Patents by Inventor Sadao Kowatari

Sadao Kowatari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit devices and fabrication Method of the same
    Patent number: 5822850
    Abstract: A supporting member or first synthetic resin sheet with conductive bumps disposed at predetermined positions are superposed on a second synthetic resin sheet under the condition that the resin component of the second synthetic resin sheet is plastic deformed or the temperature thereof exceeds a glass transition temperature so that the conductive bumps are pierced into the second synthetic resin sheet. In other words, the conductive bumps are pierced vertically into the second synthetic resin sheet so as to form through-type conducive lead portions exposed to the first (supporting substrate) and second synthetic resin sheets. The through-type conductive lead portions are used to electrically connect electric devices and circuit and to connect wiring pattern layers. The conductive bumps can be precisely and densely formed and disposed by printing method or plating method. The conductive bumps can be pushed and pierced into the second synthetic resin sheet.
    Type: Grant
    Filed: December 22, 1995
    Date of Patent: October 20, 1998
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiroshi Odaira, Eiji Imamura, Yusuke Wada, Yasushi Arai, Kenji Sasaoka, Takahiro Mori, Fumitoshi Ikegaya, Sadao Kowatari
  • Circuit devices and fabrication method of the same
    Patent number: 5600103
    Abstract: A supporting member or first synthetic resin sheet with conductive bumps disposed at predetermined positions are superposed on a second synthetic resin sheet under the condition that the resin component of the second synthetic resin sheet is plastic deformed or the temperature thereof exceeds a glass transition temperature so that the conductive bumps are pierced into the second synthetic resin sheet. In other words, the conductive bumps are pierced vertically into the second synthetic resin sheet so as to form through-type conducive lead portions exposed to the first (supporting substrate) and second synthetic resin sheets. The through-type conductive lead portions are used to electrically connect electric devices and circuit and to connect wiring pattern layers. The conductive bumps can be precisely and densely formed and disposed by printing method or plating method. The conductive bumps can be pushed and pierced into the second synthetic resin sheet.
    Type: Grant
    Filed: March 2, 1994
    Date of Patent: February 4, 1997
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiroshi Odaira, Eiji Imamura, Yusuke Wada, Yasushi Arai, Kenji Sasaoka, Takahiro Mori, Fumitoshi Ikegaya, Sadao Kowatari