Patents by Inventor Sadao Yanagida

Sadao Yanagida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10173281
    Abstract: Disclosed herein are bonded structures and methods of forming the same. One embodiment of a bonded structure comprises first and second metallic layers and a bonding interface between the first and second metallic layers formed by diffusion and comprising a layer of at least one intermetallic compound. The intermetallic compound layer is formed in an area 52% or greater of an area of the bonding interface and has a thickness of 0.5 to 3.2 ?m.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: January 8, 2019
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Hiroshi Sakurai, Shigeyuki Nakagawa, Akira Fukushima, Sadao Yanagida, Chika Sugi
  • Publication number: 20140144889
    Abstract: Disclosed herein are bonded structures and methods of forming the same. One embodiment of a bonded structure comprises first and second metallic layers and a bonding interface between the first and second metallic layers formed by diffusion and comprising a layer of at least one intermetallic compound. The intermetallic compound layer is formed in an area 52% or greater of an area of the bonding interface and has a thickness of 0.5 to 3.2 ?m.
    Type: Application
    Filed: January 31, 2014
    Publication date: May 29, 2014
    Applicant: Nissan Motor Co., Ltd.
    Inventors: Hiroshi Sakurai, Shigeyuki Nakagawa, Akira Fukushima, Sadao Yanagida, Chika Sugi
  • Patent number: 8492005
    Abstract: In joining a magnesium alloy material 1 (first material) and a steel material (second material), a zinc-plated steel plate 2 plated with zinc (metal C) is used as a steel material, Al (metal D) is added to the magnesium alloy material 1. Next, eutectic melting of Mg and Zn is caused so as to remove a product produced by the eutectic melting with an oxide film 1f and impurities from a joint interface. Moreover, an Al—Mg system intermetallic compound such as Al3Mg2 and an Fe—Al system intermetallic compound such as FeAl3 are produced, whereby regenerated surfaces of both materials 1 and 2 are joined via a compound layer 3 containing those intermetallic compounds.
    Type: Grant
    Filed: January 16, 2009
    Date of Patent: July 23, 2013
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Shigeyuki Nakagawa, Kenji Miyamoto, Minoru Kasukawa, Masao Aihara, Sadao Yanagida, Akio Hirose
  • Publication number: 20110123825
    Abstract: Disclosed herein are bonded structures and methods of forming the same. One embodiment of a bonded structure comprises first and second metallic layers and a bonding interface between the first and second metallic layers formed by diffusion and comprising a layer of at least one intermetallic compound. The intermetallic compound layer is formed in an area 52% or greater of an area of the bonding interface and has a thickness of 0.5 to 3.2 ?m.
    Type: Application
    Filed: August 7, 2008
    Publication date: May 26, 2011
    Applicant: NISSAN MOTOR CO., LTD.
    Inventors: Hiroshi Sakurai, Shigeyuki Nakagawa, Akira Fukushima, Sadao Yanagida, Chika Sugi
  • Publication number: 20110052935
    Abstract: In joining a magnesium alloy material 1 (first material) and a steel material (second material), a zinc-plated steel plate 2 plated with zinc (metal C) is used as a steel material, Al (metal D) is added to the magnesium alloy material 1. Next, eutectic melting of Mg and Zn is caused so as to remove a product produced by the eutectic melting with an oxide film 1f and impurities from a joint interface. Moreover, an Al—Mg system intermetallic compound such as Al3Mg2 and an Fe—Al system intermetallic compound such as FeAl3 are produced, whereby regenerated surfaces of both materials 1 and 2 are joined via a compound layer 3 containing those intermetallic compounds.
    Type: Application
    Filed: January 16, 2009
    Publication date: March 3, 2011
    Inventors: Shigeyuki Nakagawa, Kenji Miyamoto, Minoru Kasukawa, Masao Aihara, Sadao Yanagida, Akio Hirose
  • Patent number: 7171988
    Abstract: A tubing including an overlap portion formed by the first and second circumferential end portions overlapping and joined with each other, and a fluid leakage preventing member for preventing pressurized fluid from leaking from the tubing upon the tubing being subjected to hydrostatic forming. An apparatus and method for hydrostatic forming of a tubing having an overlap portion. The apparatus includes a die and a nozzle having fluid leakage preventing means for preventing the pressurized fluid supplied into the tubing from leaking from a clearance between the first and second circumferential end portions of the overlap portion of the tubing at the longitudinal end portions of the tubing.
    Type: Grant
    Filed: December 2, 2004
    Date of Patent: February 6, 2007
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Fumihiko Gejima, Hiroshi Sakurai, Kenji Kanamori, Tetsuji Morita, Sadao Yanagida, Masayuki Inoue
  • Publication number: 20050121096
    Abstract: A tubing including an overlap portion formed by the first and second circumferential end portions overlapping and joined with each other, and a fluid leakage preventing member for preventing pressurized fluid from leaking from the tubing upon the tubing being subjected to hydrostatic forming. An apparatus and method for hydrostatic forming of a tubing having an overlap portion. The apparatus includes a die and a nozzle having fluid leakage preventing means for preventing the pressurized fluid supplied into the tubing from leaking from a clearance between the first and second circumferential end portions of the overlap portion of the tubing at the longitudinal end portions of the tubing.
    Type: Application
    Filed: December 2, 2004
    Publication date: June 9, 2005
    Inventors: Fumihiko Gejima, Hiroshi Sakurai, Kenji Kanamori, Tetsuji Morita, Sadao Yanagida, Masayuki Inoue