Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Abstract: A production line constructing system for constructing a production line having groups of processing apparatuses, articulated robots for loading workpieces on and unloading processed workpieces from the processing apparatuses, and an automatic conveyor in the form of a vehicle for carrying a respective articulated robot and for conveying the workpieces between the processing apparatuses. The dimensions of the articulated robot are determined taking into consideration the width of passages in a work area, the dimensions of the vehicle, restrictions on available power supply, and the conveying speed of the vehicle carrying the articulated robot relative to the conveying speed of the operator. The production line is constructed so that a maximum loading/unloading area on the processing apparatuses within which a workpiece is loaded on and unloaded from the processing apparatus is included in a range of movement of the end effector of the articulated robot which is limited in dimensions.

Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Abstract: A computer-implemented method and system for diagnosing and system for diagnosing and analyzing fault information of a product is carried out by (a) creating a fault tree representing causal relations between faults and causes thereof base on information of past faults and information concerning the structure and characteristics of the product, and storing the fault tree in a storage unit, the fault tree having branches allocated with weighting coefficients; (b) inputting new fault information of the product into the computer; (c) searching the fault tree in accordance with the weighting coefficients based on the fault information stored in the storage unit to thereby determine the cause of the fault; (d) generating and outputting information concerning an adjustment or repair of the product suffering from the fault based on the determined cause of the fault as well as the information concerning the structure and the characteristics of the product; (e) supplying information concerning the timing of the occurr

Abstract: An apparatus for carrying a variety of products for effectively processing and carrying plural kinds of works such as semiconductor wafers includes a plurality of processing stations for processing plural kinds of works, a carriage system for carrying plural kinds of works, and a transfer system for delivering works between the carriage system and a processing station. A method for carrying a variety of products is realized in which the carriage system simultaneously carries plural kinds of works between the plurality of processing stations and stops at a predetermined position of the transfer system, whereas the transfer system identifies and delivers the desired kind of work to and from the carriage system.

Abstract: An equipment is diagnosed by monitoring a career of operations of the equipment necessary for diagnosing the equipment and a condition of the equipment during the operation, monitoring information on equipment operations and information on variations in operation of the equipment having started operation for a data gathering purpose, selecting some of the gathered data, classifying the selected data based on rules, computing characteristics of variations in equipment state during the operation of the equipment and diagnosing the data on the basis of criterion references for the characteristics prescribed by the rules as an equipment diagnostic procedure.

Abstract: An integrated quality control method and system for explaining failure causes of a product. Information relating to failure of the product and measures taken to correct the failure as well as information relation to manufacture and distribution of the product are collected and inputted for storage in a data base. The information relating to the failure and measures taken to correct the failure is combined with the information relating to the manufacture and distribution of the product and the combined information is analyzed for enabling an estimate of causes of the failure of the product and a trend of possible failures.

Abstract: The present invention provides a carrier jig for use in processing, transporting and stocking a wafer-like material used in manufacture processes of semiconductor products, and a semiconductor production system using the carrier jig. The carrier jig of the present invention comprises a holder for holding and storing therein one wafer, for example, and a container box for loading therein the holder. A mechanism for transferring wafers by the use of the carrier jig is provided in each process, with the result the period of production time can be shortened and the production speed can be enhanced.

Abstract: The present invention provides a carrier jig for use in processing, transporting and stocking a wafer-like material used in manufacture processes of semiconductor products, and a semiconductor production system using the carrier jig. The carrier jig of the present invention comprises a holder for holding and storing therein one wafer, for example, and a container box for loading therein the holder. A mechanism for transferring wafers by the use of the carrier jig is provided in each process, with the result the period of production time can be shortened and the production speed can be enhanced.

Abstract: A simulation method includes a step of modifying a model in a simulation process, a step of detecting elements influenced by the model modification, and a step of performing a resimulation process while returning to the earliest one of the influenced elements. According to the disclosed method, a resimulation process associated with the model modificaiton can be realized in a short time without the inconvenience of the prior art in which the resimulation is carried out with a waste of time even for elements which are not influenced by the model modification or elements which need not to be subjected to the resimulation.