover part (61) along the outer edge of the cover part (61). Since a cross-sectional area of the exhaust flow space (64) increases gradually along a rotation direction of the rotating part (51), it is possible to reduce variation of inlet flow speed of air around the gap space (62) and to suppress nonuniformity of processing of the substrate (9).Type: ApplicationFiled: February 23, 2006Publication date: August 31, 2006Inventors: Yoshiyuki Nakazawa, Sadao Hirae, Takamasa Sakai
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Publication number: 20050229946Abstract: A substrate treating method for cleaning a substrate by supplying a cleaning solution thereto. The method comprises the steps of supplying the cleaning solution having ozone dissolved therein to the substrate, and irradiating the cleaning solution with ultraviolet light. By irradiating the cleaning solution having ozone dissolved therein with ultraviolet light, oxygen radicals are generated easily to increase the activity of the cleaning solution. Thus, a significantly improved cleaning capability is achieved even with low concentration ozone water. This method is applicable also to a piecemeal treatment for cleaning large substrates. Since the cleaning solution supplied to the substrate contains ozone in a low concentration, a filter and piping materials for supplying the cleaning solution need not have strong ozone resistance.Type: ApplicationFiled: June 15, 2005Publication date: October 20, 2005Inventors: Sadao Hirae, Masanobu Sato, Shuichi Yasuda
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Patent number: 6951221Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.Type: GrantFiled: September 21, 2001Date of Patent: October 4, 2005Assignee: Dainippon Screen Mfg. Co., Ltd.Inventors: Seiichiro Okuda, Hiroaki Sugimoto, Takuya Kuroda, Masanobu Sato, Sadao Hirae, Shuichi Yasuda, Kenya Morinishi, Masayoshi Imai
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Patent number: 6901938Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a gas-liquid mixture by mixing a liquid and a pressurized gas, to discharge the gas-liquid mixture to a substrate at high speeds. The mixture process is conducted in an open space out of the nozzle, and change in the supply pressure of the gas does not affect the supply of the liquid. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the gas-liquid mixture, whereby the quality of the process is improved.Type: GrantFiled: November 4, 2003Date of Patent: June 7, 2005Assignee: Dainippon Screen Mfg. Co., Ltd.Inventors: Masanobu Sato, Sadao Hirae, Shuichi Yasuda, Kenya Morinishi
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Publication number: 20040235308Abstract: A substrate treatment method including the steps of: generating droplets of a treatment liquid by mixing the treatment liquid with a gas; and causing the treatment liquid droplets generated in the liquid droplet generating step to impinge on a surface of a substrate being treated. The treatment liquid droplets have a volume median diameter of 5 &mgr;m to 40 &mgr;m.Type: ApplicationFiled: January 28, 2004Publication date: November 25, 2004Applicant: Dainippon Screen Mfg. Co., Ltd.Inventors: Masanobu Sato, Sadao Hirae, Shuichi Yasuda
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Publication number: 20040206379Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.Type: ApplicationFiled: May 10, 2004Publication date: October 21, 2004Applicant: DAINIPPON SCREEN MFG. CO., LTD.Inventors: Seiichiro Okuda, Hiroaki Sugimoto, Takuya Kuroda, Masanobu Sato, Sadao Hirae, Shuichi Yasuda, Kenya Morinishi, Masayoshi Imai
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Publication number: 20040206378Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.Type: ApplicationFiled: May 5, 2004Publication date: October 21, 2004Applicant: DAINIPPON SCREEN MFG. CO., LTD.Inventors: Seiichiro Okuda, Hiroaki Sugimoto, Takuya Kuroda, Masanobu Sato, Sadao Hirae, Shuichi Yasuda, Kenya Morinishi, Masayoshi Imai
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Publication number: 20040206452Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.Type: ApplicationFiled: May 10, 2004Publication date: October 21, 2004Applicant: DAINIPPON SCREEN MFG. CO., LTD.Inventors: Seiichiro Okuda, Hiroaki Sugimoto, Takuya Kuroda, Masanobu Sato, Sadao Hirae, Shuichi Yasuda, Kenya Morinishi, Masayoshi Imai
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Publication number: 20040200513Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.Type: ApplicationFiled: May 3, 2004Publication date: October 14, 2004Applicant: DAINIPPON SCREEN MFG. CO., LTD.Inventors: Seiichiro Okuda, Hiroaki Sugimoto, Takuya Kuroda, Masanobu Sato, Sadao Hirae, Shuichi Yasuda, Kenya Morinishi, Masayoshi Imai
