Patents by Inventor Sadao Kishida

Sadao Kishida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead-free solder alloys
    Patent number: 6488888
    Abstract: A lead-free solder alloy having a relatively low melting temperature and suitable for use to solder electronic devices consists essentially of: from 7 to 10 wt % of Zn; at least one of from 0.01 to 1 wt % of Ni, from 0.1 to 3.5 wt % of Ag, and from 0.1 to 3 wt % of Cu; optionally at least one of from 0.2 to 6 wt % of Bi, from 0.5 to 3 wt % of In, and from 0.001 to 1 wt % of P; and a balance of Sn. Another such lead-free solder alloy consists essentially of: from 2 to 10 wt % of Zn; from 10 to 30 wt % of Bi; from 0.05 to 2 wt % of Ag; optionally from 0.001 to 1 wt % of P, and a balance of Sn. These solder alloys have a tensile strength of at least 5 kgf/mm2 and at least 10% elongation.
    Type: Grant
    Filed: April 9, 2001
    Date of Patent: December 3, 2002
    Assignees: Matsushita Electric Industrial Co., Ltd., Senju Metal Industry Co., Ltd.
    Inventors: Toshikazu Murata, Hiroji Noguchi, Sadao Kishida, Toshihiko Taguchi, Shozo Asano, Ryo Oishi, Takashi Hori
  • Lead-free solder alloys
    Publication number: 20020015660
    Abstract: A lead-free solder alloy having a relatively low melting temperature and suitable for use to solder electronic devices consists essentially of: from 7 to 10 wt % of Zn; at least one of from 0.01 to 1 wt % of Ni, from 0.1 to 3.5 wt % of Ag, and from 0.1 to 3 wt % of Cu; optionally at least one of from 0.2 to 6 wt % of Bi, from 0.5 to 3 wt % of In, and from 0.001 to 1 wt % of P; and a balance of Sn. Another such lead-free solder alloy consists essentially of: from 2 to 10 wt % of Zn; from 10 to 30 wt % of Bi; from 0.05 to 2 wt % of Ag; optionally from 0.001 to 1 wt % of P, and a balance of Sn. These solder alloys have a tensile strength of at least 5 kgf/mm2 and at least 10% elongation.
    Type: Application
    Filed: April 9, 2001
    Publication date: February 7, 2002
    Inventors: Toshikazu Murata, Hiroji Noguchi, Sadao Kishida, Toshihiko Taguchi, Shozo Asano, Ryo Oishi, Takashi Hori
  • Lead-free solder alloys
    Patent number: 6241942
    Abstract: A lead-free solder alloy having a relatively low melting temperature and suitable for use to solder electronic devices consists essentially of: from 7 to 10 wt % of Zn; at least one of from 0.01 to 1 wt % of Ni, from 0.1 to 3.5 wt % of Ag, and from 0.1 to 3 wt % of Cu; optionally at least one of from 0.2 to 6 wt % of Bi, from 0.5 to 3 wt % of In, and from 0.001 to 1 wt % of P; and a balance of Sn. Another such lead-free solder alloy consists essentially of: from 2 to 10 wt % of Zn; from 10 to 30 wt % of Bi; from 0.05 to 2 wt % of Ag; optionally from 0.001 to 1 wt % of P, and a balance of Sn. These solder alloys have a tensile strength of at least 5 kgf/mm2 and at least 10% elongation.
    Type: Grant
    Filed: March 30, 1998
    Date of Patent: June 5, 2001
    Assignees: Matsushita Electric Industrial Co., Ltd., Senju Metal Industry Co., Ltd.
    Inventors: Toshikazu Murata, Hiroji Noguchi, Sadao Kishida, Toshihiko Taguchi, Shozo Asano, Ryo Oishi, Takashi Hori