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Publication number: 20040089328Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a gas-liquid mixture by mixing a liquid and a pressurized gas, to discharge the gas-liquid mixture to a substrate at high speeds. The mixture process is conducted in an open space out of the nozzle, and change in the supply pressure of the gas does not affect the supply of the liquid. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the gas-liquid mixture, whereby the quality of the process is improved.Type: ApplicationFiled: November 4, 2003Publication date: May 13, 2004Applicant: DAINIPPON SCREEN MFG. CO., LTD.Inventors: Masanobu Sato, Sadao Hirae, Shuichi Yasuda, Kenya Morinishi
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Patent number: 6729561Abstract: A cleaning nozzle includes a mixing portion with inner walls thereof formed of quartz given smoothing treatment. As a result, the inner walls of the mixing portion have smooth surfaces. This construction effectively suppresses abrasion of the inner walls of the mixing portion, and particle generation from the cleaning nozzle. Further, the cleaning nozzle has a supply pipe surrounding a gas introduction pipe. This reduces areas of contact in the mixing portion between a gas and inner walls of the cleaning nozzle, to suppress particle generation with increased effect.Type: GrantFiled: October 11, 2001Date of Patent: May 4, 2004Assignee: Dainippon Screen Mfg. Co., Ltd.Inventors: Sadao Hirae, Masanobu Sato, Shuichi Yasuda
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Patent number: 6705331Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a gas-liquid mixture by mixing a liquid and a pressurized gas, to discharge the gas-liquid mixture to a substrate at high speeds. The mixture process is conducted in an open space out of the nozzle, and change in the supply pressure of the gas does not affect the supply of the liquid. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the gas-liquid mixture, whereby the quality of the process is improved.Type: GrantFiled: November 14, 2001Date of Patent: March 16, 2004Assignee: Dainippon Screen Mfg., Co., Ltd.Inventors: Masanobu Sato, Sadao Hirae, Shuichi Yasuda, Kenya Morinishi
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Publication number: 20040003829Abstract: A plurality of substrate holding pins 13 extend upright from a holding stage 12, and a substrate W is mechanically held in a circumferential direction with a back surface Sb of the substrate W faced up. Between the substrate W and the holding stage 12, a drip-proof plate 14 whose shape is approximately the same as that of the substrate W is disposed with a distance from the substrate W in such a manner that the drip-proof plate 14 covers a front surface (pattern-bearing surface) Sf of the substrate W from below. The drip-proof plate 14 disposed so as to cover the front surface Sf of the substrate W blocks the mist from splashing upon the front surface Sf of the substrate.Type: ApplicationFiled: April 18, 2003Publication date: January 8, 2004Applicant: Dainippon Screen Mfg. Co., Ltd.Inventor: Sadao Hirae
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Publication number: 20030178047Abstract: A substrate processing apparatus is provided with an IPA spouting nozzle in opposition to an objective surface of a substrate supported by a support part. A nozzle swinging mechanism swingably supports the IPA spouting nozzle through an arm. An IPA supply pipe and a nitrogen gas supply pipe are connected to the IPA spouting nozzle. IPA and nitrogen gas supplied from these supply pipes are mixed with each other in the IPA spouting nozzle for forming IPA droplets. The formed IPA droplets are spouted toward the objective surface of the substrate. Consequently, the objective surface of the substrate can be cleaned with IPA. Thus provided is the substrate processing apparatus cleaning the substrate hard to clean with deionized water.Type: ApplicationFiled: March 5, 2003Publication date: September 25, 2003Applicant: Dainippon Screen Mfg. Co., Ltd.Inventor: Sadao Hirae
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Patent number: 6598805Abstract: A gas mixture of dry steam and nitrogen gas serving as carrier gas is blown into a hot water mist injection port for rendering the nitrogen gas serve as a medium absorbing latent heat of condensation, thereby smoothly progressing condensation of water vapor and efficiently forming hot water mist. The water vapor is condensed in the hot water mist injection port formed by a cylindrical pipe for supplying latent heat of condensation to the nitrogen gas and dilating the same, thereby accelerating the flow of the hot water mist and spraying the hot water mist to a substrate from the hot water mist injection port at a high speed. Small droplets contained in the high-speed hot water mist have high kinetic energy and high thermal energy, for exhibiting a large colliding effect and a high activation effect with respect to small contaminants adhering to the substrate. A substrate cleaning apparatus capable of spraying hot water mist attaining a high cleaning effect to a substrate is provided.Type: GrantFiled: May 15, 2002Date of Patent: July 29, 2003Assignee: Dainippon Screen Mfg. Co., LTDInventors: Takamasa Sakai, Sadao Hirae